JP4882634B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP4882634B2
JP4882634B2 JP2006260707A JP2006260707A JP4882634B2 JP 4882634 B2 JP4882634 B2 JP 4882634B2 JP 2006260707 A JP2006260707 A JP 2006260707A JP 2006260707 A JP2006260707 A JP 2006260707A JP 4882634 B2 JP4882634 B2 JP 4882634B2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
concave opening
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006260707A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008084943A (ja
JP2008084943A5 (enExample
Inventor
慎平 笹岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2006260707A priority Critical patent/JP4882634B2/ja
Publication of JP2008084943A publication Critical patent/JP2008084943A/ja
Publication of JP2008084943A5 publication Critical patent/JP2008084943A5/ja
Application granted granted Critical
Publication of JP4882634B2 publication Critical patent/JP4882634B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006260707A 2006-09-26 2006-09-26 発光装置 Expired - Fee Related JP4882634B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006260707A JP4882634B2 (ja) 2006-09-26 2006-09-26 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006260707A JP4882634B2 (ja) 2006-09-26 2006-09-26 発光装置

Publications (3)

Publication Number Publication Date
JP2008084943A JP2008084943A (ja) 2008-04-10
JP2008084943A5 JP2008084943A5 (enExample) 2009-11-05
JP4882634B2 true JP4882634B2 (ja) 2012-02-22

Family

ID=39355515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006260707A Expired - Fee Related JP4882634B2 (ja) 2006-09-26 2006-09-26 発光装置

Country Status (1)

Country Link
JP (1) JP4882634B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028049A (ja) * 2008-07-24 2010-02-04 Kyocera Corp 発光装置及び照明装置
JP5280818B2 (ja) * 2008-11-28 2013-09-04 シャープ株式会社 発光装置
JP5458910B2 (ja) 2009-02-24 2014-04-02 日亜化学工業株式会社 発光装置
JP5726409B2 (ja) * 2009-07-01 2015-06-03 シャープ株式会社 発光装置および発光装置の製造方法
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
KR101676669B1 (ko) * 2010-05-20 2016-11-16 엘지이노텍 주식회사 발광 소자
JP5583051B2 (ja) * 2011-02-23 2014-09-03 京セラ株式会社 発光素子搭載用基板および発光装置
JP2017162940A (ja) 2016-03-08 2017-09-14 パナソニックＩｐマネジメント株式会社 発光装置及び照明装置
DE102016108427A1 (de) 2016-05-06 2017-11-09 Epcos Ag Multi-LED System
JP6508131B2 (ja) 2016-05-31 2019-05-08 日亜化学工業株式会社 発光装置
WO2019048054A1 (en) * 2017-09-08 2019-03-14 Osram Opto Semiconductors Gmbh LIGHT EMITTING COMPONENT AND METHOD FOR PRODUCING LIGHT EMITTING COMPONENT
JP7011196B2 (ja) * 2020-03-18 2022-02-10 日亜化学工業株式会社 発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3764255B2 (ja) * 1997-07-30 2006-04-05 ローム株式会社 半導体発光素子
JP3673621B2 (ja) * 1997-07-30 2005-07-20 ローム株式会社 チップ型発光素子
JP2002124703A (ja) * 2000-08-09 2002-04-26 Rohm Co Ltd チップ型発光装置
KR200373718Y1 (ko) * 2004-09-20 2005-01-21 주식회사 티씨오 정전기 방전 충격에 대한 보호 기능이 내장된 고휘도발광다이오드
JP4789673B2 (ja) * 2005-10-27 2011-10-12 京セラ株式会社 発光素子収納用パッケージならびにこれを用いた光源および発光装置

Also Published As

Publication number Publication date
JP2008084943A (ja) 2008-04-10

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