JP4935105B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP4935105B2 JP4935105B2 JP2006040573A JP2006040573A JP4935105B2 JP 4935105 B2 JP4935105 B2 JP 4935105B2 JP 2006040573 A JP2006040573 A JP 2006040573A JP 2006040573 A JP2006040573 A JP 2006040573A JP 4935105 B2 JP4935105 B2 JP 4935105B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- inclined surface
- substrate
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
本発明の実施の形態1に係る発光装置を図1および図2に基づいて説明する。図1は、本発明の実施の形態1に係る発光装置の構成を説明する図であり、(a)は断面図、(b)は平面図、(c)は底面図である。図2は、本発明の実施の形態1に係る発光装置の分断手段を示すもので、図1(a)のA部拡大図である。
本発明の実施の形態2に係る発光装置を図3に基づいて説明する。図3は、本発明の実施の形態2に係る発光装置の構成を説明する図であり、(a)は断面図、(b)は平面図、(c)は底面図である。なお図3においては、図1と同じ構成のものは同符号を付して説明を省略する。
2 基板
2a,2b 配線パターン
2c 半スルーホール
3 発光素子
4 蛍光部
4a 主面
4b 稜線
5 反射枠
5a 開口
5b 傾斜面
5c 壁面部
5d 環状凹部
6 ワイヤ
7 接着シート
10 発光装置
11 蛍光部
11a 主面
11b 稜線
F 主光出射方向
Claims (1)
- 配線パターンが形成された基板と、
前記配線パターンに導通接続された発光素子と、
前記発光素子からの光により励起され、波長変換して補色となる光を発光する蛍光体を含有し、前記発光素子を封止した蛍光部と、
主光出射方向に向かって開口面積が徐々に広がるようにパラボラ型あるいはすり鉢状に形成され、前記蛍光部からの光を反射する傾斜面と前記傾斜面の下端から前記基板までの間に形成した壁面部を有する反射枠を備え、
前記壁面部は、基板に対しての傾きが、前記傾斜面を延長したときの基板と成す角より大きく、垂直以下となるように形成され、
前記蛍光部は円柱状に形成され、
前記反射枠は、前記傾斜面の基板側の延長上に前記蛍光部の主面の稜線が位置するように形成され、かつ前記傾斜面の下端周囲が前記蛍光部の主面と離間した位置に形成されていることを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006040573A JP4935105B2 (ja) | 2006-02-17 | 2006-02-17 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006040573A JP4935105B2 (ja) | 2006-02-17 | 2006-02-17 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007220942A JP2007220942A (ja) | 2007-08-30 |
JP4935105B2 true JP4935105B2 (ja) | 2012-05-23 |
Family
ID=38497878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006040573A Expired - Fee Related JP4935105B2 (ja) | 2006-02-17 | 2006-02-17 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4935105B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6359360A (ja) * | 1986-08-29 | 1988-03-15 | Koito Mfg Co Ltd | ヘツドランプクリ−ナ用超広角ノズル |
JP2010050367A (ja) * | 2008-08-25 | 2010-03-04 | Panasonic Corp | 発光装置 |
JP5797945B2 (ja) * | 2011-06-21 | 2015-10-21 | シチズン電子株式会社 | Ledランプ |
JP6165537B2 (ja) * | 2013-07-22 | 2017-07-19 | ローム株式会社 | Led照明装置 |
WO2015114477A1 (en) * | 2014-01-29 | 2015-08-06 | Koninklijke Philips N.V. | Shallow reflector cup for phosphor-converted led filled with encapsulant |
JP6450096B2 (ja) * | 2014-06-18 | 2019-01-09 | ローム株式会社 | 光学装置、半導体装置、光学装置の実装構造、および光学装置の製造方法 |
KR102170218B1 (ko) * | 2014-08-05 | 2020-10-26 | 엘지이노텍 주식회사 | 발광소자 패키지 |
JP6755090B2 (ja) | 2014-12-11 | 2020-09-16 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2997100B2 (ja) * | 1991-07-23 | 2000-01-11 | シャープ株式会社 | 光半導体装置 |
JP4432275B2 (ja) * | 2000-07-13 | 2010-03-17 | パナソニック電工株式会社 | 光源装置 |
JP2005197369A (ja) * | 2004-01-05 | 2005-07-21 | Toshiba Corp | 光半導体装置 |
JP2005310911A (ja) * | 2004-04-19 | 2005-11-04 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
-
2006
- 2006-02-17 JP JP2006040573A patent/JP4935105B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007220942A (ja) | 2007-08-30 |
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