JP4950734B2 - 熱間加工性に優れた高強度高導電性銅合金 - Google Patents

熱間加工性に優れた高強度高導電性銅合金 Download PDF

Info

Publication number
JP4950734B2
JP4950734B2 JP2007093467A JP2007093467A JP4950734B2 JP 4950734 B2 JP4950734 B2 JP 4950734B2 JP 2007093467 A JP2007093467 A JP 2007093467A JP 2007093467 A JP2007093467 A JP 2007093467A JP 4950734 B2 JP4950734 B2 JP 4950734B2
Authority
JP
Japan
Prior art keywords
phase particles
strength
alloy
present
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007093467A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008248351A (ja
Inventor
雅俊 衛藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2007093467A priority Critical patent/JP4950734B2/ja
Priority to TW097110952A priority patent/TWI384083B/zh
Priority to CN2008100951815A priority patent/CN101275191B/zh
Priority to KR1020080029257A priority patent/KR100994651B1/ko
Publication of JP2008248351A publication Critical patent/JP2008248351A/ja
Application granted granted Critical
Publication of JP4950734B2 publication Critical patent/JP4950734B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Conductive Materials (AREA)
JP2007093467A 2007-03-30 2007-03-30 熱間加工性に優れた高強度高導電性銅合金 Expired - Fee Related JP4950734B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007093467A JP4950734B2 (ja) 2007-03-30 2007-03-30 熱間加工性に優れた高強度高導電性銅合金
TW097110952A TWI384083B (zh) 2007-03-30 2008-03-27 High-strength, high-conductivity copper alloy with excellent hot workability
CN2008100951815A CN101275191B (zh) 2007-03-30 2008-03-28 热加工性优异的高强度高导电性铜合金
KR1020080029257A KR100994651B1 (ko) 2007-03-30 2008-03-28 열간 가공성이 우수한 고강도 고도전성 구리 합금

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007093467A JP4950734B2 (ja) 2007-03-30 2007-03-30 熱間加工性に優れた高強度高導電性銅合金

Publications (2)

Publication Number Publication Date
JP2008248351A JP2008248351A (ja) 2008-10-16
JP4950734B2 true JP4950734B2 (ja) 2012-06-13

Family

ID=39973638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007093467A Expired - Fee Related JP4950734B2 (ja) 2007-03-30 2007-03-30 熱間加工性に優れた高強度高導電性銅合金

Country Status (2)

Country Link
JP (1) JP4950734B2 (zh)
CN (1) CN101275191B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041194A1 (ja) * 2007-09-27 2009-04-02 Nippon Mining & Metals Co., Ltd. 熱間加工性に優れた高強度高導電性銅合金
JP5079574B2 (ja) * 2008-03-31 2012-11-21 Ｊｘ日鉱日石金属株式会社 熱間加工性に優れた高強度高導電性銅合金
US10311991B2 (en) * 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
WO2012133651A1 (ja) * 2011-03-31 2012-10-04 国立大学法人東北大学 銅合金および銅合金の製造方法
JP6493047B2 (ja) * 2015-07-13 2019-04-03 日立金属株式会社 銅合金材およびその製造方法
CN105603253B (zh) * 2016-01-15 2017-10-17 宁波博威合金材料股份有限公司 一种含镍磷、镍硼相的铜合金材料及其制造方法
CN111575531B (zh) * 2020-06-28 2021-01-05 杭州铜信科技有限公司 高导电铜合金板材及其制造方法
CN113106288A (zh) * 2021-04-07 2021-07-13 太原晋西春雷铜业有限公司 一种制备具有优良抗软化性能kfc异型带坯的方法
CN113862511B (zh) * 2021-10-09 2022-07-12 浙江惟精新材料股份有限公司 一种Cu-Ni-Mn-P合金及其制备方法
CN115852170A (zh) * 2022-11-25 2023-03-28 西部超导材料科技股份有限公司 一种低氧含量纯钛铸锭的熔炼方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104148A (ja) * 1981-12-14 1983-06-21 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
JPS596346A (ja) * 1982-07-05 1984-01-13 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
JPH0219433A (ja) * 1988-07-05 1990-01-23 Mitsubishi Electric Corp 電子機器用銅合金
JPH0499838A (ja) * 1990-08-14 1992-03-31 Nikko Kyodo Co Ltd 通電材料
JPH04231444A (ja) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd 通電材料の製造方法
JP3465108B2 (ja) * 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金
JP4020881B2 (ja) * 2004-04-13 2007-12-12 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
JP4493083B2 (ja) * 2004-12-01 2010-06-30 日鉱金属株式会社 強度、導電性に優れた電子機器用高機能銅合金及びその製造方法
JP3871064B2 (ja) * 2005-06-08 2007-01-24 株式会社神戸製鋼所 電気接続部品用銅合金板

Also Published As

Publication number Publication date
CN101275191A (zh) 2008-10-01
CN101275191B (zh) 2010-10-27
JP2008248351A (ja) 2008-10-16

Similar Documents

Publication Publication Date Title
JP4950734B2 (ja) 熱間加工性に優れた高強度高導電性銅合金
JP5319700B2 (ja) 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
TWI547572B (zh) 電子機器用銅合金、電子機器用銅合金之製造方法、電子機器用銅合金塑性加工材及電子機器用零件
JP3699701B2 (ja) 易加工高力高導電性銅合金
CN107208191B (zh) 铜合金材料及其制造方法
JP2011252188A (ja) 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP2013213237A (ja) Ｃｕ−Ｚｎ−Ｓｎ−Ｎｉ−Ｐ系合金
JP5232794B2 (ja) 熱間加工性に優れた高強度高導電性銅合金
JP4100629B2 (ja) 高強度高導電性銅合金
JP2008075152A (ja) 高強度、高導電率および曲げ加工性に優れた銅合金
JP4937628B2 (ja) 熱間加工性に優れた銅合金
JP5101149B2 (ja) 熱間加工性に優れた高強度高導電性銅合金
JP4750601B2 (ja) 熱間加工性に優れた銅合金及びその製造方法
JP5079574B2 (ja) 熱間加工性に優れた高強度高導電性銅合金
JP3296709B2 (ja) 電子機器用薄板銅合金およびその製造方法
JP4175920B2 (ja) 高力銅合金
JP7133327B2 (ja) 強度及び導電性に優れる銅合金板、通電用電子部品、放熱用電子部品
JP4750602B2 (ja) 熱間加工性に優れた銅合金
JP4493083B2 (ja) 強度、導電性に優れた電子機器用高機能銅合金及びその製造方法
JP2008056974A (ja) 熱間加工性に優れた銅合金
TWI384083B (zh) High-strength, high-conductivity copper alloy with excellent hot workability
JP7133326B2 (ja) 強度及び導電性に優れる銅合金板、通電用電子部品、放熱用電子部品
JP6762453B1 (ja) 銅合金板材およびその製造方法
JP4679040B2 (ja) 電子材料用銅合金

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090915

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20100830

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110915

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111018

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111213

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120306

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120309

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150316

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees