JP4912991B2 - 熱電変換素子の製造方法 - Google Patents
熱電変換素子の製造方法 Download PDFInfo
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- JP4912991B2 JP4912991B2 JP2007232986A JP2007232986A JP4912991B2 JP 4912991 B2 JP4912991 B2 JP 4912991B2 JP 2007232986 A JP2007232986 A JP 2007232986A JP 2007232986 A JP2007232986 A JP 2007232986A JP 4912991 B2 JP4912991 B2 JP 4912991B2
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- thermoelectric conversion
- conversion element
- metal
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- metal compound
- Prior art date
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- 238000006243 chemical reaction Methods 0.000 title claims description 91
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 59
- 150000002736 metal compounds Chemical class 0.000 claims description 40
- 229910052709 silver Inorganic materials 0.000 claims description 23
- 238000000354 decomposition reaction Methods 0.000 claims description 17
- 229910044991 metal oxide Inorganic materials 0.000 claims description 17
- 150000004706 metal oxides Chemical class 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 9
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229940125810 compound 20 Drugs 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 239000004332 silver Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000012298 atmosphere Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 229940100890 silver compound Drugs 0.000 description 5
- 150000003379 silver compounds Chemical class 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910018989 CoSb Inorganic materials 0.000 description 2
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 2
- 229910002665 PbTe Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 2
- 229910006585 β-FeSi Inorganic materials 0.000 description 2
- -1 β-FeSi 2 Chemical compound 0.000 description 2
- 101710134784 Agnoprotein Proteins 0.000 description 1
- 101100150279 Caenorhabditis elegans srb-6 gene Proteins 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910018871 CoO 2 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 241000877463 Lanio Species 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 1
- 229910017028 MnSi Inorganic materials 0.000 description 1
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
Description
直径20mm、高さ4mmの円柱状のp型Ca3Co4O9焼結体をヒーター上へ載置し、p型Ca3Co4O9焼結体の表面の温度を700℃±20℃となるように加熱した後、大気雰囲気下で焼結体表面にAg2O粉末を散布したところ、すぐに表面に粉末が広がって膜が形成されるとともに、この膜の色が黒色から白色へと変化した。焼結体を裏返した後、裏面についても同様にAg2O粉末を散布した。室温まで冷却した後、マイクロカッターを用いて、一辺が4mmの立方体形状に切り出した。これにより、立方体形状であり、上下面が銀で覆われた焼結体を得た。得られた立方体の上下面間の抵抗値を、マルチメータで測定したところ0.13Ωであった。
直径15mm、高さ4mmの円柱状のn型CaMnO3焼結体を用いた以外は実施例1と同様にして、上下面が銀で覆われた焼結体を得た。得られた立方体の上下面間の抵抗値を、実施例1と同様にして測定したところ0.01Ωであった。
p型のCa3Co4O9焼結体を一辺が4mmの立方体形状に切り出し、その対向する2面へ銀ペーストを塗布し、乾燥させた後、700℃、大気雰囲気下で30分間加熱した。室温まで冷却した後、得られた立方体の上下面間の抵抗値を、実施例1と同様にして測定したところ0.20Ωであった。
n型のCaMnO3焼結体を用いた以外は比較例1と同様にして、上下面が銀ペーストで覆われた焼結体を得た。室温まで冷却した後、得られた立方体の上下面間の抵抗値を、実施例1と同様にして測定したところ0.05Ωであった。
p型のCa3Co4O9焼結体を一辺が4mmの立方体形状に切り出し、全面にNiめっきを施した。その後、上下面以外の面に付着したNiめっきを研磨紙を用いて除去した。得られた立方体の上下面間の抵抗値を測定したところ、140kΩとなった。Niめっき層と焼結体との密着性は弱く、Niめっき層が簡単に剥がれてしまった。
n型のCaMnO3焼結体を用いた以外は、比較例3と同様にして、上下面がNiめっきで覆われた焼結体を得た。得られた立方体の上下面間の抵抗値を、実施例1と同様にして測定したところ、150Ω程度となった。Niめっき層と焼結体との密着性は弱かった。
Claims (4)
- 加熱により分解して金属を生成する金属化合物を、前記金属化合物の分解温度以上に加熱された熱電変換素子本体の表面に散布する金属層形成工程を有し、
前記金属化合物は、Ag 2 O又はAg 2 CO 3 である熱電変換素子の製造方法。
法。 - 加熱により分解して金属を生成する金属化合物を、前記金属化合物の分解温度以上に加熱された熱電変換素子本体の表面に散布する金属層形成工程を有し、
前記金属化合物は、金属酸化物又は金属炭酸塩である熱電変換素子の製造方法。 - 前記熱電変換素子本体は、金属酸化物を含む請求項1又は2記載の熱電変換素子の製造方法。
- 前記熱電変換素子本体に含まれる金属酸化物は、Ca3Co4O9又はCaMnO3である請求項3記載の熱電変換素子の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007232986A JP4912991B2 (ja) | 2007-09-07 | 2007-09-07 | 熱電変換素子の製造方法 |
TW097133579A TW200915633A (en) | 2007-09-07 | 2008-09-02 | Method for making thermo-electric conversion element |
PCT/JP2008/066271 WO2009031695A1 (ja) | 2007-09-07 | 2008-09-03 | 熱電変換素子の製造方法 |
US12/676,444 US20100275435A1 (en) | 2007-09-07 | 2008-09-03 | Method for manufacturing thermoelectric conversion element |
CN2008801058074A CN101796662B (zh) | 2007-09-07 | 2008-09-03 | 热电转换元件的制造方法 |
EP08829887A EP2197058A4 (en) | 2007-09-07 | 2008-09-03 | METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007232986A JP4912991B2 (ja) | 2007-09-07 | 2007-09-07 | 熱電変換素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009065046A JP2009065046A (ja) | 2009-03-26 |
JP4912991B2 true JP4912991B2 (ja) | 2012-04-11 |
Family
ID=40429000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007232986A Expired - Fee Related JP4912991B2 (ja) | 2007-09-07 | 2007-09-07 | 熱電変換素子の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100275435A1 (ja) |
EP (1) | EP2197058A4 (ja) |
JP (1) | JP4912991B2 (ja) |
CN (1) | CN101796662B (ja) |
TW (1) | TW200915633A (ja) |
WO (1) | WO2009031695A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101969094B (zh) * | 2009-07-27 | 2012-08-29 | 中国科学院上海硅酸盐研究所 | 一种用于热电材料的涂层及其含有该涂层的器件 |
WO2013116107A1 (en) * | 2012-02-01 | 2013-08-08 | Baker Hughes Incorporated | Thermoelectric devices using sintered bonding |
CN103311423B (zh) * | 2012-02-17 | 2017-06-30 | 雅马哈株式会社 | 热电转换组件及热电转换组件的制造方法 |
US10454013B2 (en) * | 2012-11-16 | 2019-10-22 | Micropower Global Limited | Thermoelectric device |
JP6721317B2 (ja) | 2015-11-18 | 2020-07-15 | 日東電工株式会社 | 半導体装置の製造方法 |
CN107689414B (zh) * | 2017-08-10 | 2020-06-26 | 合肥工业大学 | 一种导电金属相均匀分布的多相复合锰酸钙基氧化物热电材料的制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216413A (ja) | 1993-01-20 | 1994-08-05 | Aisin Seiki Co Ltd | 熱電変換素子 |
JP3137880B2 (ja) * | 1995-08-25 | 2001-02-26 | ティーディーケイ株式会社 | 強誘電体薄膜、電子デバイスおよび強誘電体薄膜の製造方法 |
US20040197493A1 (en) * | 1998-09-30 | 2004-10-07 | Optomec Design Company | Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition |
JP3918424B2 (ja) * | 2000-10-16 | 2007-05-23 | 松下電工株式会社 | 熱電変換モジュールの製造方法 |
EP1775734B1 (en) * | 2001-12-27 | 2010-07-28 | Fujikura Ltd. | Electrically conductive composition, electrically conductive coating and electrically conductive coating formation method |
JP2003309352A (ja) * | 2002-04-16 | 2003-10-31 | Fujikura Ltd | 導電性接着剤およびこれを用いた電子部品実装構造 |
JP2004193209A (ja) * | 2002-12-09 | 2004-07-08 | Ube Ind Ltd | 熱電変換モジュール及びその製造方法 |
JP4279594B2 (ja) | 2003-05-16 | 2009-06-17 | 財団法人電力中央研究所 | 熱電変換モジュールの組立方法および当該モジュールの組立てに用いられるろう材 |
EP1670610B1 (en) * | 2003-09-26 | 2018-05-30 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition |
US7732704B2 (en) * | 2003-10-08 | 2010-06-08 | National Institute Of Advanced Industrial Science And Technology | Conductive paste for connecting thermoelectric conversion material |
GB0400107D0 (en) * | 2004-01-06 | 2004-02-04 | Koninkl Philips Electronics Nv | Printable transparent electrodes |
JP2005294478A (ja) * | 2004-03-31 | 2005-10-20 | Dainippon Printing Co Ltd | 熱電変換材料 |
JP2005289727A (ja) * | 2004-03-31 | 2005-10-20 | Sakai Chem Ind Co Ltd | 焼成物、熱電変換材料、熱電変換材料の製造方法及び熱電変換素子 |
JP4457795B2 (ja) | 2004-07-22 | 2010-04-28 | ヤマハ株式会社 | 熱電モジュールの製造方法 |
JP4731957B2 (ja) * | 2005-03-10 | 2011-07-27 | 株式会社リコー | 熱電材料 |
JP2006294960A (ja) * | 2005-04-13 | 2006-10-26 | Sumitomo Chemical Co Ltd | 熱電変換材料 |
-
2007
- 2007-09-07 JP JP2007232986A patent/JP4912991B2/ja not_active Expired - Fee Related
-
2008
- 2008-09-02 TW TW097133579A patent/TW200915633A/zh unknown
- 2008-09-03 WO PCT/JP2008/066271 patent/WO2009031695A1/ja active Application Filing
- 2008-09-03 EP EP08829887A patent/EP2197058A4/en not_active Withdrawn
- 2008-09-03 CN CN2008801058074A patent/CN101796662B/zh not_active Expired - Fee Related
- 2008-09-03 US US12/676,444 patent/US20100275435A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2009065046A (ja) | 2009-03-26 |
WO2009031695A1 (ja) | 2009-03-12 |
CN101796662A (zh) | 2010-08-04 |
US20100275435A1 (en) | 2010-11-04 |
EP2197058A1 (en) | 2010-06-16 |
TW200915633A (en) | 2009-04-01 |
EP2197058A4 (en) | 2012-02-01 |
CN101796662B (zh) | 2012-03-28 |
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