DE102007055779B4 - Halbleitervorrichtung zum Erfassen einer Flussrate von Fluid - Google Patents
Halbleitervorrichtung zum Erfassen einer Flussrate von Fluid Download PDFInfo
- Publication number
- DE102007055779B4 DE102007055779B4 DE102007055779A DE102007055779A DE102007055779B4 DE 102007055779 B4 DE102007055779 B4 DE 102007055779B4 DE 102007055779 A DE102007055779 A DE 102007055779A DE 102007055779 A DE102007055779 A DE 102007055779A DE 102007055779 B4 DE102007055779 B4 DE 102007055779B4
- Authority
- DE
- Germany
- Prior art keywords
- humidity sensor
- sensor
- moisture
- substrate
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 154
- 239000012530 fluid Substances 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 146
- 238000010438 heat treatment Methods 0.000 claims abstract description 68
- 229920006254 polymer film Polymers 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 238000001514 detection method Methods 0.000 claims description 46
- 239000004642 Polyimide Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 229910021426 porous silicon Inorganic materials 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000012549 training Methods 0.000 description 12
- 238000010276 construction Methods 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000007791 dehumidification Methods 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
- G01F1/692—Thin-film arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
- G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Volume Flow (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-346565 | 2006-12-22 | ||
| JP2006346565A JP4882732B2 (ja) | 2006-12-22 | 2006-12-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102007055779A1 DE102007055779A1 (de) | 2008-06-26 |
| DE102007055779B4 true DE102007055779B4 (de) | 2013-08-14 |
Family
ID=39431985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102007055779A Expired - Fee Related DE102007055779B4 (de) | 2006-12-22 | 2007-12-12 | Halbleitervorrichtung zum Erfassen einer Flussrate von Fluid |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7640798B2 (enExample) |
| JP (1) | JP4882732B2 (enExample) |
| DE (1) | DE102007055779B4 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4674529B2 (ja) * | 2005-11-07 | 2011-04-20 | 株式会社デンソー | 湿度センサ装置及びその製造方法 |
| JP5178388B2 (ja) * | 2008-08-11 | 2013-04-10 | 日立オートモティブシステムズ株式会社 | 空気流量測定装置 |
| DE102008056198B4 (de) * | 2008-11-06 | 2015-02-19 | Continental Automotive Gmbh | Massenstromsensor und Kraftfahrzeug mit dem Massenstromsensor |
| JP5279667B2 (ja) * | 2008-11-28 | 2013-09-04 | 日立オートモティブシステムズ株式会社 | 熱式空気流量センサ |
| JP5175974B2 (ja) * | 2009-03-31 | 2013-04-03 | アルプス電気株式会社 | 容量型湿度センサ及びその製造方法 |
| DE102009028848A1 (de) * | 2009-08-24 | 2011-03-03 | Endress + Hauser Flowtec Ag | Aufbau und Herstellungsverfahrens eines Sensors eines thermischen Durchflussmessgeräts |
| JP4929333B2 (ja) * | 2009-09-30 | 2012-05-09 | 日立オートモティブシステムズ株式会社 | センサの構造 |
| JP5406674B2 (ja) * | 2009-11-06 | 2014-02-05 | 日立オートモティブシステムズ株式会社 | 熱式流体流量センサおよびその製造方法 |
| JP5318737B2 (ja) * | 2009-12-04 | 2013-10-16 | 株式会社デンソー | センサ装置およびその製造方法 |
| JP5208099B2 (ja) * | 2009-12-11 | 2013-06-12 | 日立オートモティブシステムズ株式会社 | 流量センサとその製造方法、及び流量センサモジュール |
| WO2012049742A1 (ja) | 2010-10-13 | 2012-04-19 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法並びに流量センサモジュールおよびその製造方法 |
| DE102010043062A1 (de) * | 2010-10-28 | 2012-05-03 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung einer Strömungseigenschaft eines fluiden Mediums |
| DE102010043083A1 (de) * | 2010-10-28 | 2012-05-03 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung einer Strömungseigenschaft eines fluiden Mediums |
| CN103380353B (zh) * | 2011-03-02 | 2015-08-05 | 日立汽车系统株式会社 | 热式流量计 |
| JP5526065B2 (ja) | 2011-03-25 | 2014-06-18 | 日立オートモティブシステムズ株式会社 | 熱式センサおよびその製造方法 |
| JP5333529B2 (ja) * | 2011-07-05 | 2013-11-06 | 株式会社デンソー | モールドパッケージの製造方法 |
| US9134153B2 (en) | 2011-07-13 | 2015-09-15 | Hitachi Automotive Systems, Ltd. | Flowmeter |
| US9103705B2 (en) * | 2012-02-27 | 2015-08-11 | Freescale Semiconductor, Inc. | Combined environmental parameter sensor |
| DE102012009421A1 (de) * | 2012-05-11 | 2013-11-14 | E + E Elektronik Ges.M.B.H. | Strömungssensor |
| JP5675716B2 (ja) | 2012-06-29 | 2015-02-25 | 日立オートモティブシステムズ株式会社 | 熱式空気流量センサ |
| JP5916637B2 (ja) * | 2013-01-11 | 2016-05-11 | 日立オートモティブシステムズ株式会社 | 流量センサおよびその製造方法 |
| US9360357B2 (en) * | 2013-03-19 | 2016-06-07 | Wisenstech Ltd. | Micromachined mass flow sensor with condensation prevention and method of making the same |
| JP5973371B2 (ja) * | 2013-03-21 | 2016-08-23 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
| JP6021761B2 (ja) * | 2013-08-27 | 2016-11-09 | 日立オートモティブシステムズ株式会社 | ガスセンサ装置 |
| JP6035582B2 (ja) * | 2013-10-30 | 2016-11-30 | 株式会社デンソー | 空気流量測定装置及びその製造方法 |
| US20160252378A1 (en) * | 2013-10-31 | 2016-09-01 | Hitachi Automotive Systems, Ltd. | Mass Air Flow Measurement Device |
| JP6265052B2 (ja) * | 2014-05-29 | 2018-01-24 | 株式会社デンソー | 物理量センサ |
| JP6274021B2 (ja) | 2014-06-10 | 2018-02-07 | 株式会社デンソー | 湿度測定装置 |
| JP6212000B2 (ja) * | 2014-07-02 | 2017-10-11 | 株式会社東芝 | 圧力センサ、並びに圧力センサを用いたマイクロフォン、血圧センサ、及びタッチパネル |
| EP3176543B1 (en) * | 2014-07-30 | 2020-11-18 | Hitachi Automotive Systems, Ltd. | Circuit board mounting structure and sensor using same |
| US10900921B2 (en) | 2015-01-20 | 2021-01-26 | Masco Corporation | Multi-functional water quality sensor |
| JP6641820B2 (ja) * | 2015-09-16 | 2020-02-05 | 株式会社デンソー | 流量測定装置 |
| EP3358316B1 (en) | 2015-09-30 | 2023-05-10 | Hitachi Astemo, Ltd. | Physical quantity detection device |
| JP6561017B2 (ja) | 2016-06-15 | 2019-08-14 | 日立オートモティブシステムズ株式会社 | 半導体装置、半導体装置の製造方法および流量センサ |
| JP6747124B2 (ja) * | 2016-07-14 | 2020-08-26 | 株式会社デンソー | 流量センサ |
| JP6812688B2 (ja) * | 2016-07-20 | 2021-01-13 | 株式会社デンソー | 吸気流量測定装置 |
| DE102017116408A1 (de) | 2017-07-20 | 2019-01-24 | Endress + Hauser Wetzer Gmbh + Co. Kg | Thermisches Durchflussmessgerät |
| US12163944B2 (en) * | 2017-07-20 | 2024-12-10 | The Regents Of The University Of Michigan | Multi-functional water quality sensor |
| JP6416357B1 (ja) * | 2017-10-05 | 2018-10-31 | 三菱電機株式会社 | 流量測定装置 |
| EP3614109A1 (de) * | 2018-08-22 | 2020-02-26 | Technische Universität Graz | Messvorrichtung und messsonde für ein strömendes fluid |
| DE112019004779B4 (de) * | 2018-11-05 | 2025-10-09 | Hitachi Astemo, Ltd. | Positionierungs- und befestigungsaufbau für ein chipmodul |
| EP3882615A4 (en) * | 2018-11-12 | 2022-07-27 | National Institute for Materials Science | CONDENSATION SENSING ELEMENT |
| US11397047B2 (en) * | 2019-04-10 | 2022-07-26 | Minebea Mitsumi Inc. | Moisture detector, moisture detection method, electronic device, and log output system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4101739A1 (de) * | 1990-01-22 | 1991-07-25 | Mecanotronic Produktion Von El | Luftaufbereitungsanlage |
| JPH102772A (ja) * | 1996-06-14 | 1998-01-06 | Hitachi Ltd | 空気流量測定装置 |
| JPH10197305A (ja) * | 1997-01-16 | 1998-07-31 | Hitachi Ltd | 熱式空気流量計及び熱式空気流量計用の測定素子 |
| DE19750496A1 (de) * | 1997-11-14 | 1999-05-20 | Bosch Gmbh Robert | Verfahren zur Bestimmung der von einer Brennkraftmaschine angesaugten Luft und Sensor für eine Brennkraftmaschine |
| DE10117486A1 (de) * | 2001-04-07 | 2002-10-17 | Bosch Gmbh Robert | Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement |
| US6812821B2 (en) * | 2001-05-31 | 2004-11-02 | Ngk Spark Plug Co., Ltd. | Humidity sensor |
| DE102004038988B3 (de) * | 2004-08-10 | 2006-01-19 | Siemens Ag | Strömungssensor |
| DE102005025667A1 (de) * | 2004-06-18 | 2006-06-08 | Denso Corp., Kariya | Sensoranordnung mit einem umgossenen Signalausgabeabschnitt |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4893508A (en) * | 1988-12-13 | 1990-01-16 | Viz Manufacturing Company | Humidity sensing apparatus and method therefor |
| JP2957769B2 (ja) * | 1991-08-26 | 1999-10-06 | 株式会社日立製作所 | 熱式空気流量計及びエンジン制御装置 |
| JP2784286B2 (ja) * | 1991-12-09 | 1998-08-06 | 三菱電機株式会社 | 半導体センサー装置の製造方法 |
| JP3329073B2 (ja) * | 1993-06-04 | 2002-09-30 | セイコーエプソン株式会社 | 半導体装置およびその製造方法 |
| JP3364115B2 (ja) * | 1997-07-03 | 2003-01-08 | 三菱電機株式会社 | 感熱式流量検出素子 |
| JP3468731B2 (ja) | 2000-01-14 | 2003-11-17 | 株式会社日立製作所 | 熱式空気流量センサ、素子および内燃機関制御装置 |
| JP2002116172A (ja) * | 2000-10-10 | 2002-04-19 | Ngk Spark Plug Co Ltd | 湿度センサ |
| US7531136B2 (en) * | 2001-11-26 | 2009-05-12 | Sony Deutschland Gmbh | Chemical sensor |
| JP2003232765A (ja) * | 2002-02-08 | 2003-08-22 | Nippon Soken Inc | 湿度センサ用感湿素子 |
| US6983653B2 (en) | 2002-12-13 | 2006-01-10 | Denso Corporation | Flow sensor having thin film portion and method for manufacturing the same |
| JP2005003543A (ja) | 2003-06-12 | 2005-01-06 | Nippon Soken Inc | 湿度センサ用感湿素子 |
| JP2005257474A (ja) | 2004-03-11 | 2005-09-22 | Nippon Soken Inc | 容量式湿度センサ及びその製造方法 |
| JP4156546B2 (ja) | 2004-03-15 | 2008-09-24 | 株式会社日本自動車部品総合研究所 | 感湿膜前駆体及び容量式湿度センサの製造方法 |
| JP4609019B2 (ja) | 2004-09-24 | 2011-01-12 | 株式会社デンソー | 熱式流量センサ及びその製造方法 |
| JP4566784B2 (ja) * | 2005-02-24 | 2010-10-20 | 株式会社デンソー | 湿度センサ装置 |
| JP2006352666A (ja) | 2005-06-17 | 2006-12-28 | Toshiba Corp | ネットワーク家電制御システム |
| JP2006071647A (ja) | 2005-09-26 | 2006-03-16 | Nippon Soken Inc | 湿度センサ用感湿素子 |
| JP4650246B2 (ja) | 2005-12-06 | 2011-03-16 | 株式会社デンソー | 湿度センサ |
-
2006
- 2006-12-22 JP JP2006346565A patent/JP4882732B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-12 DE DE102007055779A patent/DE102007055779B4/de not_active Expired - Fee Related
- 2007-12-13 US US12/000,462 patent/US7640798B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4101739A1 (de) * | 1990-01-22 | 1991-07-25 | Mecanotronic Produktion Von El | Luftaufbereitungsanlage |
| JPH102772A (ja) * | 1996-06-14 | 1998-01-06 | Hitachi Ltd | 空気流量測定装置 |
| JPH10197305A (ja) * | 1997-01-16 | 1998-07-31 | Hitachi Ltd | 熱式空気流量計及び熱式空気流量計用の測定素子 |
| DE19750496A1 (de) * | 1997-11-14 | 1999-05-20 | Bosch Gmbh Robert | Verfahren zur Bestimmung der von einer Brennkraftmaschine angesaugten Luft und Sensor für eine Brennkraftmaschine |
| DE10117486A1 (de) * | 2001-04-07 | 2002-10-17 | Bosch Gmbh Robert | Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement |
| US6812821B2 (en) * | 2001-05-31 | 2004-11-02 | Ngk Spark Plug Co., Ltd. | Humidity sensor |
| DE102005025667A1 (de) * | 2004-06-18 | 2006-06-08 | Denso Corp., Kariya | Sensoranordnung mit einem umgossenen Signalausgabeabschnitt |
| DE102004038988B3 (de) * | 2004-08-10 | 2006-01-19 | Siemens Ag | Strömungssensor |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102007055779A1 (de) | 2008-06-26 |
| JP2008157742A (ja) | 2008-07-10 |
| JP4882732B2 (ja) | 2012-02-22 |
| US20080148842A1 (en) | 2008-06-26 |
| US7640798B2 (en) | 2010-01-05 |
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