JP4943312B2 - 導電性ボールの搭載方法及び余剰ボール除去装置 - Google Patents
導電性ボールの搭載方法及び余剰ボール除去装置 Download PDFInfo
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- JP4943312B2 JP4943312B2 JP2007327206A JP2007327206A JP4943312B2 JP 4943312 B2 JP4943312 B2 JP 4943312B2 JP 2007327206 A JP2007327206 A JP 2007327206A JP 2007327206 A JP2007327206 A JP 2007327206A JP 4943312 B2 JP4943312 B2 JP 4943312B2
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- 238000000034 method Methods 0.000 title claims description 56
- 239000000758 substrate Substances 0.000 claims description 73
- 239000000853 adhesive Substances 0.000 claims description 72
- 230000001070 adhesive effect Effects 0.000 claims description 72
- 229910000679 solder Inorganic materials 0.000 claims description 47
- 230000004907 flux Effects 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 21
- 239000011229 interlayer Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims (7)
- 接続パッドを備えた基板の上に開口部を備えたマスクを配置する工程と、
前記マスクの上に導電性ボールを供給し、前記マスクの前記開口部を通して前記接続パッドの上に前記導電性ボールを配置する工程と、
前記マスクと前記基板とを分離する工程であって、前記マスク上に残った余分な前記導電性ボールが前記マスクの前記開口部から落下することによって、前記基板上に余剰ボールが搭載される工程と、
前記基板上の前記余剰ボールを粘着ヘッドに接着させて除去する工程とを有し、
前記余剰ボールを除去する工程は、
前記粘着ヘッドの先端部に粘着材を転写する工程と、
前記粘着ヘッドに転写した前記粘着材に前記余剰ボールを接着させて前記基板から除去する工程と、
前記粘着ヘッドに接着させた前記余剰ボールを接着シートに接着させて回収する工程とを含むことを特徴とする導電性ボールの搭載方法。 - 前記余剰ボールを除去する工程は、
前記基板上の前記余剰ボールを画像認識してその配置座標を特定し、前記配置座標に前記粘着ヘッドを配置して前記余剰ボールを前記基板から除去することを含むことを特徴とする請求項1に記載の導電性ボールの搭載方法。 - 前記粘着材はフラックスであることを特徴とする請求項1又は2に記載の導電性ボールの搭載方法。
- 前記基板は、前記接続パッドに半導体チップが実装される配線基板であり、前記導電性ボールは、少なくとも外周部がはんだからなることを特徴とする請求項1又は2に記載の導電性ボールの搭載方法。
- 接続パッドを備えた基板の該接続パッドの上にマスクの開口部を通して導電性ボールを配置する方法で使用され、前記マスクと前記基板とを分離する際に、前記マスク上の余分な導電性ボールが前記マスクの前記開口部から落下することによって前記基板の上に搭載される余剰ボールを除去するための余剰ボール除去装置であって、
前記余剰ボールを接着させて除去する粘着ヘッドと、
前記基板を載置する基板ステージと、
表面に粘着材が設けられた粘着材ステージと、
表面に接着シートが設けられたボール回収ステージとを有し、
前記粘着ヘッドが前記粘着材ステージ上の前記粘着材に押し当てられて、前記粘着ヘッドの先端部に前記粘着材が転写され、
前記粘着ヘッドに転写された前記粘着材に前記基板上の前記余剰ボールを接着させ、
前記粘着ヘッドに接着させた前記余剰ボールを前記ボール回収ステージ上の前記接着シートに接着させて回収することを特徴とする余剰ボール除去装置。 - 前記基板を撮影する画像認識カメラと、
前記画像認識カメラに接続されて、前記画像認識カメラによる画像データを処理して前記余剰ボールの配置座標を特定する画像処理部と、
前記粘着ヘッドを前記余剰ボールの配置座標に移動させる移動手段とを有し、
前記粘着ヘッドが前記基板の前記配置座標に配置されて前記余剰ボールが除去されることを特徴とする請求項5に記載の余剰ボール除去装置。 - 前記粘着材はフラックスであることを特徴とする請求項5又は6に記載の余剰ボール除去装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007327206A JP4943312B2 (ja) | 2007-12-19 | 2007-12-19 | 導電性ボールの搭載方法及び余剰ボール除去装置 |
EP08170698.8A EP2073258B1 (en) | 2007-12-19 | 2008-12-04 | Conductive ball mounting method and surplus ball removing apparatus |
US12/333,619 US8141770B2 (en) | 2007-12-19 | 2008-12-12 | Conductive ball mounting method and surplus ball removing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007327206A JP4943312B2 (ja) | 2007-12-19 | 2007-12-19 | 導電性ボールの搭載方法及び余剰ボール除去装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009152286A JP2009152286A (ja) | 2009-07-09 |
JP4943312B2 true JP4943312B2 (ja) | 2012-05-30 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007327206A Active JP4943312B2 (ja) | 2007-12-19 | 2007-12-19 | 導電性ボールの搭載方法及び余剰ボール除去装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8141770B2 (ja) |
EP (1) | EP2073258B1 (ja) |
JP (1) | JP4943312B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5453636B2 (ja) * | 2009-11-30 | 2014-03-26 | 澁谷工業株式会社 | 導電性ボールの搭載装置 |
US8523046B1 (en) * | 2012-10-18 | 2013-09-03 | International Business Machines Corporation | Forming an array of metal balls or shapes on a substrate |
US9905525B1 (en) * | 2016-08-18 | 2018-02-27 | Semiconductor Components Industries, Llc | Semiconductor wafer and method of ball drop on thin wafer with edge support ring |
JP7401748B2 (ja) * | 2019-12-03 | 2023-12-20 | 澁谷工業株式会社 | 導電性粒体搭載基板の不要物除去装置 |
CN115579300B (zh) * | 2022-11-24 | 2023-03-28 | 河北北芯半导体科技有限公司 | 一种倒装芯片封装堆叠方法 |
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JP3271461B2 (ja) * | 1995-02-07 | 2002-04-02 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
JP3163951B2 (ja) * | 1995-07-14 | 2001-05-08 | 松下電器産業株式会社 | 半田ボールの搭載方法及び半田バンプの形成方法 |
JPH09162533A (ja) * | 1995-12-04 | 1997-06-20 | Sony Corp | はんだ供給装置 |
JP3251893B2 (ja) * | 1997-12-09 | 2002-01-28 | ケル株式会社 | ボール搬送装置 |
US6402014B1 (en) * | 1998-05-29 | 2002-06-11 | Hitachi, Ltd. | Method of forming bumps |
US6869008B2 (en) * | 1998-05-29 | 2005-03-22 | Hitachi, Ltd. | Method of forming bumps |
JP3795691B2 (ja) * | 1999-02-04 | 2006-07-12 | 株式会社日立製作所 | 電子装置の製造方法 |
JP4143788B2 (ja) * | 1999-08-04 | 2008-09-03 | 澁谷工業株式会社 | ボールマウント装置及びマウント方法 |
JP3436355B2 (ja) | 2000-06-12 | 2003-08-11 | 株式会社モリカワ | 半田ボール搭載装置 |
JP2002056901A (ja) | 2000-08-09 | 2002-02-22 | Toshiba Corp | 電池残量表示装置及び電池残量表示方法 |
JP4130526B2 (ja) * | 2000-11-10 | 2008-08-06 | 株式会社日立製作所 | バンプ形成方法およびその装置 |
JP4184592B2 (ja) * | 2000-12-15 | 2008-11-19 | 新日鉄マテリアルズ株式会社 | 導電性ボールの吸引配列方法及び吸引配列装置 |
JP3822834B2 (ja) * | 2002-04-12 | 2006-09-20 | 新日本製鐵株式会社 | リペア方法及び装置 |
US20040003891A1 (en) * | 2002-07-02 | 2004-01-08 | Asm Assembly Automation Ltd. | Apparatus and method for application of adhesive substances to objects |
TWI285524B (en) * | 2003-03-10 | 2007-08-11 | Hitachi Metals Ltd | Method and apparatus for carrying electric conductive ball |
JP2005056901A (ja) * | 2003-08-04 | 2005-03-03 | Nippon Steel Corp | 半導体装置の製造装置及び半導体装置の製造方法 |
JP4334985B2 (ja) * | 2003-12-02 | 2009-09-30 | アスリートFa株式会社 | 基板載置装置 |
JP4255438B2 (ja) | 2004-12-13 | 2009-04-15 | アスリートFa株式会社 | 微小粒子の配置方法および装置 |
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