JP4827263B2 - 熱処理装置 - Google Patents

熱処理装置 Download PDF

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Publication number
JP4827263B2
JP4827263B2 JP2008313453A JP2008313453A JP4827263B2 JP 4827263 B2 JP4827263 B2 JP 4827263B2 JP 2008313453 A JP2008313453 A JP 2008313453A JP 2008313453 A JP2008313453 A JP 2008313453A JP 4827263 B2 JP4827263 B2 JP 4827263B2
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JP
Japan
Prior art keywords
gas
gas supply
exhaust
heat treatment
exhaust pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008313453A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010140960A (ja
Inventor
浩 新屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008313453A priority Critical patent/JP4827263B2/ja
Priority to KR1020090121116A priority patent/KR101464777B1/ko
Publication of JP2010140960A publication Critical patent/JP2010140960A/ja
Application granted granted Critical
Publication of JP4827263B2 publication Critical patent/JP4827263B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008313453A 2008-12-09 2008-12-09 熱処理装置 Expired - Fee Related JP4827263B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008313453A JP4827263B2 (ja) 2008-12-09 2008-12-09 熱処理装置
KR1020090121116A KR101464777B1 (ko) 2008-12-09 2009-12-08 열처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008313453A JP4827263B2 (ja) 2008-12-09 2008-12-09 熱処理装置

Publications (2)

Publication Number Publication Date
JP2010140960A JP2010140960A (ja) 2010-06-24
JP4827263B2 true JP4827263B2 (ja) 2011-11-30

Family

ID=42350866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008313453A Expired - Fee Related JP4827263B2 (ja) 2008-12-09 2008-12-09 熱処理装置

Country Status (2)

Country Link
JP (1) JP4827263B2 (ko)
KR (1) KR101464777B1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101941097B1 (ko) * 2015-11-24 2019-01-23 주식회사 원익테라세미콘 가스 공급 및 배기 장치
US10796935B2 (en) * 2017-03-17 2020-10-06 Applied Materials, Inc. Electronic device manufacturing systems, methods, and apparatus for heating substrates and reducing contamination in loadlocks
JP6990121B2 (ja) * 2018-03-06 2022-01-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102139615B1 (ko) 2018-07-10 2020-08-12 세메스 주식회사 기판 처리 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183269B2 (ja) * 1998-09-09 2001-07-09 日本電気株式会社 反応生成物除去機能付き真空装置及びその反応生成物除去方法
JP3719337B2 (ja) 1998-09-11 2005-11-24 日産自動車株式会社 遠心式圧縮機
JP3108693B1 (ja) * 1999-09-17 2000-11-13 核燃料サイクル開発機構 排気管閉塞防止方法及び装置
JP3756100B2 (ja) * 2001-10-12 2006-03-15 アプライド マテリアルズ インコーポレイテッド 成膜装置
JP2008060303A (ja) * 2006-08-31 2008-03-13 Dainippon Screen Mfg Co Ltd 熱処理装置
JP4465342B2 (ja) * 2006-11-15 2010-05-19 株式会社日立国際電気 半導体製造装置、排気管系および半導体集積回路装置の製造方法
KR20080059358A (ko) * 2008-06-04 2008-06-27 공배성 열풍 및 열원을 이용한 건조장치

Also Published As

Publication number Publication date
JP2010140960A (ja) 2010-06-24
KR20100066399A (ko) 2010-06-17
KR101464777B1 (ko) 2014-11-24

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