JP4882732B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4882732B2
JP4882732B2 JP2006346565A JP2006346565A JP4882732B2 JP 4882732 B2 JP4882732 B2 JP 4882732B2 JP 2006346565 A JP2006346565 A JP 2006346565A JP 2006346565 A JP2006346565 A JP 2006346565A JP 4882732 B2 JP4882732 B2 JP 4882732B2
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JP
Japan
Prior art keywords
detection unit
humidity
flow rate
semiconductor substrate
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006346565A
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English (en)
Japanese (ja)
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JP2008157742A (ja
JP2008157742A5 (enExample
Inventor
輝夫 小田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2006346565A priority Critical patent/JP4882732B2/ja
Priority to DE102007055779A priority patent/DE102007055779B4/de
Priority to US12/000,462 priority patent/US7640798B2/en
Publication of JP2008157742A publication Critical patent/JP2008157742A/ja
Publication of JP2008157742A5 publication Critical patent/JP2008157742A5/ja
Application granted granted Critical
Publication of JP4882732B2 publication Critical patent/JP4882732B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Volume Flow (AREA)
JP2006346565A 2006-12-22 2006-12-22 半導体装置 Expired - Fee Related JP4882732B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006346565A JP4882732B2 (ja) 2006-12-22 2006-12-22 半導体装置
DE102007055779A DE102007055779B4 (de) 2006-12-22 2007-12-12 Halbleitervorrichtung zum Erfassen einer Flussrate von Fluid
US12/000,462 US7640798B2 (en) 2006-12-22 2007-12-13 Semiconductor device for detecting flow rate of fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006346565A JP4882732B2 (ja) 2006-12-22 2006-12-22 半導体装置

Publications (3)

Publication Number Publication Date
JP2008157742A JP2008157742A (ja) 2008-07-10
JP2008157742A5 JP2008157742A5 (enExample) 2009-03-19
JP4882732B2 true JP4882732B2 (ja) 2012-02-22

Family

ID=39431985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006346565A Expired - Fee Related JP4882732B2 (ja) 2006-12-22 2006-12-22 半導体装置

Country Status (3)

Country Link
US (1) US7640798B2 (enExample)
JP (1) JP4882732B2 (enExample)
DE (1) DE102007055779B4 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099757A (ja) * 2009-11-06 2011-05-19 Hitachi Automotive Systems Ltd 熱式流体流量センサおよびその製造方法
JP2014185865A (ja) * 2013-03-21 2014-10-02 Hitachi Automotive Systems Ltd 熱式流量計
JP2015225029A (ja) * 2014-05-29 2015-12-14 株式会社デンソー 物理量センサ
DE112017001418T5 (de) 2016-06-15 2018-11-29 Hitachi Automotive Systems, Ltd. Halbleitervorrichtung, Verfahren zur Herstellung der Halbleitervorrichtung und Strömungssensor

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4674529B2 (ja) * 2005-11-07 2011-04-20 株式会社デンソー 湿度センサ装置及びその製造方法
JP5178388B2 (ja) * 2008-08-11 2013-04-10 日立オートモティブシステムズ株式会社 空気流量測定装置
DE102008056198B4 (de) * 2008-11-06 2015-02-19 Continental Automotive Gmbh Massenstromsensor und Kraftfahrzeug mit dem Massenstromsensor
JP5279667B2 (ja) * 2008-11-28 2013-09-04 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP5175974B2 (ja) * 2009-03-31 2013-04-03 アルプス電気株式会社 容量型湿度センサ及びその製造方法
DE102009028848A1 (de) * 2009-08-24 2011-03-03 Endress + Hauser Flowtec Ag Aufbau und Herstellungsverfahrens eines Sensors eines thermischen Durchflussmessgeräts
JP4929333B2 (ja) * 2009-09-30 2012-05-09 日立オートモティブシステムズ株式会社 センサの構造
JP5318737B2 (ja) * 2009-12-04 2013-10-16 株式会社デンソー センサ装置およびその製造方法
JP5208099B2 (ja) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 流量センサとその製造方法、及び流量センサモジュール
WO2012049742A1 (ja) 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法
DE102010043062A1 (de) * 2010-10-28 2012-05-03 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung einer Strömungseigenschaft eines fluiden Mediums
DE102010043083A1 (de) * 2010-10-28 2012-05-03 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung einer Strömungseigenschaft eines fluiden Mediums
CN103380353B (zh) * 2011-03-02 2015-08-05 日立汽车系统株式会社 热式流量计
JP5526065B2 (ja) 2011-03-25 2014-06-18 日立オートモティブシステムズ株式会社 熱式センサおよびその製造方法
JP5333529B2 (ja) * 2011-07-05 2013-11-06 株式会社デンソー モールドパッケージの製造方法
WO2013008273A1 (ja) * 2011-07-13 2013-01-17 日立オートモティブシステムズ株式会社 流量計
US9103705B2 (en) * 2012-02-27 2015-08-11 Freescale Semiconductor, Inc. Combined environmental parameter sensor
DE102012009421A1 (de) * 2012-05-11 2013-11-14 E + E Elektronik Ges.M.B.H. Strömungssensor
JP5675716B2 (ja) * 2012-06-29 2015-02-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP5916637B2 (ja) * 2013-01-11 2016-05-11 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
US9360357B2 (en) * 2013-03-19 2016-06-07 Wisenstech Ltd. Micromachined mass flow sensor with condensation prevention and method of making the same
JP6021761B2 (ja) * 2013-08-27 2016-11-09 日立オートモティブシステムズ株式会社 ガスセンサ装置
JP6035582B2 (ja) * 2013-10-30 2016-11-30 株式会社デンソー 空気流量測定装置及びその製造方法
EP3064906A4 (en) * 2013-10-31 2017-03-08 Hitachi Automotive Systems, Ltd. Airflow measurement device
JP6274021B2 (ja) 2014-06-10 2018-02-07 株式会社デンソー 湿度測定装置
JP6212000B2 (ja) * 2014-07-02 2017-10-11 株式会社東芝 圧力センサ、並びに圧力センサを用いたマイクロフォン、血圧センサ、及びタッチパネル
JP6357535B2 (ja) * 2014-07-30 2018-07-11 日立オートモティブシステムズ株式会社 センサおよびその製造方法
US10900921B2 (en) 2015-01-20 2021-01-26 Masco Corporation Multi-functional water quality sensor
JP6641820B2 (ja) * 2015-09-16 2020-02-05 株式会社デンソー 流量測定装置
JP6932640B2 (ja) 2015-09-30 2021-09-08 日立Astemo株式会社 物理量検出装置
JP6747124B2 (ja) * 2016-07-14 2020-08-26 株式会社デンソー 流量センサ
JP6812688B2 (ja) * 2016-07-20 2021-01-13 株式会社デンソー 吸気流量測定装置
US12163944B2 (en) * 2017-07-20 2024-12-10 The Regents Of The University Of Michigan Multi-functional water quality sensor
DE102017116408A1 (de) * 2017-07-20 2019-01-24 Endress + Hauser Wetzer Gmbh + Co. Kg Thermisches Durchflussmessgerät
JP6416357B1 (ja) * 2017-10-05 2018-10-31 三菱電機株式会社 流量測定装置
EP3614109A1 (de) * 2018-08-22 2020-02-26 Technische Universität Graz Messvorrichtung und messsonde für ein strömendes fluid
DE112019004779B4 (de) * 2018-11-05 2025-10-09 Hitachi Astemo, Ltd. Positionierungs- und befestigungsaufbau für ein chipmodul
JP7015587B2 (ja) * 2018-11-12 2022-02-03 国立研究開発法人物質・材料研究機構 結露検出素子
US11397047B2 (en) * 2019-04-10 2022-07-26 Minebea Mitsumi Inc. Moisture detector, moisture detection method, electronic device, and log output system

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4893508A (en) * 1988-12-13 1990-01-16 Viz Manufacturing Company Humidity sensing apparatus and method therefor
AT394264B (de) * 1990-01-22 1992-02-25 Mecanotronic Produktion Von El Luftaufbereitungsanlage
JP2957769B2 (ja) * 1991-08-26 1999-10-06 株式会社日立製作所 熱式空気流量計及びエンジン制御装置
JP2784286B2 (ja) * 1991-12-09 1998-08-06 三菱電機株式会社 半導体センサー装置の製造方法
JP3329073B2 (ja) * 1993-06-04 2002-09-30 セイコーエプソン株式会社 半導体装置およびその製造方法
JPH102772A (ja) * 1996-06-14 1998-01-06 Hitachi Ltd 空気流量測定装置
JP3335860B2 (ja) * 1997-01-16 2002-10-21 株式会社日立製作所 熱式空気流量計用測定素子及び熱式空気流量計
JP3364115B2 (ja) * 1997-07-03 2003-01-08 三菱電機株式会社 感熱式流量検出素子
DE19750496A1 (de) * 1997-11-14 1999-05-20 Bosch Gmbh Robert Verfahren zur Bestimmung der von einer Brennkraftmaschine angesaugten Luft und Sensor für eine Brennkraftmaschine
JP3468731B2 (ja) * 2000-01-14 2003-11-17 株式会社日立製作所 熱式空気流量センサ、素子および内燃機関制御装置
JP2002116172A (ja) * 2000-10-10 2002-04-19 Ngk Spark Plug Co Ltd 湿度センサ
DE10117486A1 (de) * 2001-04-07 2002-10-17 Bosch Gmbh Robert Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
DE60239174D1 (de) * 2001-05-31 2011-03-31 Ngk Spark Plug Co Feuchtigkeitssensor
US7531136B2 (en) * 2001-11-26 2009-05-12 Sony Deutschland Gmbh Chemical sensor
JP2003232765A (ja) * 2002-02-08 2003-08-22 Nippon Soken Inc 湿度センサ用感湿素子
US6983653B2 (en) * 2002-12-13 2006-01-10 Denso Corporation Flow sensor having thin film portion and method for manufacturing the same
JP2005003543A (ja) * 2003-06-12 2005-01-06 Nippon Soken Inc 湿度センサ用感湿素子
JP2005257474A (ja) 2004-03-11 2005-09-22 Nippon Soken Inc 容量式湿度センサ及びその製造方法
JP4156546B2 (ja) 2004-03-15 2008-09-24 株式会社日本自動車部品総合研究所 感湿膜前駆体及び容量式湿度センサの製造方法
JP4281630B2 (ja) * 2004-06-18 2009-06-17 株式会社デンソー センサ装置の製造方法
DE102004038988B3 (de) * 2004-08-10 2006-01-19 Siemens Ag Strömungssensor
JP4609019B2 (ja) * 2004-09-24 2011-01-12 株式会社デンソー 熱式流量センサ及びその製造方法
JP4566784B2 (ja) * 2005-02-24 2010-10-20 株式会社デンソー 湿度センサ装置
JP2006352666A (ja) 2005-06-17 2006-12-28 Toshiba Corp ネットワーク家電制御システム
JP2006071647A (ja) 2005-09-26 2006-03-16 Nippon Soken Inc 湿度センサ用感湿素子
JP4650246B2 (ja) 2005-12-06 2011-03-16 株式会社デンソー 湿度センサ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099757A (ja) * 2009-11-06 2011-05-19 Hitachi Automotive Systems Ltd 熱式流体流量センサおよびその製造方法
JP2014185865A (ja) * 2013-03-21 2014-10-02 Hitachi Automotive Systems Ltd 熱式流量計
JP2015225029A (ja) * 2014-05-29 2015-12-14 株式会社デンソー 物理量センサ
DE112017001418T5 (de) 2016-06-15 2018-11-29 Hitachi Automotive Systems, Ltd. Halbleitervorrichtung, Verfahren zur Herstellung der Halbleitervorrichtung und Strömungssensor

Also Published As

Publication number Publication date
JP2008157742A (ja) 2008-07-10
DE102007055779B4 (de) 2013-08-14
US20080148842A1 (en) 2008-06-26
US7640798B2 (en) 2010-01-05
DE102007055779A1 (de) 2008-06-26

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