JP4955038B2 - 水晶片の製造方法及びこの方法により製造した水晶振動子 - Google Patents
水晶片の製造方法及びこの方法により製造した水晶振動子 Download PDFInfo
- Publication number
- JP4955038B2 JP4955038B2 JP2009153904A JP2009153904A JP4955038B2 JP 4955038 B2 JP4955038 B2 JP 4955038B2 JP 2009153904 A JP2009153904 A JP 2009153904A JP 2009153904 A JP2009153904 A JP 2009153904A JP 4955038 B2 JP4955038 B2 JP 4955038B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- wet etching
- frequency
- thickness
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013078 crystal Substances 0.000 title claims description 128
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title description 12
- 239000010453 quartz Substances 0.000 title description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title description 10
- 238000001039 wet etching Methods 0.000 claims description 32
- 238000005192 partition Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0478—Resonance frequency in a process for mass production
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
2 水晶ウェハの表面
2a 段差部(凹陥部:逆メサ部)
2b 突起部(仕切部)
3 水晶ウェハの裏面
3a 段差部(凹陥部:逆メサ部)
3b 突起部(仕切部)
10 仕切板
11 貫通孔
15 ディスペンサ
15a ノズル
16 エッチング液
Claims (1)
- 複数の水晶片を水晶ウェハレベルで製造する方法において、前記水晶ウェハの表面及び裏面に前記水晶片を形成する所定個数の仕切部に囲まれた段差部をパーシャル・ウェットエッチングして形成し、さらに、前記水晶ウェハの前記裏面にパーシャル・ウェットエッチングして形成した前記段差部の面積が、前記表面に形成した前記段差部の面積より大となるよう形成し、該水晶片の周波数を前記水晶片を構成する水晶板の前記段差部の厚みをパーシャル・ウェットエッチングで2段階に調整して前記水晶片の周波数調整を行う際、第1段階で、該表面の前記水晶片間の前記段差部の厚みのバラツキをパーシャル・ウェットエッチングして粗調整して揃えて同等の厚みにし、次いで、第2段階で、該裏面の同等の前記段差部の厚みをもつグループに属する前記水晶片をまとめてパーシャル・ウェットエッチングして前記段差部の厚みを微調整することを特徴とする水晶片の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009153904A JP4955038B2 (ja) | 2009-06-29 | 2009-06-29 | 水晶片の製造方法及びこの方法により製造した水晶振動子 |
US12/803,062 US8125283B2 (en) | 2009-06-29 | 2010-06-18 | Method of manufacturing crystal element and crystal resonator manufactured thereby |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009153904A JP4955038B2 (ja) | 2009-06-29 | 2009-06-29 | 水晶片の製造方法及びこの方法により製造した水晶振動子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011010204A JP2011010204A (ja) | 2011-01-13 |
JP4955038B2 true JP4955038B2 (ja) | 2012-06-20 |
Family
ID=43380034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009153904A Expired - Fee Related JP4955038B2 (ja) | 2009-06-29 | 2009-06-29 | 水晶片の製造方法及びこの方法により製造した水晶振動子 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8125283B2 (ja) |
JP (1) | JP4955038B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014146945A (ja) * | 2013-01-29 | 2014-08-14 | Kyocera Crystal Device Corp | 圧電素子ウエハ形成方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5630716B2 (ja) * | 1973-07-20 | 1981-07-16 | ||
JP3255456B2 (ja) * | 1992-07-03 | 2002-02-12 | 東洋通信機株式会社 | 超薄板圧電共振子素板の製造方法 |
JPH1041771A (ja) * | 1996-07-24 | 1998-02-13 | Matsushita Electric Ind Co Ltd | 振動子の製造方法とその製造装置 |
JP4538871B2 (ja) * | 1999-10-01 | 2010-09-08 | エプソントヨコム株式会社 | 超薄圧電共振子素板の製造方法及び製造装置 |
JP2002033640A (ja) * | 2000-07-17 | 2002-01-31 | Toyo Commun Equip Co Ltd | 圧電デバイス |
JP3543786B2 (ja) * | 2001-04-26 | 2004-07-21 | セイコーエプソン株式会社 | 圧電振動片及び圧電振動子の製造方法 |
JP3919091B2 (ja) * | 2001-06-04 | 2007-05-23 | セイコーエプソン株式会社 | 圧電振動片の製造方法 |
JP2003110388A (ja) * | 2001-09-28 | 2003-04-11 | Citizen Watch Co Ltd | 圧電振動素子とその製造方法、および圧電デバイス |
JP3820982B2 (ja) * | 2001-12-25 | 2006-09-13 | 株式会社大真空 | 圧電振動デバイスの処理方法 |
JP2004260455A (ja) * | 2003-02-25 | 2004-09-16 | Toyo Commun Equip Co Ltd | 極超短波圧電素子の製造方法 |
JP2004165743A (ja) * | 2002-11-08 | 2004-06-10 | Toyo Commun Equip Co Ltd | 圧電基板、圧電振動素子、圧電振動子、圧電発振器、圧電基板ウェハ、圧電基板ウェハの構造、及び製造方法 |
US7098574B2 (en) * | 2002-11-08 | 2006-08-29 | Toyo Communication Equipment Co., Ltd. | Piezoelectric resonator and method for manufacturing the same |
JP2005065234A (ja) * | 2003-07-31 | 2005-03-10 | Kyocera Kinseki Corp | 水晶振動子の製造方法 |
JP2005184665A (ja) * | 2003-12-22 | 2005-07-07 | Toyo Commun Equip Co Ltd | 圧電基板の製造方法、圧電振動素子、圧電振動子、及び圧電発振器 |
JP2006211583A (ja) * | 2005-01-31 | 2006-08-10 | Kyocera Kinseki Corp | 水晶振動子の製造方法 |
JP2008187321A (ja) * | 2007-01-29 | 2008-08-14 | Epson Toyocom Corp | 圧電振動素子の製造方法 |
-
2009
- 2009-06-29 JP JP2009153904A patent/JP4955038B2/ja not_active Expired - Fee Related
-
2010
- 2010-06-18 US US12/803,062 patent/US8125283B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011010204A (ja) | 2011-01-13 |
US8125283B2 (en) | 2012-02-28 |
US20100327987A1 (en) | 2010-12-30 |
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