JP4828537B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4828537B2 JP4828537B2 JP2007532208A JP2007532208A JP4828537B2 JP 4828537 B2 JP4828537 B2 JP 4828537B2 JP 2007532208 A JP2007532208 A JP 2007532208A JP 2007532208 A JP2007532208 A JP 2007532208A JP 4828537 B2 JP4828537 B2 JP 4828537B2
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Description
Claims (9)
- 主面に形成された複数の第1集積回路素子と、前記主面および裏面を貫通するように形成された複数の第1貫通孔と、前記複数の第1貫通孔のそれぞれの内部に形成され、前記複数の集積回路素子のいずれかに電気的に接続された第1導電膜とを有する第1半導体基板を備えた半導体装置であって、
前記主面における前記複数の第1貫通孔のそれぞれの開口形状は、長方形であり、
前記複数の第1貫通孔は、その長辺が前記主面の第1方向に沿って配向された第1群の貫通孔と、前記長辺が前記主面の第1方向とは異なる第2方向に沿って配向された第2群の貫通孔とを含み、
前記主面における前記第1群の貫通孔の数と前記第2群の貫通孔の数は、等しく、
前記第1群の貫通孔と前記第2群の貫通孔は、電気的に分離されており、
前記第1群の貫通孔の開口形状と前記第2群の貫通孔の開口形状は、等しいことを特徴とする半導体装置。 - 前記主面における前記第1方向と前記第2方向とのなす角は、90度であることを特徴とする請求項1記載の半導体装置。
- 前記主面における前記第1方向と前記第2方向とのなす角は、45度であることを特徴とする請求項1記載の半導体装置。
- 前記複数の第1貫通孔は、それぞれの長辺が同一方向に配向され、かつそれぞれの短辺方向に沿って一列に配列された2個の第1貫通孔を一組とする複数組の貫通孔によって構成されることを特徴とする請求項1記載の半導体装置。
- 主面に複数の第2集積回路素子が形成された第2半導体基板をさらに備え、前記第2半導体基板上に前記第1半導体基板が積層され、前記第1半導体基板の主面に形成された前記第1集積回路素子のいずれかと、前記第2半導体基板の主面に形成された前記第2集積回路素子のいずれかとが、前記複数の第1貫通孔を介して互いに電気的に接続されていることを特徴とする請求項1記載の半導体装置。
- 前記第1半導体基板の厚さと前記第2半導体基板の厚さは異なることを特徴とする請求項5記載の半導体装置。
- 前記第2半導体基板は、その主面および裏面を貫通するように形成された複数の第2貫通孔と、前記複数の第2貫通孔のそれぞれの内部に形成され、前記複数の第2集積回路素子のいずれかに電気的に接続された第2導電膜とをさらに有することを特徴とする請求項5記載の半導体装置。
- 前記第1貫通孔は、短辺の長さが1μm以上であり、深さは短辺の長さの1/2よりも深いことを特徴とする請求項5記載の半導体装置。
- 前記第1導電膜は、タングステンを主成分とする導電膜であることを特徴とする請求項1記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007532208A JP4828537B2 (ja) | 2005-08-26 | 2006-08-25 | 半導体装置 |
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JP2005245553 | 2005-08-26 | ||
JP2005245553 | 2005-08-26 | ||
PCT/JP2006/316770 WO2007023963A1 (ja) | 2005-08-26 | 2006-08-25 | 半導体装置 |
JP2007532208A JP4828537B2 (ja) | 2005-08-26 | 2006-08-25 | 半導体装置 |
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JPWO2007023963A1 JPWO2007023963A1 (ja) | 2009-03-05 |
JP4828537B2 true JP4828537B2 (ja) | 2011-11-30 |
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JP2007532208A Expired - Fee Related JP4828537B2 (ja) | 2005-08-26 | 2006-08-25 | 半導体装置 |
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US (1) | US7948088B2 (ja) |
JP (1) | JP4828537B2 (ja) |
TW (1) | TWI407539B (ja) |
WO (1) | WO2007023963A1 (ja) |
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JP2016174101A (ja) * | 2015-03-17 | 2016-09-29 | 株式会社東芝 | 半導体装置およびその製造方法 |
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JP2004221430A (ja) * | 2003-01-16 | 2004-08-05 | Nec Electronics Corp | 半導体装置およびそのマスクパターン |
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US7948088B2 (en) | 2011-05-24 |
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