JP4845309B2 - レーザアニール方法及び半導体装置の作製方法 - Google Patents
レーザアニール方法及び半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4845309B2 JP4845309B2 JP2001398600A JP2001398600A JP4845309B2 JP 4845309 B2 JP4845309 B2 JP 4845309B2 JP 2001398600 A JP2001398600 A JP 2001398600A JP 2001398600 A JP2001398600 A JP 2001398600A JP 4845309 B2 JP4845309 B2 JP 4845309B2
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- Prior art keywords
- film
- laser
- substrate
- semiconductor film
- light
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- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001398600A JP4845309B2 (ja) | 2000-12-27 | 2001-12-27 | レーザアニール方法及び半導体装置の作製方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000399462 | 2000-12-27 | ||
| JP2000-399462 | 2000-12-27 | ||
| JP2000399462 | 2000-12-27 | ||
| JP2001398600A JP4845309B2 (ja) | 2000-12-27 | 2001-12-27 | レーザアニール方法及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002289524A JP2002289524A (ja) | 2002-10-04 |
| JP2002289524A5 JP2002289524A5 (cg-RX-API-DMAC10.html) | 2005-07-28 |
| JP4845309B2 true JP4845309B2 (ja) | 2011-12-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001398600A Expired - Fee Related JP4845309B2 (ja) | 2000-12-27 | 2001-12-27 | レーザアニール方法及び半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4845309B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG108878A1 (en) | 2001-10-30 | 2005-02-28 | Semiconductor Energy Lab | Laser irradiation method and laser irradiation apparatus, and method for fabricating semiconductor device |
| JP4762121B2 (ja) * | 2001-11-16 | 2011-08-31 | 株式会社半導体エネルギー研究所 | レーザ照射方法、及び半導体装置の作製方法 |
| JP2004128421A (ja) | 2002-10-07 | 2004-04-22 | Semiconductor Energy Lab Co Ltd | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
| JP4515034B2 (ja) | 2003-02-28 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| DE602004020538D1 (de) | 2003-02-28 | 2009-05-28 | Semiconductor Energy Lab | Verfahren und Vorrichtung zur Laserbestrahlung, sowie Verfahren zur Herstellung von Halbleiter. |
| JP4799825B2 (ja) * | 2003-03-03 | 2011-10-26 | 株式会社半導体エネルギー研究所 | レーザ照射方法 |
| US7304005B2 (en) * | 2003-03-17 | 2007-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
| JP4860116B2 (ja) * | 2003-03-17 | 2012-01-25 | 株式会社半導体エネルギー研究所 | 結晶性半導体膜の作製方法 |
| JP2005079312A (ja) * | 2003-08-29 | 2005-03-24 | Mitsubishi Electric Corp | 半導体装置の製造方法およびそれに用いられる半導体製造装置並びに液晶表示装置 |
| JP6615658B2 (ja) | 2016-03-16 | 2019-12-04 | 株式会社ブイ・テクノロジー | マスク及び薄膜トランジスタの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890723A (ja) * | 1981-11-25 | 1983-05-30 | Mitsubishi Electric Corp | レ−ザビ−ム照射による物性変化方法 |
| JPH0897141A (ja) * | 1994-09-22 | 1996-04-12 | A G Technol Kk | 多結晶半導体層の形成方法、多結晶半導体tft、及びビームアニール装置 |
| JPH11162868A (ja) * | 1997-12-02 | 1999-06-18 | Toshiba Corp | レ−ザ照射装置 |
| JP3504528B2 (ja) * | 1999-03-18 | 2004-03-08 | 株式会社日本製鋼所 | レーザ光照射装置 |
-
2001
- 2001-12-27 JP JP2001398600A patent/JP4845309B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002289524A (ja) | 2002-10-04 |
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