JP4986282B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP4986282B2 JP4986282B2 JP2007002317A JP2007002317A JP4986282B2 JP 4986282 B2 JP4986282 B2 JP 4986282B2 JP 2007002317 A JP2007002317 A JP 2007002317A JP 2007002317 A JP2007002317 A JP 2007002317A JP 4986282 B2 JP4986282 B2 JP 4986282B2
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- JP
- Japan
- Prior art keywords
- light
- phosphor
- light emitting
- emitting element
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
- Led Devices (AREA)
Description
図1に示す構成のLEDランプ1の蛍光体含有樹脂層9を、以下に示すようにして形成した。すなわち、主剤と硬化剤とを1:1の割合で混合して得られた液状熱硬化性シリコーン樹脂(25℃の粘度3Pa・s)を、真空脱泡装置にかけて泡を除去した後、これに以下に示す蛍光体(粒径10〜15μm)を10重量%の割合で含有させたものを、ディスペンサで凹部7内に滴下・塗布した。なお、発光素子としては、実施例1,2および比較例1〜3では、1辺の長さが100μm(上面積0.01mm2)の青色LEDチップ(主波長460nm)を使用し、参考例および比較例4,5では、1辺の長さが300μm(上面積0.09mm2)の青色LEDチップ(主波長460nm)を使用した。また、主波長540nmの黄色蛍光体と主波長585nmの黄色蛍光体および主波長650nmの赤色蛍光体を、樹脂に対する重量比(%)で4.0:3.5:2.5の割合で混合して使用した。そして、この蛍光体含有シリコーン樹脂を、開口径3.0mm、リクレクタ角度63度、深さ1mmの円錐台状の凹部7内に、光路長1mmになるように注入した。
Δuv={(uθ−u0)2+(vθ−v0)2}1/2 ………(1)
Claims (3)
- 凹部を有する基体と;
前記凹部内に配置され、上面の一辺の長さが50μmから100μmであって上面積が0.0025mm 2 から0.01mm 2 となるように形成された発光素子と;
前記発光素子を覆うように前記凹部内に形成され、熱硬化性樹脂と前記発光素子から発せられた光により励起されて可視光を発する蛍光体とを含有する層であり、前記発光素子の上面より光取り出し方向側に存在する泡を備え、この泡は前記発光素子の上面積の5%未満の投影面積である蛍光体含有樹脂層と;
を具備する発光装置であって、
前記蛍光体含有樹脂層は、前記凹部内の厚さが0.5〜1.2mmであり、かつ発光の観察角度70度での角度色差が0.012以下であることを特徴とする発光装置。 - 前記発光素子は、青色光を発する発光素子であり、前記蛍光体は、該発光素子から発せられた青色光により励起されて黄色光から橙色光間の光を発する黄色系蛍光体であることを特徴とする請求項1記載の発光装置。
- 前記熱硬化性樹脂は、熱硬化性シリコーン樹脂であることを特徴とする請求項1または2記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007002317A JP4986282B2 (ja) | 2007-01-10 | 2007-01-10 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007002317A JP4986282B2 (ja) | 2007-01-10 | 2007-01-10 | 発光装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010109621A Division JP2010171466A (ja) | 2010-05-11 | 2010-05-11 | 発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008171931A JP2008171931A (ja) | 2008-07-24 |
JP2008171931A5 JP2008171931A5 (ja) | 2010-06-24 |
JP4986282B2 true JP4986282B2 (ja) | 2012-07-25 |
Family
ID=39699765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007002317A Expired - Fee Related JP4986282B2 (ja) | 2007-01-10 | 2007-01-10 | 発光装置 |
Country Status (1)
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JP (1) | JP4986282B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010021089A1 (ja) * | 2008-08-21 | 2010-02-25 | パナソニック株式会社 | 照明用光源 |
JP5308773B2 (ja) * | 2008-10-30 | 2013-10-09 | スタンレー電気株式会社 | 半導体発光装置 |
CN102208392A (zh) * | 2010-03-29 | 2011-10-05 | 段维新 | 一种高反射及高导热式电气组件及其制造方法 |
JP2011243709A (ja) * | 2010-05-17 | 2011-12-01 | Panasonic Corp | 発光モジュール及びこれを備えた照明装置 |
JP6018869B2 (ja) * | 2012-10-04 | 2016-11-02 | シャープ株式会社 | 光源モジュール |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883869A (ja) * | 1994-09-09 | 1996-03-26 | Sony Corp | 半導体装置およびその製造方法 |
JP3490894B2 (ja) * | 1998-06-26 | 2004-01-26 | シャープ株式会社 | 発光表示装置およびその製造方法 |
JP2001168400A (ja) * | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | ケース付チップ型発光装置およびその製造方法 |
TWI286393B (en) * | 2004-03-24 | 2007-09-01 | Toshiba Lighting & Technology | Lighting apparatus |
JP4912624B2 (ja) * | 2005-06-14 | 2012-04-11 | 株式会社フジクラ | 発光素子実装用基板の製造方法及び発光素子モジュールの製造方法 |
JP4697789B2 (ja) * | 2005-10-26 | 2011-06-08 | シチズン電子株式会社 | 半導体装置及びその製造方法 |
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2007
- 2007-01-10 JP JP2007002317A patent/JP4986282B2/ja not_active Expired - Fee Related
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JP2008171931A (ja) | 2008-07-24 |
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