JP4962881B2 - 半導体装置の製造方法及びそのための装置 - Google Patents
半導体装置の製造方法及びそのための装置 Download PDFInfo
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- JP4962881B2 JP4962881B2 JP2010512974A JP2010512974A JP4962881B2 JP 4962881 B2 JP4962881 B2 JP 4962881B2 JP 2010512974 A JP2010512974 A JP 2010512974A JP 2010512974 A JP2010512974 A JP 2010512974A JP 4962881 B2 JP4962881 B2 JP 4962881B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Weting (AREA)
Description
Claims (8)
- 被処理基板の一方の面に接着剤層を形成する工程と、
前記被処理基板の表面よりも外形が大きい表面を有する支持基板の一方の面に、光熱変換層を形成する工程と、
前記被処理基板を前記光熱変換層の表面上に前記接着剤層を介して接着して積層体を得る工程と、
この積層体において、前記光熱変換層のうち、前記被処理基板から露出する部分を除去、洗浄する工程と、
前記除去、洗浄した積層体において、前記被処理基板の前記支持基板との接着面とは反対側の面を処理する工程と、
前記処理した被処理基板を、前記接着剤層から離す工程と
を含む半導体装置の製造方法。 - 被処理基板の一方の面に接着剤層を形成する工程と、
前記被処理基板の表面よりも外形が大きい表面を有する支持基板の一方の面に、光熱変換層を形成する工程と、
前記被処理基板を前記光熱変換層の表面上に前記接着剤層を介して接着して積層体を得る工程と、
この積層体において、前記被処理基板の前記支持基板との接着面とは反対側の面を処理する工程と、
前記接着面とは反対側の面を処理する工程の途中で、前記積層体において、前記光熱変換層のうち、前記被処理基板から露出する部分を除去、洗浄する工程と、
前記接着面とは反対側の面の処理が終了した被処理基板を、前記接着剤層から離す工程と
を含む半導体装置の製造方法。 - 前記光熱変換層を部分的に除去、洗浄する工程において、前記被処理基板から露出する部分にアルカリ性水溶液を滴下した後、洗浄液流で洗浄する請求項1又は2に記載の製造方法。
- 前記光熱変換層を部分的に除去、洗浄する工程において、前記被処理基板から露出する部分にアルカリ性水溶液を滴下した後、ブラシで洗浄する請求項1又は2に記載の製造方法。
- 前記アルカリ性水溶液が水酸化ナトリウム水溶液、水酸化カリウム水溶液、アンモニア水、水酸化テトラメチルアンモニウム(TMAH)水溶液、若しくはアンモニア過酸化水素水、又はこれらの混合液である請求項3又は4に記載の製造方法。
- 一方の面に接着剤層が形成された被処理基板と、一方の面に光熱変換層が形成された支持基板とが、前記接着剤層および前記光熱変換層を介して接着されており、前記被処理基板の表面よりも支持基板の表面の方が外形が大きく、前記光熱変換層のうち、前記被処理基板から露出する部分をアルカリ性水溶液で除去、洗浄する装置であって、
前記被処理基板から露出する光熱変換層の部分にアルカリ性水溶液を滴下する手段と、
前記アルカリ性水溶液により溶解した光熱変換層を前記支持基板から洗浄する手段と を備えた装置。 - 前記溶解した光熱変換層を洗浄する手段が、高圧の水流を噴射する手段である請求項6に記載の装置。
- 前記溶解した光熱変換層を洗浄する手段がブラシである請求項6に記載の装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010512974A JP4962881B2 (ja) | 2008-05-22 | 2009-04-15 | 半導体装置の製造方法及びそのための装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008133977 | 2008-05-02 | ||
JP2008133977A JP2011040419A (ja) | 2008-05-22 | 2008-05-22 | 半導体装置の製造方法及びそのための装置 |
PCT/JP2009/057566 WO2009142078A1 (ja) | 2008-05-22 | 2009-04-15 | 半導体装置の製造方法及びそのための装置 |
JP2010512974A JP4962881B2 (ja) | 2008-05-22 | 2009-04-15 | 半導体装置の製造方法及びそのための装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2009142078A1 JPWO2009142078A1 (ja) | 2011-09-29 |
JPWO2009142078A6 JPWO2009142078A6 (ja) | 2011-09-29 |
JP4962881B2 true JP4962881B2 (ja) | 2012-06-27 |
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JP2008133977A Pending JP2011040419A (ja) | 2008-05-22 | 2008-05-22 | 半導体装置の製造方法及びそのための装置 |
JP2010512974A Expired - Fee Related JP4962881B2 (ja) | 2008-05-22 | 2009-04-15 | 半導体装置の製造方法及びそのための装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008133977A Pending JP2011040419A (ja) | 2008-05-22 | 2008-05-22 | 半導体装置の製造方法及びそのための装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8709912B2 (ja) |
JP (2) | JP2011040419A (ja) |
CN (1) | CN102037553B (ja) |
WO (1) | WO2009142078A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106346353A (zh) * | 2015-07-16 | 2017-01-25 | 盛美半导体设备(上海)有限公司 | 一种基于阳极喷头位置进行优化的晶圆旋转卡盘 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG10201408436TA (en) * | 2009-12-18 | 2015-02-27 | Lam Res Corp | Methodology for cleaning of surface metal contamination from an upper electrode used in a plasma chamber |
JP5619542B2 (ja) * | 2010-09-08 | 2014-11-05 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体基板の処理方法及び半導体装置の製造方法 |
JP5666244B2 (ja) * | 2010-10-28 | 2015-02-12 | タツモ株式会社 | 支持板剥離装置 |
JP5657342B2 (ja) * | 2010-10-28 | 2015-01-21 | タツモ株式会社 | 剥離用テープ供給装置、及び支持板剥離装置 |
JP5913877B2 (ja) * | 2011-09-20 | 2016-04-27 | 東京応化工業株式会社 | 基板の処理方法 |
JP2013098305A (ja) * | 2011-10-31 | 2013-05-20 | Jsr Corp | 基材の処理方法、半導体装置および仮固定用組成物 |
JP5752639B2 (ja) * | 2012-05-28 | 2015-07-22 | 東京エレクトロン株式会社 | 接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
CN102779907B (zh) * | 2012-08-14 | 2015-08-19 | 常州天合光能有限公司 | 高效异质结电池的制备方法 |
SG11201509300PA (en) * | 2013-05-31 | 2015-12-30 | Mitsui Chemicals Tohcello Inc | Method of peeling electronic member and laminate |
US9324601B1 (en) | 2014-11-07 | 2016-04-26 | International Business Machines Corporation | Low temperature adhesive resins for wafer bonding |
DE102015101897A1 (de) * | 2015-02-10 | 2016-08-11 | Ev Group E. Thallner Gmbh | Vorrichtung und Verfahren zum zumindest teilweisen Lösen einer Verbindungsschicht eines temporär verbondeten Substratstapels |
JP6463664B2 (ja) * | 2015-11-27 | 2019-02-06 | 信越化学工業株式会社 | ウエハ加工体及びウエハ加工方法 |
KR20210072392A (ko) * | 2019-12-09 | 2021-06-17 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 접착 필름 |
WO2023248872A1 (ja) * | 2022-06-20 | 2023-12-28 | 日産化学株式会社 | 光照射剥離用の剥離剤組成物 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004064040A (ja) * | 2002-06-03 | 2004-02-26 | Three M Innovative Properties Co | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
JP2005159155A (ja) * | 2003-11-27 | 2005-06-16 | Three M Innovative Properties Co | 半導体チップの製造方法 |
US20050257889A1 (en) * | 1999-03-15 | 2005-11-24 | Nec Corporation | Etching and cleaning methods and etching and cleaning apparatuses used therefor |
JP2008010464A (ja) * | 2006-06-27 | 2008-01-17 | Three M Innovative Properties Co | 分割チップの製造方法 |
US7883991B1 (en) * | 2010-02-18 | 2011-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temporary carrier bonding and detaching processes |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703773B (zh) * | 2002-06-03 | 2011-11-16 | 3M创新有限公司 | 层压体以及用该层压体制造超薄基片的方法和设备 |
US7534498B2 (en) * | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
US7229744B2 (en) * | 2003-03-21 | 2007-06-12 | Eastman Kodak Company | Method for preparing lithographic printing plates |
JP2005005672A (ja) | 2003-05-16 | 2005-01-06 | Fuji Electric Device Technology Co Ltd | 半導体素子の製造方法および発泡剥離装置 |
EP1635223A3 (en) * | 2004-08-27 | 2009-11-11 | FUJIFILM Corporation | Processing apparatus for lithographic printing plate and process for processing the same |
JP5036270B2 (ja) | 2005-12-02 | 2012-09-26 | 日東電工株式会社 | 加熱剥離型粘着シートおよびこの加熱剥離型粘着シートを用いた半導体チップの製造方法 |
US7883833B2 (en) * | 2007-06-20 | 2011-02-08 | Eastman Kodak Company | Use of highly alkaline developer regenerator composition |
JP4642057B2 (ja) | 2007-10-15 | 2011-03-02 | リンテック株式会社 | シート剥離装置および方法 |
-
2008
- 2008-05-22 JP JP2008133977A patent/JP2011040419A/ja active Pending
-
2009
- 2009-04-15 WO PCT/JP2009/057566 patent/WO2009142078A1/ja active Application Filing
- 2009-04-15 CN CN200980116548XA patent/CN102037553B/zh not_active Expired - Fee Related
- 2009-04-15 JP JP2010512974A patent/JP4962881B2/ja not_active Expired - Fee Related
- 2009-04-15 US US12/937,434 patent/US8709912B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050257889A1 (en) * | 1999-03-15 | 2005-11-24 | Nec Corporation | Etching and cleaning methods and etching and cleaning apparatuses used therefor |
JP2004064040A (ja) * | 2002-06-03 | 2004-02-26 | Three M Innovative Properties Co | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
JP2005159155A (ja) * | 2003-11-27 | 2005-06-16 | Three M Innovative Properties Co | 半導体チップの製造方法 |
JP2008010464A (ja) * | 2006-06-27 | 2008-01-17 | Three M Innovative Properties Co | 分割チップの製造方法 |
US7883991B1 (en) * | 2010-02-18 | 2011-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temporary carrier bonding and detaching processes |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106346353A (zh) * | 2015-07-16 | 2017-01-25 | 盛美半导体设备(上海)有限公司 | 一种基于阳极喷头位置进行优化的晶圆旋转卡盘 |
Also Published As
Publication number | Publication date |
---|---|
US8709912B2 (en) | 2014-04-29 |
US20110129989A1 (en) | 2011-06-02 |
CN102037553A (zh) | 2011-04-27 |
CN102037553B (zh) | 2012-12-12 |
JPWO2009142078A1 (ja) | 2011-09-29 |
WO2009142078A1 (ja) | 2009-11-26 |
JP2011040419A (ja) | 2011-02-24 |
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