JP4976358B2 - 基板乾燥装置 - Google Patents
基板乾燥装置 Download PDFInfo
- Publication number
- JP4976358B2 JP4976358B2 JP2008264147A JP2008264147A JP4976358B2 JP 4976358 B2 JP4976358 B2 JP 4976358B2 JP 2008264147 A JP2008264147 A JP 2008264147A JP 2008264147 A JP2008264147 A JP 2008264147A JP 4976358 B2 JP4976358 B2 JP 4976358B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- roller
- transport
- roller group
- upstream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 162
- 238000011144 upstream manufacturing Methods 0.000 claims description 71
- 238000001035 drying Methods 0.000 claims description 40
- 230000005540 biological transmission Effects 0.000 claims description 17
- 230000032258 transport Effects 0.000 description 148
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000003825 pressing Methods 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 5
- 230000001141 propulsive effect Effects 0.000 description 5
- 230000007723 transport mechanism Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008264147A JP4976358B2 (ja) | 2008-10-10 | 2008-10-10 | 基板乾燥装置 |
TW098134148A TWI386613B (zh) | 2008-10-10 | 2009-10-08 | Substrate drying device |
KR1020090096235A KR101092750B1 (ko) | 2008-10-10 | 2009-10-09 | 기판 건조 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008264147A JP4976358B2 (ja) | 2008-10-10 | 2008-10-10 | 基板乾燥装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010093196A JP2010093196A (ja) | 2010-04-22 |
JP4976358B2 true JP4976358B2 (ja) | 2012-07-18 |
Family
ID=42216723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008264147A Active JP4976358B2 (ja) | 2008-10-10 | 2008-10-10 | 基板乾燥装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4976358B2 (ko) |
KR (1) | KR101092750B1 (ko) |
TW (1) | TWI386613B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108847398B (zh) * | 2018-05-16 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | 用于干燥基板的风刀装置 |
CN111348370A (zh) * | 2020-03-06 | 2020-06-30 | 深圳市华星光电半导体显示技术有限公司 | 基板传送装置 |
WO2024084810A1 (ja) * | 2022-10-18 | 2024-04-25 | 日本電気硝子株式会社 | ガラス物品の製造装置及びガラス物品の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03283429A (ja) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | 洗浄装置 |
JP2001341827A (ja) * | 2000-05-31 | 2001-12-11 | Canon Inc | 枚葉式洗浄機および枚葉式洗浄機に用いられるローラーコンベア用の中間軸受け |
JP2002022359A (ja) | 2000-07-07 | 2002-01-23 | Matsushita Electric Ind Co Ltd | 基板の乾燥装置 |
JP3880386B2 (ja) * | 2001-12-07 | 2007-02-14 | 芝浦メカトロニクス株式会社 | エアーナイフを用いた処理装置 |
JP4509613B2 (ja) | 2004-03-19 | 2010-07-21 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2006003036A (ja) * | 2004-06-18 | 2006-01-05 | Shimada Phys & Chem Ind Co Ltd | 乾燥装置 |
JP4319175B2 (ja) * | 2005-08-11 | 2009-08-26 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
JP2007153542A (ja) * | 2005-12-06 | 2007-06-21 | Dainippon Screen Mfg Co Ltd | 基板搬送装置及び基板乾燥装置 |
JP4272230B2 (ja) * | 2006-12-22 | 2009-06-03 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
-
2008
- 2008-10-10 JP JP2008264147A patent/JP4976358B2/ja active Active
-
2009
- 2009-10-08 TW TW098134148A patent/TWI386613B/zh active
- 2009-10-09 KR KR1020090096235A patent/KR101092750B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201030297A (en) | 2010-08-16 |
KR20100040691A (ko) | 2010-04-20 |
JP2010093196A (ja) | 2010-04-22 |
KR101092750B1 (ko) | 2011-12-09 |
TWI386613B (zh) | 2013-02-21 |
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