JP4880478B2 - 弾性表面波センサアセンブリ - Google Patents
弾性表面波センサアセンブリ Download PDFInfo
- Publication number
- JP4880478B2 JP4880478B2 JP2006547194A JP2006547194A JP4880478B2 JP 4880478 B2 JP4880478 B2 JP 4880478B2 JP 2006547194 A JP2006547194 A JP 2006547194A JP 2006547194 A JP2006547194 A JP 2006547194A JP 4880478 B2 JP4880478 B2 JP 4880478B2
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- JP
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- Prior art keywords
- saw sensor
- sensor
- circuit layer
- saw
- conductive elastomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
- G01N29/022—Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/222—Constructional or flow details for analysing fluids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2462—Probes with waveguides, e.g. SAW devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/021—Gases
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/022—Liquids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0255—(Bio)chemical reactions, e.g. on biosensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0256—Adsorption, desorption, surface mass change, e.g. on biosensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Acoustics & Sound (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
Claims (3)
- 複数の電極を含む弾性表面波センサと、
開口および複数の電気コンタクトを含む回路層と、
前記電気コンタクトを前記電極に結合するためのZ軸導電性エラストマー層(ここで、Z軸は、当該導電性エラストマー層の主面に垂直な軸である)と、
を含む弾性表面波センサアセンブリ。 - 流体経路を含むハウジングと、
複数の電極を含む弾性表面波センサ、開口および複数の電気コンタクトを含む回路層、ならびに前記電気コンタクトを前記電極に結合するためのZ軸導電層(ここで、Z軸は、当該導電層の主面に垂直な軸である)を含む弾性表面波センサアセンブリであって、前記弾性表面波センサが、前記開口を介して前記流体経路に露出されている、弾性表面波センサアセンブリと、
を含むセンサカートリッジ。 - 弾性表面波センサの複数の電極を、Z軸導電性エラストマー層(ここで、Z軸は、当該導電性エラストマー層の主面に垂直な軸である)で、回路層の複数の電気コンタクトに電気的に結合する工程を含む、弾性表面波センサアセンブリを形成する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53317603P | 2003-12-30 | 2003-12-30 | |
US60/533,176 | 2003-12-30 | ||
PCT/US2004/042663 WO2005066621A1 (en) | 2003-12-30 | 2004-12-17 | Surface acoustic wave sensor assemblies |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007520698A JP2007520698A (ja) | 2007-07-26 |
JP2007520698A5 JP2007520698A5 (ja) | 2008-01-24 |
JP4880478B2 true JP4880478B2 (ja) | 2012-02-22 |
Family
ID=34748865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006547194A Expired - Fee Related JP4880478B2 (ja) | 2003-12-30 | 2004-12-17 | 弾性表面波センサアセンブリ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090115004A1 (ja) |
EP (1) | EP1700108A1 (ja) |
JP (1) | JP4880478B2 (ja) |
CN (1) | CN100567976C (ja) |
AU (1) | AU2004312835A1 (ja) |
CA (1) | CA2551836A1 (ja) |
WO (1) | WO2005066621A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005066622A1 (en) | 2003-12-30 | 2005-07-21 | 3M Innovative Properties Company | Estimating propagation velocity through a surface acoustic wave sensor |
US20070281369A1 (en) * | 2003-12-30 | 2007-12-06 | Carter Chad J | Acousto-Mechanical Detection Systems and Methods of Use |
DE102006015512B4 (de) * | 2006-03-31 | 2010-01-21 | Andreas Hettich Gmbh & Co. Kg | Vorrichtung aus einer Messkammer und einem über einen Schnellverschluss in die Messkammer integrierbaren Resonator für die Flüssigkeitssensorik |
WO2008083279A1 (en) * | 2006-12-29 | 2008-07-10 | 3M Innovative Properties Company | Method of detection of bioanalytes by acousto-mechanical detection systems comprising the addition of liposomes |
JP5229220B2 (ja) | 2007-03-29 | 2013-07-03 | 株式会社村田製作所 | 液中物質検出センサー |
JP4524700B2 (ja) * | 2007-11-26 | 2010-08-18 | ソニー株式会社 | スピーカ装置およびスピーカ駆動方法 |
DE102008028404B4 (de) * | 2008-06-17 | 2013-07-18 | Saw Instruments Gmbh | Kartusche mit integriertem SAW Sensor |
CN101634643B (zh) * | 2008-07-24 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 表面声波感测器 |
WO2013015443A1 (ja) * | 2011-07-28 | 2013-01-31 | 京セラ株式会社 | バイオセンサ |
WO2014069063A1 (ja) * | 2012-10-29 | 2014-05-08 | 京セラ株式会社 | 弾性表面波センサ |
JP5973595B2 (ja) * | 2013-01-30 | 2016-08-23 | 京セラ株式会社 | センサ装置 |
FR3002638A1 (fr) * | 2013-02-25 | 2014-08-29 | Bigot Jerome Le | Detecteur de gaz et procede de fabrication associe |
FR3002637A1 (fr) * | 2013-02-25 | 2014-08-29 | Bigot Jerome Le | Detecteur de gaz et procede de fabrication associe |
CN105934667B (zh) * | 2014-09-30 | 2019-09-24 | 京瓷株式会社 | 传感器装置 |
CN109562380B (zh) * | 2016-08-02 | 2022-04-05 | Imec 非营利协会 | 用于聚集流中的物体的方法和装置 |
WO2019010356A1 (en) * | 2017-07-07 | 2019-01-10 | Aviana Molecular Technologies, Llc | ACOUSTIC SURFACE WAVE SENSORS FOR DELAYED LINE CODING MULTIPLEXING SURFACE |
RU188186U1 (ru) * | 2018-12-07 | 2019-04-02 | федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) | Пьезорезонансный сорбционный сенсор концентрации веществ |
TWI754247B (zh) * | 2020-03-20 | 2022-02-01 | 義守大學 | 氣體感應器的製造方法 |
CN112054270B (zh) * | 2020-07-27 | 2022-06-10 | 中国电子科技集团公司第十三研究所 | 波导接口组件互联结构 |
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Publication number | Publication date |
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CN1902482A (zh) | 2007-01-24 |
CN100567976C (zh) | 2009-12-09 |
JP2007520698A (ja) | 2007-07-26 |
WO2005066621A1 (en) | 2005-07-21 |
AU2004312835A1 (en) | 2005-07-21 |
CA2551836A1 (en) | 2005-07-21 |
US20090115004A1 (en) | 2009-05-07 |
EP1700108A1 (en) | 2006-09-13 |
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