JP4868534B2 - 高融点の金属の炭化物層を析出するための方法 - Google Patents

高融点の金属の炭化物層を析出するための方法 Download PDF

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Publication number
JP4868534B2
JP4868534B2 JP2007508741A JP2007508741A JP4868534B2 JP 4868534 B2 JP4868534 B2 JP 4868534B2 JP 2007508741 A JP2007508741 A JP 2007508741A JP 2007508741 A JP2007508741 A JP 2007508741A JP 4868534 B2 JP4868534 B2 JP 4868534B2
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Prior art keywords
vacuum chamber
melting point
metal
electron beam
depositing
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Japanese (ja)
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JP2007533853A (ja
Inventor
ハインス イェンス−ペーター
シェッフェル ベルト
メッツナー クリストフ
キルヒホフ フォルカー
テンブッシュ マティアス
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32321—Discharge generated by other radiation
    • H01J37/3233—Discharge generated by other radiation using charged particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)
JP2007508741A 2004-04-20 2005-02-23 高融点の金属の炭化物層を析出するための方法 Expired - Fee Related JP4868534B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004019169A DE102004019169A1 (de) 2004-04-20 2004-04-20 Verfahren zum Abscheiden von Karbidschichten hochschmelzender Metalle
DE102004019169.7 2004-04-20
PCT/EP2005/001851 WO2005109466A1 (de) 2004-04-20 2005-02-23 Verfahren zum abscheiden von karbidschichten hochschmelzender metalle

Publications (2)

Publication Number Publication Date
JP2007533853A JP2007533853A (ja) 2007-11-22
JP4868534B2 true JP4868534B2 (ja) 2012-02-01

Family

ID=34960529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007508741A Expired - Fee Related JP4868534B2 (ja) 2004-04-20 2005-02-23 高融点の金属の炭化物層を析出するための方法

Country Status (6)

Country Link
EP (1) EP1738395A1 (de)
JP (1) JP4868534B2 (de)
KR (1) KR20060134994A (de)
CN (1) CN1922708A (de)
DE (1) DE102004019169A1 (de)
WO (1) WO2005109466A1 (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096754A (ja) * 1983-10-28 1985-05-30 Japan Atom Energy Res Inst チタンカ−バイド厚膜の被覆方法
JPS63105960A (ja) * 1986-06-07 1988-05-11 Kawasaki Steel Corp 密着性に優れたイオンプレ−テイング被膜をそなえる金属ストリツプの製造方法およびイオンプレ−テイング装置
JPH03232957A (ja) * 1990-02-09 1991-10-16 Nippon Steel Corp 耐摩耗部材の製造方法
JPH05239630A (ja) * 1992-02-28 1993-09-17 Nkk Corp イオンプレーティング方法及び装置
JPH06264213A (ja) * 1993-03-12 1994-09-20 Sekisui Chem Co Ltd チタン系薄膜被覆金属部材
US5614273A (en) * 1993-10-27 1997-03-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung, E.V. Process and apparatus for plasma-activated electron beam vaporization
JP2000064028A (ja) * 1998-06-09 2000-02-29 Sumitomo Heavy Ind Ltd Ｃｕ成膜方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227203A (en) * 1992-02-24 1993-07-13 Nkk Corporation Ion-plating method and apparatus therefor
DE4336680C2 (de) * 1993-10-27 1998-05-14 Fraunhofer Ges Forschung Verfahren zum Elektronenstrahlverdampfen

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096754A (ja) * 1983-10-28 1985-05-30 Japan Atom Energy Res Inst チタンカ−バイド厚膜の被覆方法
JPS63105960A (ja) * 1986-06-07 1988-05-11 Kawasaki Steel Corp 密着性に優れたイオンプレ−テイング被膜をそなえる金属ストリツプの製造方法およびイオンプレ−テイング装置
JPH03232957A (ja) * 1990-02-09 1991-10-16 Nippon Steel Corp 耐摩耗部材の製造方法
JPH05239630A (ja) * 1992-02-28 1993-09-17 Nkk Corp イオンプレーティング方法及び装置
JPH06264213A (ja) * 1993-03-12 1994-09-20 Sekisui Chem Co Ltd チタン系薄膜被覆金属部材
US5614273A (en) * 1993-10-27 1997-03-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung, E.V. Process and apparatus for plasma-activated electron beam vaporization
JP2000064028A (ja) * 1998-06-09 2000-02-29 Sumitomo Heavy Ind Ltd Ｃｕ成膜方法

Also Published As

Publication number Publication date
EP1738395A1 (de) 2007-01-03
JP2007533853A (ja) 2007-11-22
WO2005109466A1 (de) 2005-11-17
CN1922708A (zh) 2007-02-28
KR20060134994A (ko) 2006-12-28
DE102004019169A1 (de) 2005-11-17

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