JP4976358B2 - 基板乾燥装置 - Google Patents

基板乾燥装置 Download PDF

Info

Publication number
JP4976358B2
JP4976358B2 JP2008264147A JP2008264147A JP4976358B2 JP 4976358 B2 JP4976358 B2 JP 4976358B2 JP 2008264147 A JP2008264147 A JP 2008264147A JP 2008264147 A JP2008264147 A JP 2008264147A JP 4976358 B2 JP4976358 B2 JP 4976358B2
Authority
JP
Japan
Prior art keywords
substrate
roller
transport
roller group
upstream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008264147A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010093196A (ja
Inventor
悟志 清久
茂樹 南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2008264147A priority Critical patent/JP4976358B2/ja
Priority to TW098134148A priority patent/TWI386613B/zh
Priority to KR1020090096235A priority patent/KR101092750B1/ko
Publication of JP2010093196A publication Critical patent/JP2010093196A/ja
Application granted granted Critical
Publication of JP4976358B2 publication Critical patent/JP4976358B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
JP2008264147A 2008-10-10 2008-10-10 基板乾燥装置 Active JP4976358B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008264147A JP4976358B2 (ja) 2008-10-10 2008-10-10 基板乾燥装置
TW098134148A TWI386613B (zh) 2008-10-10 2009-10-08 Substrate drying device
KR1020090096235A KR101092750B1 (ko) 2008-10-10 2009-10-09 기판 건조 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008264147A JP4976358B2 (ja) 2008-10-10 2008-10-10 基板乾燥装置

Publications (2)

Publication Number Publication Date
JP2010093196A JP2010093196A (ja) 2010-04-22
JP4976358B2 true JP4976358B2 (ja) 2012-07-18

Family

ID=42216723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008264147A Active JP4976358B2 (ja) 2008-10-10 2008-10-10 基板乾燥装置

Country Status (3)

Country Link
JP (1) JP4976358B2 (ko)
KR (1) KR101092750B1 (ko)
TW (1) TWI386613B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108847398B (zh) * 2018-05-16 2021-01-01 武汉华星光电半导体显示技术有限公司 用于干燥基板的风刀装置
CN111348370A (zh) * 2020-03-06 2020-06-30 深圳市华星光电半导体显示技术有限公司 基板传送装置
WO2024084810A1 (ja) * 2022-10-18 2024-04-25 日本電気硝子株式会社 ガラス物品の製造装置及びガラス物品の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03283429A (ja) * 1990-03-30 1991-12-13 Hitachi Ltd 洗浄装置
JP2001341827A (ja) * 2000-05-31 2001-12-11 Canon Inc 枚葉式洗浄機および枚葉式洗浄機に用いられるローラーコンベア用の中間軸受け
JP2002022359A (ja) 2000-07-07 2002-01-23 Matsushita Electric Ind Co Ltd 基板の乾燥装置
JP3880386B2 (ja) * 2001-12-07 2007-02-14 芝浦メカトロニクス株式会社 エアーナイフを用いた処理装置
JP4509613B2 (ja) 2004-03-19 2010-07-21 大日本スクリーン製造株式会社 基板処理装置
JP2006003036A (ja) * 2004-06-18 2006-01-05 Shimada Phys & Chem Ind Co Ltd 乾燥装置
JP4319175B2 (ja) * 2005-08-11 2009-08-26 東京エレクトロン株式会社 減圧乾燥装置
JP2007153542A (ja) * 2005-12-06 2007-06-21 Dainippon Screen Mfg Co Ltd 基板搬送装置及び基板乾燥装置
JP4272230B2 (ja) * 2006-12-22 2009-06-03 東京エレクトロン株式会社 減圧乾燥装置

Also Published As

Publication number Publication date
TW201030297A (en) 2010-08-16
KR20100040691A (ko) 2010-04-20
JP2010093196A (ja) 2010-04-22
KR101092750B1 (ko) 2011-12-09
TWI386613B (zh) 2013-02-21

Similar Documents

Publication Publication Date Title
TW200814222A (en) Apparatus for processing substrate
JP5285783B2 (ja) 拭取り清掃装置及び拭取り清掃方法
JP4349101B2 (ja) 基板搬送装置
JP4976358B2 (ja) 基板乾燥装置
JP4881575B2 (ja) 基板の搬送装置
JP2007184391A (ja) 基板の搬送方法及び装置
JP2003086654A (ja) 基板処理装置
WO2011099222A1 (ja) 基板処理装置
JP2008098198A (ja) 基板搬送装置
JP2006193267A (ja) 基板搬送方法および基板搬送装置
JP5372695B2 (ja) 基板処理装置
KR101071268B1 (ko) 기판 이송 장치
JP2008265995A (ja) 基板搬送装置及びこれを用いた基板処理装置
KR101116654B1 (ko) 기판 이송 모듈 및 이를 포함하는 기판 처리 장치
JP5422925B2 (ja) 浮上搬送装置
KR101040696B1 (ko) 기판 이송 장치
KR20090011754A (ko) 기판 반송 장치
JP5604940B2 (ja) 浮上搬送装置
KR101040695B1 (ko) 기판 이송 장치
KR100862232B1 (ko) 기판 처리 장치
KR101099551B1 (ko) 기판 건조 장치
JP5332142B2 (ja) 浮上搬送装置
KR100471683B1 (ko) 기판의 이송 및 세정장치
JP4974587B2 (ja) 処理装置
JP2015178407A (ja) 板状物搬送方法および板状物搬送装置並びに当該板状物搬送装置を備える板状物の生産装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110606

TRDD Decision of grant or rejection written
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120329

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120403

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120412

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4976358

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150420

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250