JP4870572B2 - 半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法 - Google Patents

半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法 Download PDF

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Publication number
JP4870572B2
JP4870572B2 JP2006543856A JP2006543856A JP4870572B2 JP 4870572 B2 JP4870572 B2 JP 4870572B2 JP 2006543856 A JP2006543856 A JP 2006543856A JP 2006543856 A JP2006543856 A JP 2006543856A JP 4870572 B2 JP4870572 B2 JP 4870572B2
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Prior art keywords
light emitting
emitting device
cavity
submount
semiconductor substrate
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Expired - Fee Related
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JP2006543856A
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Japanese (ja)
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JP2007535130A5 (enExample
JP2007535130A (ja
Inventor
ケラー ベルント
イベットソン ジェイムズ
エス．アンドリュース ピーター
エイチ．ネグレイ ジェラルド
ヒラー ノルベルト
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Wolfspeed Inc
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Cree Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2006543856A 2003-12-09 2004-11-24 半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法 Expired - Fee Related JP4870572B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US52805403P 2003-12-09 2003-12-09
US60/528,054 2003-12-09
US10/987,894 2004-11-12
US10/987,894 US7518158B2 (en) 2003-12-09 2004-11-12 Semiconductor light emitting devices and submounts
PCT/US2004/039619 WO2005062393A2 (en) 2003-12-09 2004-11-24 Semiconductor light emitting devices and submounts and methods for forming the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011147906A Division JP2011193030A (ja) 2003-12-09 2011-07-04 半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法

Publications (3)

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JP2007535130A JP2007535130A (ja) 2007-11-29
JP2007535130A5 JP2007535130A5 (enExample) 2008-01-17
JP4870572B2 true JP4870572B2 (ja) 2012-02-08

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JP2006543856A Expired - Fee Related JP4870572B2 (ja) 2003-12-09 2004-11-24 半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法
JP2011147906A Pending JP2011193030A (ja) 2003-12-09 2011-07-04 半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法

Family Applications After (1)

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JP2011147906A Pending JP2011193030A (ja) 2003-12-09 2011-07-04 半導体発光デバイスおよびサブマウント、ならびにそれを形成するための方法

Country Status (7)

Country Link
US (3) US7518158B2 (enExample)
EP (1) EP1692729B1 (enExample)
JP (2) JP4870572B2 (enExample)
KR (1) KR101097694B1 (enExample)
CA (1) CA2547832A1 (enExample)
TW (1) TW200531312A (enExample)
WO (1) WO2005062393A2 (enExample)

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US20090159918A1 (en) 2009-06-25
US8138000B2 (en) 2012-03-20
JP2007535130A (ja) 2007-11-29
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US8847257B2 (en) 2014-09-30
WO2005062393A3 (en) 2006-01-05
TW200531312A (en) 2005-09-16
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US20050121686A1 (en) 2005-06-09
US7518158B2 (en) 2009-04-14

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