200814222 九、發明說明： 【發明所屬之技術領域】 技術領域 本發明係有關於一種基板處理裝置，係將基板以預定 5角度傾斜之立起狀態搬運且經處理液處理後，噴射氣體2 以乾燥處理者。 〃 【先前技術】 背景技術 液晶顯示器所使用之玻璃基板可形成電路圖案，而於 10基板上形成電路圖案時，係採用微影成像製程。微影成像 製程係如眾知地於前述基板上塗佈光阻，再透過已形成電 路圖案之光罩將光線照射於光阻上者。 之後，去除光阻未受到絲射之部分或已受到光照射 之部分，再姓刻已去除光阻之部分。接著，藉由重複姓刻 15後再去除光阻此-連串之步驟，即可將電路圖案形成於前 述基板上。 “於此種微影成像製程中，前述基板上必須經過··利用 顯影液、钱刻液或钱刻後去除光阻的剝離液等處理液處理 2〇基板之步驟；利用清洗液清洗之步驟；及除去清洗後殘留 於基板上之清洗液的乾燥步驟。 μ往，對基板進行前述一連串處理時，前述基板係藉 =輪線呈水平配置的搬運滾子，在大致水平的狀態下，依 播運至複數的處理室，以便於各處理室中進行以處理液 、以清洗液清洗、及清洗後喷射氣體的乾燥等。 200814222 但’近來液晶顯示器所使用之玻璃基板有逐漸大型化 及薄型化之傾向，因此，在水平地搬運基板時，搬運滾子 間之基板撓曲會增大，故會產生各處理室中之處理無法遍 布基板全體板面均勻地進行的問題。 5 且，一旦基板大型化後，設有搬運該基板之搬運滾子 的搬運軸須增長。此外，因基板大型化，於基板上使用的 處理液量也會增加，而隨著基板上處理液量的增加，施加 於前述搬運轴上的負載將變大，搬運軸的撓曲亦會隨之增 大。因此，基板也會因搬運軸撓曲而產生撓曲，而無法進 10行均勻之處理。 因此，在處理基板時，為了防止該基板因處理液或清 洗液的重量而導致撓曲，所採行的方式是將基板以預定的 角度，例如相對垂直狀態傾斜15度之75度的角度來搬運， 對位於該基板傾斜方向上側之前面喷射處理液來處理前 15 面，接著再對前面及背面噴射清洗液。 將基板傾斜搬運’再於該基板的前面喷射供給處理液 或清洗液的話，處理液或清洗液將不會殘留於板面上，而 會順利的從板面上方流向下方，因此可防止基板因處理液 或清洗液的重量而撓曲。 ° 將基板以預定角度傾斜地搬運並加以處理的處理裝 置，如專利文獻1所示，於室内設有支撐成為基板傾斜方向 下側之背面的支撐滾子、及支撐其下端的驅動滾子。驅動 /袞子安裝於驅動軸上’且該驅動軸可藉由驅動源驅動旋轉。 前述處理裝置中，多數前述支撐滾子及前述驅動滾子 6 200814222 7對於IT述基板的搬運方向以預定的間隔配置於室内，藉 此二前述基板的背面可由前述支撐滾子支撐，而其下端: 由岫述驅動滾子驅動，朝預定方向搬運。 、 專利文獻1 :特開2004-210511號公報 5【發明内容】 發明揭示 發明所欲解決之課題 另一方面，經由處理液處理過的基板，在其前面與背 1〇 、二π洗液清洗後，即如前述藉空氣刀對其前面及背面噴 射氣體以進行乾燥處理，該空氣刀的前端形成有一狹縫$ 又，該空氣刀相對於所搬運之基板前面及背面，朝搬 運方向上游側傾斜地配置，以將業經加壓之氣體從前述狹 縫向基板搬運方向上游側傾斜地喷射在朝預定方向搬運的 基板前面及背面上。 15 ^ 右將氣體向上游側傾斜地贺射在基板前面及背面上， 即旎驅使附著於基板前面及背面的清洗液，往基板搬運方 向上游側流動。因此，可讓基板前面及背面受到乾燥處理。 然而，從空氣刀噴射到基板前面及背面的氣體中，噴 射到别面的氣體在碰撞到基板前面後，將立即往遠離該前 面之方向流動，而往遠離基板前面之方向流動的氣體會於 基板前面產生浮力。 當於基板前面產生浮力時，基板因此浮力而從其背面 的支擇滾子浮起，因此基板的搬運狀態會變得不穩定。浮 起情形嚴重的話，基板將會有撞到形成於室端部壁之讓基 200814222 板通過的狹縫、造成損傷、或無法搬運的疑慮。 本發明提供一種基板處理裝置，其係於對基板嘴射氣 體並加以乾燥處理時，防止基板從支撐滾子浮起者。 解決課題之手段 ' 5 本發明係一種用於對以預定角度傾斜地搬運且業經處 . 理液處理之基板喷射氣體，以進行乾燥處理之基板處理裝 置’該基板處理裝置包含有： 室； 支撐滾子，係裝設於該室内，用以支撐前述基板之傾 10 斜方向下側之背面者； 驅動滾子，係以其外周面支撐前述背面由前述支撐滚 子支撐的基板之下端，且被驅動旋轉將前述基板朝預定方 向搬運者； 噴射氣體機構，係於前述基板之傾斜方向上側之前面 15及下側之背面之高度方向上大致遍及全長地對向配置，並 可朝前述基板之搬運方向上游側喷射氣體者；及 刎面整流板，係於基板之搬運方向上位於比前述基板 • Μ面之前述喷射氣體機構更上游側，且與前述前面對向地 2置，並引導由前述噴射氣體機構所喷射之氣體，使其沿 20前述基板之前面流動者。 發明致果 +依據本發明，藉由前面整流板引導從喷射氣體機構所 喷出的氣體沿基板前面流動，可抑制因該氣體的流動而於 基板前面產生浮力，且可在穩定的狀態下搬運基板。 8 200814222 【實施方式】 發明之實施態樣 以下參照圖式說明本發明之一實施態樣。 第1圖係顯示處理裝置概略構造之透視圖。豸處理裝置 _ 5 I-裝置本體卜且該裝置本體1可分割成複數的處理單 . 元，而在本實施態樣中係由可分解之第1至第5處理單元 1A〜1E呈一列連結而成。 各處理單元1A〜1M-底架2，該底架2的前面設有以 預疋角度傾斜地被固持之箱狀的室3。前述底架2與室3的上 1〇面設有上部搬運部4,且於前述底架2下端之寬度方向兩端 設有-對板狀的可拆式腳體5(僅圖示其中—者）。藉該腳體 5 ’於前述底架2之下面側形成一空間部6。 前述空間部6内收納一將機器7栽置於框架8上之機器 部9，且該機器7為將用於如後述般進行之基板處理之藥劑 15或沖洗液等處理液供給至前述室3中的槽或泵，或是用二二 做理液之供給的控職置等。換言之，藉由以㈣5支^ 底架2且於室3下方形成空間部6，各處理單元1A〜1E可分為 . 位於上下方向上之室3、上部搬運部4及機器部9的3個部分。 前述室3以預定的角度傾斜地固持於底架2上，例如以 20 從垂直狀態傾斜15度、相對於水平面75度的角度傾斜，且 寬度方向的兩側面上形成有可供以75度角度傾斜搬運之基 板W通過的狹縫13(圖1中僅圖示一處）。 於前述室3之内部，如第2圖所示，於室3之寬度方向上 以預定間隔設有構成傾斜搬運機構之複數搬運軸15(僅圖 9 200814222 不一個），且在該搬運軸15上，於輛方向 ^ 口 乂預定間隔設有複 線與前述狹縫 別由一托架15a支 數可疑轉的支撐滾子14。前述搬運軸15之車由 13係以相同角度傾斜，且其上端與下端分 撐0 5 10 15 在前述室3内，基板W係藉第！圖中點鍵線所干之第】姿 :變換部16從水平狀態變換為傾斜75錢，從前述狹縫η 搬入。即，未處理之基板W經由上部搬運部4從第5處理單 ，側運送至…處理單⑽側，並利用前述 部16從水平狀態傾斜至75度後，被搬人第丨處理單元μ中。 被搬入第1處理單ΜΑ之室3内之基_^裝設於前 述搬運軸15上之支撐滾子14捕其«置Φ，即其背面， 並以驅動滾子17之外周面支撐該基板下端。 前述驅動滾子17裝設於驅動單元18之旋轉軸19上，而 且，藉驅動旋轉該旋轉軸19，可向前述驅動滾子Η之旋轉 方向搬運下端由驅動滾子17支撐而背面由前述支撐滾子14 支撐之前述基板W。 基板W在位於搬運方向上游側之第丨至第3處理單元 1A〜1C中，利用作為處理液之剝離液去除光阻後，再於第4 處理單元1D中藉清洗液進行清洗處理。之後，再於第5處理 單tlIE中以熱風等之加壓氣體進行如後述之乾燥處理。 依序經過各處理單元1A〜1E處理之基板W，以75度傾斜 之狀態下從前述第5處理單元1E搬出。從第5處理單元1E搬 出之基板w ’藉第丨圖中點鏈線所示之第2姿勢變換部23從 傾斜狀態變換姿勢為水平狀態後，再進行下一個步驟。 200814222 如第2圖所示，前述驅動單元18中沿室3之寬度方向（基 板W之搬運方向）具有一長板狀之下部底座構件24，且該下 部底座構件24上設有與該下部底座構件24等長之槽狀上部 底座構件25，而該上部底座構件25之兩側下端固定連接於 5 該下部底座構件24上。 於前述上部底座構件25上，與前述下部底座構件24約 等大之平板狀安裝構件26之寬度方向上之一端部與另一端 部連結設置成可調整相對於上部底座構件25之傾斜角度。 換言之，使前述安裝構件26可調整室3朝前後方向之傾斜角 10 度。 於前述安裝構件26之寬度方向之一端與另一端，複數 托架31分別相對於前述安裝構件26之縱向以預定間隔設置 於對應見度方向之位置處。述旋轉轴19轴向之中間部透 過未圖示之軸承被支撐於寬度方向上相對應之一對托架3丄 15上且可自由旋轉。前述驅動滾子17安裝於該旋轉軸19前 端，且第1齒輪33嵌接於其後端。 又’若要將室3設置於前述底架2上的話，則可藉螺絲 20 42將4根桿狀基準構件35之下端面安裝固定於設置在兮底 架2之支樓部41上面。前述驅動單元18中，利用螺絲42將下 部底座構件24之四角部下面安裝固定於前述基準構件^之 平面上。因 之寬度方向 上端面’且4根基準構件35之上端面係位於同_ 此，驅動單元18可以不會朝其下部底座構件24 及縱向產生歪斜之方式被安裝固定。 以基準構件35之上端面為基準將前述驅動單元μ插入 11 200814222 室3内時，受驅動單元18支撐之複數旋轉軸19之後端部從室 3之前壁12b開口形成之導出孔44突出至驅動室45。而且， 驅動單元18插入室3内後，前述第1齒輪33嵌接於前述旋轉 軸19之後端。 5 前述驅動室45中設有一驅動源51，且該驅動源51之輸 出轴上欲接有一驅動滑輪53。該驅動滑輪53與從動滑輪54 間張設有一皮帶55，且前述從動滑輪54與未圖示之第2齒輪 係同軸設置，並且該第2齒輪咬合於前述第1齒輪33。因此， 若驅動源51開始運作，則前述旋轉軸19會受驅動旋轉，故 10 設於該旋轉軸19前端之前述驅動滾子π也將受驅動旋轉。 若驅動滾子17受驅動旋轉，則下端藉由該等驅動滾子 17支撐之基板W便會朝前述驅動滾子π之旋轉方向搬運。 第2圖係顯示第5處理單元1E之室3内之剖視圖，於該室 3内搬運之基板W之前面及背面，對向地配置有其長度為對 15向於基板w上下方向之全長且作為噴射氣體機構之一對空 氣刀61。 一對空氣刀61之前端面開口形成有一狹縫62,以從該 狹縫62朝基板W前面及背面噴射以預定壓力加壓之氣體。 如第4圖所示’一對空氣刀61傾斜地配置，使得開口形成有 20 狹縫62之前端側係向基板W之搬運方向X上游側逐漸降 低。因此，從空氣刀61之狹縫62噴射之氣體，於碰撞到基 板W前面及背面後’便朝搬運方向X上游側，亦即與基板w 之搬運方向相反方向流動。 另外，相對於基板W前面與背面之空氣刀61之傾斜角 12 200814222 度宜設定在30〜60度之範圍内。 於基板W之搬運方向X上，位於比前述空氣刀61更上游 處，如第3圖與第4圖所示，如後述般配置有與基板w前面 對向之複數前面整流板64，且如第4圖與第5圖所示，如後 5 述般平行地配置有與背面對向並具有與基板W之高度尺寸 大致相等長度之複數背面整流板65，而在此實施態樣中為2 片背面整流板65。 也就是說，如第3圖所示，前述前面整流板64相對於基 板W之高度方向分割成3片，且如第4圖所示，各前面整流 10板64傾斜地配置，使得從基板W之搬運方向X下游側朝上游 側與基板W前面相對之對向間隔逐漸縮減。 15 20 更加具體說明的話，如第4圖所示，以前面整流板64 位於空氣刀61側之寬度方向上的一端與基板…前面之間隔 為A，又以其寬度方向上另一端與基板w前面之間隔為B， 則A>B，例如A可設定為2〇mm，B可設定為1〇mm。 月il述A面整流板64沿前述基板w之高度方向之長度尺 寸可設定為基板W之高度方向的大約5分之i。因此，:於 上下方向相鄰之前面整流板64之端部間以與前面整流板64 之長度尺寸大致相同之間隔形成-開放部S。 如第5圖所示，前述背面整流板65之長度尺寸大致與基 板WU度尺寸相同，且如第4圖所示，其寬度方向上位於 方向X上游側之一端C係比另朝更遠離 二二斜，而前述背面整流板65對基板” 面之傾斜肢⑽〜6G度為宜。又，2片背面整流板Η係相 13 200814222 對於基板w之搬運方向x以預定間隔平行地分開配設。 利用如此構成之基板W處理裝置，於第丨至第3處理單 元1A〜1C内經處理液處理後，於第4處理單元10中經清洗液 清洗處理之基板W ’於被搬入第五處理單元π時，將由一 5對空氣刀61對該基板W前面及背面喷射已加壓之氣體。 噴射到基板W前面之氣體於碰撞到基板w前面後反 射’且會往遠離該前面之方向流動。但，於基板W之搬運 方向上，位於比空氣刀61更上游側之前面處設有3片前面整 流板64。 10 因此’如第4圖中箭頭F所示，喷射至與該等前面整流 板64對應部分處之氣體，在碰撞到基板w前面後，將受前 面整流板64所引導，而沿基板w前面流動。 所以’可藉前述前面整流板64防止喷射到基板w前面 之氣體於碰撞到基板W前面後，立即往遠離該前面之方向 15流動’故可抑制因喷射到基板W之氣體於該基板W前面產 生浮力的問題。如此，將不會使基板W從支撐滾子14上浮 起’可於穩定的狀態下搬運。 又’因噴射到基板W前面未設有前面整流板64部分處 之氣體，於碰撞到基板w前面後，將立即往遠離該前面之 20方向流動，仍會使基板W前面產生浮力。 但’即使因該氣體而於基板W前面產生浮力，於基才反 W前面與前面整流板64間流動之氣體於該基板W前面會產 生一將該基板W往支撐滾子14方向推壓之力，故可防止義 板w從支撐滾子14上浮起。 14 200814222 因此，即使於基板w前面設置分割成複數之前面整流 板64，也能防止因從空氣刀61噴射到基板w前面之氣體而 使基板W浮起。 此外，前面整流板64傾斜地設置，使其與基板…前面 5之間隔係由基板W之搬運方向下游側朝上游側逐漸縮減。 因此，由空氣刀61喷射且碰撞到基板w前面之氣體將會容 易流入基板W前面與前面整流板64間，而使基板w前面難 以產生浮力。 另一方面，由於將前面整流板64相對於基板w之高度 10方向刀割成3片’故相較於將前面整流板64於基板w之高度 方向上遍及全長地設置的情形，由空氣刀61噴射後經前面 整流板64引導而沿基板w前面流動之氣體量將較少。 因此，可抑制於基板w前面產生且將基板w往支撐滾 子14推壓之力量過大，故可防止因由空氣刀61噴射之氣體 15過度加壓基板W前面而使基板W無法順利搬運之情形。 基板W背面設有從基板w之搬運方向X下游側朝上游 侧往遠離基板w背面之方向傾斜且平行之2片背面整流板 65 °因此’從空氣刀61喷射到基板W背面之氣體，於碰撞 到基板W背面後，如第4圖中箭頭R所示，經前述背面整流 2〇板65引導而往遠離基板w背面之方向流動。 因此’噴射到基板背面之氣體將不會產生使基板W從 其背面之支撐滾子14浮起之力，故也可使基板W利用支撐 滾子14於穩定的狀態下搬運。 也就是說，經清洗液清洗處理之基板W於第5處理單元 15 200814222 1E中進行乾燥處理時，就算由一對空氣刀61對以預定角度 傾斜之基板W前面及背面喷射氣體，也能防止該基板W背 面因氣體壓力而從支撐滾子14上浮起，故可於穩定的狀態 下確實地搬運基板W。 、 5 又，前述一實施態樣中雖於基板背面側設有背面整流 . 板，但即使不裝設背面整流板，只裝設前面整流板，也可 於穩定的狀態下搬運基板W。而裝設背面整流板時，其片 數不限於2片，1片或3片以上亦可。 前面整流板雖分割成複數，但亦可不將之分割而遍及 10 基板W之高度方向全長設置，此時，為了不讓於基板前面 與前面整流板間流動之氣體壓力過高，可藉由調整從空氣 刀喷射之氣體壓力，避免對基板之順利搬運產生不利之情 形。 【圖式簡單說明】 15 第1圖係顯示本發明第1實施態樣之處理裝置之概略構 造之透視圖。 第2圖係顯示設有前述處理裝置之空氣刀之室的縱向 • 截圖。 第3圖係顯示與基板前面對向配置之空氣刀及前面整 20 流板之前視圖。 第4圖係顯示在基板搬運方向與第3圖相同之情形下， 一對空氣刀、前面整流板及背面整流板之平面圖。 第5圖係顯示基板在搬運方向與第3圖相同之情形下， 與基板背面對向配置之空氣刀及背面整流板之後視圖。 16 200814222 【主要元件符號說明】 1...裝置本體 23...第2姿勢變換部 1A...第1處理單元 24…下部底座;^件 1B...第2處理單元 25…上部底座才冓件 1C...第3處理單元 26…安裝構件 1D…第4處理單元 31...托架 1E.··第5處理單元 33...第1齒輪 2...底架 35···基準構件 3…室 41…支樓部 4···上部搬運部 42…螺絲 5···腳體 44...導出孔 6...空間部 45...驅動室 7...機器 51···驅動源 8...框架 53···驅動滑輪 9...機器部 54…從動滑輪 12b...前壁 55…皮帶 13···狹縫 61...空氣刀 14…支撐滾子 62···狹縫 15…搬運車由 64...前面整流板 15a...托架 65···背面整流板 16...第1姿勢變換部 A...間隔 17…驅動滾子 B…間隔 18···驅動單元 C".端 19···旋轉軸 D·.·端 17 200814222 F...箭頭 W···基板 R···箭頭 X···搬運方向 S...開放部 18[Technical Field] The present invention relates to a substrate processing apparatus which transports a substrate in an upright state inclined at a predetermined five angles and is treated with a treatment liquid, and then ejects the gas 2 to be dried. Processor. BACKGROUND OF THE INVENTION [Background Art] A glass substrate used in a liquid crystal display can form a circuit pattern, and when a circuit pattern is formed on a substrate, a lithography process is employed. The lithography process is known to apply a photoresist to the substrate and to illuminate the photoresist through a reticle that has formed a circuit pattern. Thereafter, the portion of the photoresist that is not subjected to the laser or that has been irradiated with light is removed, and the portion where the photoresist has been removed is removed. Then, the circuit pattern can be formed on the substrate by repeating the steps of removing the photoresist and repeating the series of steps. "In the lithography process, the substrate is subjected to a process of treating the substrate with a treatment liquid such as a developer, a money engraving liquid, or a stripping liquid for removing the photoresist, and a step of cleaning with a cleaning solution. And removing the drying step of the cleaning liquid remaining on the substrate after the cleaning. When the substrate is subjected to the series of processes described above, the substrate is placed in a horizontally arranged transport roller, and in a substantially horizontal state, It is transported to a plurality of processing chambers to facilitate the drying of the processing liquid, the cleaning liquid, and the cleaning of the spraying gas in each processing chamber. 200814222 However, the glass substrates used in liquid crystal displays have recently become larger and thinner. Therefore, when the substrate is transported horizontally, the deflection of the substrate between the transfer rollers is increased, so that the processing in each processing chamber cannot be performed uniformly over the entire surface of the substrate. After the size of the substrate is increased, the conveyance shaft to which the conveyance roller for conveying the substrate is placed must be increased. Further, the amount of the treatment liquid used on the substrate is increased due to the enlargement of the substrate. Increasing, as the amount of the processing liquid on the substrate increases, the load applied to the transport shaft will increase, and the deflection of the transport shaft will also increase. Therefore, the substrate will also be scratched due to the deflection of the transport shaft. Therefore, it is impossible to perform uniform processing in 10 rows. Therefore, in order to prevent the substrate from being deflected due to the weight of the processing liquid or the cleaning liquid when the substrate is processed, the substrate is taken at a predetermined angle, for example, relative. The vertical state is conveyed at an angle of 75 degrees of 15 degrees, and the processing liquid is sprayed on the front side in the oblique direction of the substrate to process the first 15 faces, and then the cleaning liquid is sprayed on the front and back surfaces. The substrate is tilted and transported to the substrate. When the front side is supplied with the treatment liquid or the cleaning liquid, the treatment liquid or the cleaning liquid does not remain on the surface of the plate, and smoothly flows downward from the upper surface of the plate surface, thereby preventing the substrate from being scratched by the weight of the treatment liquid or the cleaning liquid. The processing device that conveys and processes the substrate obliquely at a predetermined angle, as shown in Patent Document 1, is provided inside the back of the substrate to be the lower side of the substrate in the oblique direction. a supporting roller and a driving roller supporting the lower end thereof. The driving/twist is mounted on the driving shaft' and the driving shaft is rotatable by a driving source. In the foregoing processing device, most of the foregoing supporting roller and the driving roller In the case where the transport direction of the IT substrate is placed at a predetermined interval in the room, the back surface of the two substrates can be supported by the support roller, and the lower end thereof can be transported in a predetermined direction by driving the drive roller. [Patent Document 1] JP-A-2004-210511 5 SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] On the other hand, a substrate treated with a treatment liquid is washed in front of the substrate with a back 〇, two π lotion Then, as described above, the gas is sprayed on the front and back sides thereof by an air knife for drying, and the front end of the air knife is formed with a slit $, which is opposite to the front side and the back side of the substrate to be conveyed, toward the upstream side in the conveyance direction. It is disposed obliquely so that the pressurized gas is ejected obliquely from the slit toward the upstream side in the substrate conveyance direction in front of and behind the substrate conveyed in a predetermined direction. . 15 ^ The gas is obliquely incident on the front side and the back surface of the substrate, so that the cleaning liquid adhering to the front and back surfaces of the substrate flows toward the upstream side of the substrate transport direction. Therefore, the front and back surfaces of the substrate can be dried. However, in the gas ejected from the air knife to the front and back surfaces of the substrate, the gas ejected to the other surface will immediately flow away from the front surface after colliding with the front side of the substrate, and the gas flowing in the direction away from the front side of the substrate will Buoyancy is generated in front of the substrate. When buoyancy is generated in front of the substrate, the substrate floats upward from the supporting roller on the back side, so that the conveyance state of the substrate becomes unstable. If the floating condition is severe, the substrate will have a collision with the slit that passes through the base of the chamber end wall 200814222, causing damage or untransportability. The present invention provides a substrate processing apparatus which prevents a substrate from floating from a support roller when a gas is sprayed onto a substrate nozzle and dried. Means for Solving the Problem The present invention relates to a substrate processing apparatus for ejecting a gas which is conveyed obliquely at a predetermined angle and which is subjected to a liquid processing process for drying, and the substrate processing apparatus includes: a chamber; a support roller The sub-system is installed in the chamber to support the back side of the lower side of the inclined direction of the substrate; the driving roller supports the lower end of the substrate supported by the supporting roller on the back surface by the outer peripheral surface thereof, and is The driving rotation is performed by transporting the substrate toward a predetermined direction. The injection gas mechanism is disposed to face the entire length of the front surface 15 and the lower surface of the upper side in the oblique direction of the substrate, and is disposed to face the entire substrate. And the surface rectifying plate is located on the upstream side of the injection gas mechanism of the substrate and the surface of the substrate in the direction in which the substrate is conveyed, and is disposed opposite to the front surface of the substrate, and is guided by The gas ejected by the injecting gas mechanism is caused to flow along the front surface of the substrate. According to the present invention, by the front rectifying plate, the gas ejected from the ejection gas mechanism is caused to flow along the front surface of the substrate, and the buoyancy is generated in front of the substrate due to the flow of the gas, and can be carried in a stable state. Substrate. 8 200814222 Embodiments of the Invention An embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view showing a schematic configuration of a processing apparatus.豸Processing device _ 5 I-device body and the device body 1 can be divided into a plurality of processing units. In the present embodiment, the first to fifth processing units 1A to 1E are decomposed into a column. Made. Each of the processing units 1A to 1M is a chassis 2, and a front surface of the chassis 2 is provided with a box-shaped chamber 3 which is held at an oblique angle. The upper chassis 2 and the upper one surface of the chamber 3 are provided with an upper conveying portion 4, and at the both ends in the width direction of the lower end of the chassis 2 are provided - a plate-shaped detachable foot body 5 (only the illustration is shown therein - By). A space portion 6 is formed on the lower side of the chassis 2 by the leg body 5'. The machine unit 9 for arranging the machine 7 on the frame 8 is housed in the space unit 6, and the machine 7 supplies the treatment liquid such as the medicine 15 or the rinsing liquid for substrate processing as will be described later to the chamber 3. The tank or pump in the tank, or the control position of the supply of the chemistry liquid. In other words, each of the processing units 1A to 1E can be divided into three chambers 3, an upper conveying portion 4, and a machine portion 9 in the vertical direction by forming the space portion 6 under the chamber 4 and the bottom portion 2. section. The chamber 3 is obliquely held on the chassis 2 at a predetermined angle, for example, inclined at an angle of 15 degrees from a vertical state by an angle of 75 degrees with respect to a horizontal plane by 20 degrees, and sides on the width direction are formed to be inclined at an angle of 75 degrees. The slit 13 through which the substrate W is conveyed (only one place is shown in Fig. 1). In the inside of the chamber 3, as shown in Fig. 2, a plurality of conveyance shafts 15 constituting the inclined conveyance mechanism are provided at predetermined intervals in the width direction of the chamber 3 (only one of Fig. 9 200814222), and the conveyance shaft 15 is provided. In the upper direction, the support roller 14 having a double line and the slit is suspiciously rotated by a bracket 15a is provided at a predetermined interval. The vehicle of the transport shaft 15 is inclined at the same angle by the 13 series, and the upper end and the lower end are supported by 0 5 10 15 in the chamber 3, and the substrate W is borrowed from the first! In the figure, the position of the point key line is changed: the conversion unit 16 is changed from the horizontal state to the inclination of 75 money, and is carried in from the slit η. In other words, the unprocessed substrate W is transported from the fifth processing sheet to the processing unit (10) side via the upper processing unit 4, and is tilted from the horizontal state to 75 degrees by the above-described portion 16, and then moved to the third processing unit μ. . The support roller 14 mounted on the transport shaft 15 is placed in the chamber 3 of the first processing unit, and the support roller 14 is placed on the back surface of the first shaft, and the back surface of the support roller 14 is supported by the outer peripheral surface of the drive roller 17. Lower end. The driving roller 17 is mounted on the rotating shaft 19 of the driving unit 18, and by rotating the rotating shaft 19, the lower end of the driving roller can be supported by the driving roller 17 and the back surface is supported by the foregoing. The roller 14 supports the aforementioned substrate W. In the third to third processing units 1A to 1C located on the upstream side in the transport direction, the substrate W is removed by the stripping liquid as the processing liquid, and then washed by the cleaning liquid in the fourth processing unit 1D. Thereafter, in the fifth treatment unit, the drying treatment as described later is performed by a pressurized gas such as hot air. The substrate W which has been sequentially processed by each of the processing units 1A to 1E is carried out from the fifth processing unit 1E while being inclined at 75 degrees. The substrate w's carried out from the fifth processing unit 1E is switched to the horizontal state from the tilt state by the second posture converting portion 23 indicated by the dotted line in the second drawing, and then the next step is performed. 200814222 As shown in FIG. 2, the driving unit 18 has a long plate-shaped lower base member 24 along the width direction of the chamber 3 (the conveying direction of the substrate W), and the lower base member 24 is provided with the lower base. The member 24 is equal in length to the trough-like upper base member 25, and the lower ends of the upper base member 25 are fixedly coupled to the lower base member 24. In the upper base member 25, one end portion of the flat-plate-shaped mounting member 26 that is approximately equal to the lower base member 24 is connected to the other end portion so as to be adjustable in inclination with respect to the upper base member 25. In other words, the aforementioned mounting member 26 can adjust the inclination angle of the chamber 3 toward the front-rear direction by 10 degrees. At one end and the other end in the width direction of the mounting member 26, the plurality of brackets 31 are respectively disposed at positions corresponding to the visibility directions at a predetermined interval with respect to the longitudinal direction of the mounting member 26. The intermediate portion of the rotary shaft 19 in the axial direction is supported by a pair of bearings (not shown) on the bracket 3's 15 in the width direction and is rotatable. The drive roller 17 is attached to the front end of the rotary shaft 19, and the first gear 33 is engaged with the rear end thereof. Further, if the chamber 3 is to be placed on the chassis 2, the lower end faces of the four rod-shaped reference members 35 can be attached and fixed to the upper portion 41 of the base frame portion 41 by the screws 2042. In the drive unit 18, the lower corner portions of the lower base member 24 are attached and fixed to the plane of the reference member ^ by screws 42. Since the upper end surface in the width direction and the upper end faces of the four reference members 35 are located in the same direction, the drive unit 18 can be mounted and fixed without being skewed toward the lower base member 24 and the longitudinal direction. When the driving unit μ is inserted into the chamber 11 of the 200814222 with reference to the upper end surface of the reference member 35, the plurality of rotating shafts 19 supported by the driving unit 18 are protruded from the leading hole 44 formed by the opening of the front wall 12b of the chamber 3 to the driving. Room 45. Further, after the drive unit 18 is inserted into the chamber 3, the first gear 33 is engaged with the rear end of the rotary shaft 19. A driving source 51 is disposed in the driving chamber 45, and a driving pulley 53 is connected to the output shaft of the driving source 51. A belt 55 is stretched between the drive pulley 53 and the driven pulley 54, and the driven pulley 54 is coaxially disposed with a second gear train (not shown), and the second gear is engaged with the first gear 33. Therefore, when the drive source 51 starts operating, the rotary shaft 19 is driven to rotate, so that the drive roller π provided at the front end of the rotary shaft 19 is also driven to rotate. When the driving roller 17 is driven to rotate, the substrate W supported by the driving rollers 17 at the lower end is conveyed in the rotational direction of the driving roller π. 2 is a cross-sectional view showing the inside of the chamber 3 of the fifth processing unit 1E, and the front surface and the back surface of the substrate W conveyed in the chamber 3 are disposed opposite to each other with the length of the pair 15 in the vertical direction of the substrate w. As one of the injection gas mechanisms, the air knife 61. A pair of slits 62 are formed in the front end opening of the pair of air knives 61 to eject a gas pressurized at a predetermined pressure from the slit 62 toward the front and back surfaces of the substrate W. As shown in Fig. 4, the pair of air knives 61 are disposed obliquely such that the front end side of the slit 20 is formed to gradually decrease toward the upstream side in the conveyance direction X of the substrate W. Therefore, the gas ejected from the slit 62 of the air knife 61 flows toward the upstream side in the conveyance direction X, that is, in the direction opposite to the conveyance direction of the substrate w, after colliding with the front surface and the back surface of the substrate W. Further, the inclination angle 12 200814222 of the air knife 61 with respect to the front surface and the back surface of the substrate W is preferably set in the range of 30 to 60 degrees. In the conveyance direction X of the substrate W, it is located further upstream than the air knife 61. As shown in FIGS. 3 and 4, as described later, a plurality of front rectifying plates 64 opposed to the front surface of the substrate w are disposed, and As shown in FIG. 4 and FIG. 5, a plurality of back surface rectifying plates 65 which are opposed to the back surface and have substantially the same length as the height dimension of the substrate W are disposed in parallel as in the fifth embodiment, and in this embodiment, 2 pieces of back rectifying plate 65. That is, as shown in FIG. 3, the front rectifying plate 64 is divided into three pieces with respect to the height direction of the substrate W, and as shown in FIG. 4, each of the front rectifying 10 plates 64 is disposed obliquely so that the substrate W is The downstream direction of the conveyance direction X toward the upstream side and the opposite direction of the front surface of the substrate W are gradually reduced. 15 20 More specifically, as shown in FIG. 4, the one end of the front rectifying plate 64 in the width direction of the side of the air knife 61 and the front surface of the substrate are A, and the other end in the width direction is the substrate w. When the front interval is B, then A > B, for example, A can be set to 2 〇 mm, and B can be set to 1 〇 mm. The length dimension of the A-side rectifying plate 64 in the height direction of the substrate w can be set to about 5 Å in the height direction of the substrate W. Therefore, the opening portion S is formed at an interval substantially equal to the length dimension of the front rectifying plate 64 between the end portions of the front surface rectifying plate 64 adjacent to each other in the vertical direction. As shown in FIG. 5, the length of the back surface rectifying plate 65 is substantially the same as the dimension of the substrate WU, and as shown in FIG. 4, the one end C of the upstream side of the direction X in the width direction is farther away from the other side. The two sides are inclined, and the back surface rectifying plate 65 is preferably inclined to the substrate (10) to 6G. Further, the two back rectifying plate tether phases 13 200814222 are disposed in parallel with each other at predetermined intervals in the conveying direction x of the substrate w. By the substrate W processing apparatus configured as described above, after the processing liquid is processed in the third to third processing units 1A to 1C, the substrate W' subjected to the cleaning liquid cleaning treatment in the fourth processing unit 10 is carried into the fifth processing. When the cell is π, the pressurized gas is ejected to the front and back surfaces of the substrate W by a pair of air knives 61. The gas ejected to the front surface of the substrate W reflects after colliding with the front surface of the substrate w and flows away from the front surface. However, in the conveyance direction of the substrate W, three front rectifying plates 64 are provided at the front side of the upstream side of the air knife 61. 10 Therefore, as shown by an arrow F in Fig. 4, it is ejected to the front side. Corresponding part of the rectifying plate 64 After colliding with the front surface of the substrate w, the body will be guided by the front rectifying plate 64 and flow along the front surface of the substrate w. Therefore, the front rectifying plate 64 can prevent the gas injected to the front side of the substrate w from colliding into the front surface of the substrate W. Immediately flowing in a direction 15 away from the front side, the problem of buoyancy generated by the gas ejected to the substrate W in front of the substrate W can be suppressed. Thus, the substrate W will not float from the support roller 14 to be stable. In the state of being transported, the gas which is not disposed on the front surface of the substrate W is not disposed in front of the substrate w, and immediately after flowing into the front of the substrate w, it will immediately flow away from the front 20, and still front of the substrate W Buoyancy is generated. However, even if buoyancy is generated in front of the substrate W due to the gas, a gas flowing between the front surface of the substrate and the front rectifying plate 64 generates a direction of the substrate W toward the supporting roller 14 in front of the substrate W. The pushing force prevents the yoke w from floating up from the supporting roller 14. 14 200814222 Therefore, even if the front surface rectifying plate 64 is divided into a plurality of front faces of the substrate w, it is prevented from being ejected from the air knife 61. The substrate W is floated up to the gas in front of the substrate w. Further, the front rectifying plate 64 is disposed obliquely so as to be gradually reduced from the downstream side of the substrate W by the downstream side of the substrate W in the conveyance direction of the substrate W. The gas jetted by the blade 61 and colliding with the front surface of the substrate w will easily flow between the front surface of the substrate W and the front rectifying plate 64, making it difficult to generate buoyancy in front of the substrate w. On the other hand, the height of the front rectifying plate 64 relative to the substrate w The 10-way blade is cut into three pieces. Therefore, compared with the case where the front rectifying plate 64 is disposed over the entire length in the height direction of the substrate w, it is ejected by the air knife 61 and guided by the front rectifying plate 64 to flow along the front surface of the substrate w. Therefore, the amount of gas generated is small, so that the force generated in front of the substrate w and pushing the substrate w toward the support roller 14 is excessively large, so that the substrate 15 caused by the air jet 61 is excessively pressed against the front surface of the substrate W. W can not be handled smoothly. The back surface of the substrate W is provided with two back surface rectifying plates 65 which are inclined from the downstream side in the conveyance direction X of the substrate w toward the upstream side and away from the back surface of the substrate w, so that the gas is ejected from the air knife 61 to the back surface of the substrate W. After colliding with the back surface of the substrate W, as indicated by an arrow R in FIG. 4, it is guided by the back surface rectifying ram plate 65 and flows away from the back surface of the substrate w. Therefore, the gas ejected onto the back surface of the substrate does not cause the substrate W to float from the support roller 14 on the back side, so that the substrate W can be transported by the support roller 14 in a stable state. In other words, when the substrate W subjected to the cleaning liquid cleaning treatment is subjected to the drying treatment in the fifth processing unit 15 200814222 1E, even if a pair of air knives 61 eject the gas to the front and back surfaces of the substrate W inclined at a predetermined angle, it is possible to prevent it. Since the back surface of the substrate W floats from the support roller 14 by the gas pressure, the substrate W can be reliably transported in a stable state. Further, in the above-described embodiment, the back surface rectifying plate is provided on the back surface side of the substrate. However, even if the front rectifying plate is not provided, the substrate W can be transported in a stable state. When the rear rectifying plate is installed, the number of sheets is not limited to two, and one or three or more. Although the front rectifying plate is divided into a plurality of numbers, it may be disposed over the entire length of the 10 substrate W in the height direction without dividing the rectifying plate. In this case, in order to prevent the gas pressure flowing between the front surface of the substrate and the front rectifying plate from being excessively high, the adjustment may be performed. The gas pressure ejected from the air knife avoids adverse conditions for smooth handling of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a schematic configuration of a processing apparatus according to a first embodiment of the present invention. Figure 2 is a longitudinal view of the chamber showing the air knife provided with the aforementioned treatment device. Figure 3 is a front elevational view showing the air knife and the front 20-flow plate disposed opposite the front of the substrate. Fig. 4 is a plan view showing a pair of air knife, front rectifying plate, and rear rectifying plate in the case where the substrate conveying direction is the same as in Fig. 3. Fig. 5 is a rear view showing the air knife and the back surface rectifying plate which are disposed opposite to the back surface of the substrate in the case where the conveyance direction is the same as in Fig. 3. 16 200814222 [Description of main component symbols] 1...device main body 23...second posture converting unit 1A...first processing unit 24...lower base;^1B...second processing unit 25...upper base The first processing unit 26, the mounting member 1D, the fourth processing unit 31, the carrier 1E, the fifth processing unit 33, the first gear 2, the chassis 35, and the like - Reference member 3: Room 41: Branch portion 4... Upper transport portion 42: Screw 5: Foot member 44: Export hole 6... Space portion 45... Drive chamber 7... Machine 51···Drive source 8...Frame 53···Drive pulley 9...machine unit 54...driven pulley 12b...front wall 55...belt 13··s slit 61...air knife 14 ... support roller 62 · · slit 15 ... transport vehicle 64 ... front rectifying plate 15 a ... bracket 65 · · back rectification plate 16 ... first posture conversion unit A ... interval 17 ... drive roller B...interval 18···drive unit C".end 19···rotation axis D···end 17 200814222 F...arrow W···substrate R···arrow X···Transport Direction S...opening 18