JP4903027B2 - 基板搬送装置および基板支持体 - Google Patents
基板搬送装置および基板支持体 Download PDFInfo
- Publication number
- JP4903027B2 JP4903027B2 JP2006292675A JP2006292675A JP4903027B2 JP 4903027 B2 JP4903027 B2 JP 4903027B2 JP 2006292675 A JP2006292675 A JP 2006292675A JP 2006292675 A JP2006292675 A JP 2006292675A JP 4903027 B2 JP4903027 B2 JP 4903027B2
- Authority
- JP
- Japan
- Prior art keywords
- pick
- substrate
- support
- base
- angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006292675A JP4903027B2 (ja) | 2006-01-06 | 2006-10-27 | 基板搬送装置および基板支持体 |
KR1020070001636A KR100856588B1 (ko) | 2006-01-06 | 2007-01-05 | 기판 반송 장치 및 기판 지지체 |
TW096100553A TWI397495B (zh) | 2006-01-06 | 2007-01-05 | A substrate transfer device and a substrate support |
CN200710001578.9A CN1994841B (zh) | 2006-01-06 | 2007-01-08 | 基板搬送装置及基板支承体 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006001124 | 2006-01-06 | ||
JP2006001124 | 2006-01-06 | ||
JP2006292675A JP4903027B2 (ja) | 2006-01-06 | 2006-10-27 | 基板搬送装置および基板支持体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007208235A JP2007208235A (ja) | 2007-08-16 |
JP4903027B2 true JP4903027B2 (ja) | 2012-03-21 |
Family
ID=38487395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006292675A Active JP4903027B2 (ja) | 2006-01-06 | 2006-10-27 | 基板搬送装置および基板支持体 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4903027B2 (ko) |
KR (1) | KR100856588B1 (ko) |
CN (1) | CN1994841B (ko) |
TW (1) | TWI397495B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG146547A1 (en) * | 2007-03-09 | 2008-10-30 | Applied Materials Inc | High temperature anti-droop end effector for substrate transfer |
CN101417747B (zh) * | 2008-12-11 | 2011-11-23 | 友达光电股份有限公司 | 传送台机构 |
TW201135372A (en) * | 2009-10-20 | 2011-10-16 | Nikon Corp | Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method |
JP5613001B2 (ja) * | 2010-10-13 | 2014-10-22 | 東京エレクトロン株式会社 | 基板処理システム及び基板搬送方法 |
JP2013062316A (ja) | 2011-09-12 | 2013-04-04 | Tokyo Electron Ltd | 搬送装置及びプラズマ処理システム |
CN102534555A (zh) * | 2011-12-31 | 2012-07-04 | 无锡市奥曼特科技有限公司 | 用于硅片自动上下料系统的出片机构 |
JP6799395B2 (ja) * | 2016-06-30 | 2020-12-16 | 株式会社荏原製作所 | 基板ホルダ、電子デバイス製造装置において基板を搬送する搬送システム、および電子デバイス製造装置 |
WO2019064585A1 (ja) * | 2017-09-29 | 2019-04-04 | 株式会社ニコン | 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法 |
WO2019064576A1 (ja) * | 2017-09-29 | 2019-04-04 | 株式会社ニコン | 基板搬送装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、基板搬送方法、及び露光方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0380143U (ko) * | 1989-12-05 | 1991-08-16 | ||
JP2677913B2 (ja) * | 1991-05-13 | 1997-11-17 | 三菱電機株式会社 | 半導体製造装置のシール機構および半導体装置の製造方法 |
JP3445257B2 (ja) * | 1993-07-21 | 2003-09-08 | キヤノン株式会社 | 処理システム及びこれを用いた露光装置およびデバイス製造方法 |
JPH0799225A (ja) * | 1993-09-27 | 1995-04-11 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JPH08148539A (ja) * | 1994-11-25 | 1996-06-07 | Sharp Corp | 半導体製造装置 |
JPH11188681A (ja) * | 1997-12-24 | 1999-07-13 | Canon Inc | 基板搬送用ハンド及びその吸着機構 |
JP2000200810A (ja) * | 1999-01-07 | 2000-07-18 | Micronics Japan Co Ltd | プロ―バ |
JP3080143U (ja) * | 2001-03-08 | 2001-09-14 | オリンパス光学工業株式会社 | 基板搬送装置 |
CN1165799C (zh) * | 2001-04-27 | 2004-09-08 | 瀚宇彩晶股份有限公司 | 液晶显示器模组的外框置放架 |
JP2003060004A (ja) * | 2001-08-20 | 2003-02-28 | Yaskawa Electric Corp | ロボットハンド |
JP3908005B2 (ja) * | 2001-10-29 | 2007-04-25 | 株式会社アイテック | ワーク搬送ロボット |
JP2003197728A (ja) * | 2001-12-27 | 2003-07-11 | Aitec:Kk | 基板収納カセット |
KR100479494B1 (ko) * | 2002-09-18 | 2005-03-30 | 삼성전자주식회사 | 기판 반송 로봇 |
KR100596050B1 (ko) * | 2002-10-31 | 2006-07-03 | 삼성코닝정밀유리 주식회사 | 유리기판의 이송시스템 |
JP2004342933A (ja) * | 2003-05-16 | 2004-12-02 | Kondo Seisakusho:Kk | ウエハハンド |
JP4302575B2 (ja) * | 2003-05-30 | 2009-07-29 | 東京エレクトロン株式会社 | 基板搬送装置および真空処理装置 |
DE112004001210T5 (de) * | 2003-07-04 | 2006-06-08 | Rorze Corp. | Transportvorrichtung und Transportsteuerverfahren für eine dünne Platte |
JP4360961B2 (ja) * | 2004-03-30 | 2009-11-11 | 大日本スクリーン製造株式会社 | 基板搬送ロボットおよび基板処理装置 |
-
2006
- 2006-10-27 JP JP2006292675A patent/JP4903027B2/ja active Active
-
2007
- 2007-01-05 TW TW096100553A patent/TWI397495B/zh active
- 2007-01-05 KR KR1020070001636A patent/KR100856588B1/ko active IP Right Grant
- 2007-01-08 CN CN200710001578.9A patent/CN1994841B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN1994841A (zh) | 2007-07-11 |
KR20070074496A (ko) | 2007-07-12 |
JP2007208235A (ja) | 2007-08-16 |
KR100856588B1 (ko) | 2008-09-03 |
TWI397495B (zh) | 2013-06-01 |
CN1994841B (zh) | 2014-02-12 |
TW200738539A (en) | 2007-10-16 |
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