JP2010074185A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010074185A5 JP2010074185A5 JP2009287783A JP2009287783A JP2010074185A5 JP 2010074185 A5 JP2010074185 A5 JP 2010074185A5 JP 2009287783 A JP2009287783 A JP 2009287783A JP 2009287783 A JP2009287783 A JP 2009287783A JP 2010074185 A5 JP2010074185 A5 JP 2010074185A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wafer
- heating
- unit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 120
- 238000001816 cooling Methods 0.000 claims description 96
- 239000000758 substrate Substances 0.000 claims description 61
- 238000000576 coating method Methods 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 28
- 239000000969 carrier Substances 0.000 claims description 26
- 235000012431 wafers Nutrition 0.000 description 172
- 239000007789 gas Substances 0.000 description 44
- 101700076045 TRS1 Proteins 0.000 description 14
- 230000032258 transport Effects 0.000 description 12
- 241000711969 Chandipura virus Species 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 230000002093 peripheral Effects 0.000 description 9
- 238000010926 purge Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 6
- 201000005806 Western equine encephalitis Diseases 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000003028 elevating Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000007781 pre-processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 210000003462 Veins Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 230000002542 deteriorative Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009287783A JP5158066B2 (ja) | 2009-12-18 | 2009-12-18 | 塗布、現像装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009287783A JP5158066B2 (ja) | 2009-12-18 | 2009-12-18 | 塗布、現像装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005121267A Division JP4535499B2 (ja) | 2005-04-19 | 2005-04-19 | 加熱装置、塗布、現像装置及び加熱方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010074185A JP2010074185A (ja) | 2010-04-02 |
| JP2010074185A5 true JP2010074185A5 (ko) | 2011-02-24 |
| JP5158066B2 JP5158066B2 (ja) | 2013-03-06 |
Family
ID=42205623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009287783A Active JP5158066B2 (ja) | 2009-12-18 | 2009-12-18 | 塗布、現像装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5158066B2 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6239813B2 (ja) * | 2012-07-18 | 2017-11-29 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
| JP5630526B2 (ja) * | 2013-04-08 | 2014-11-26 | 東京エレクトロン株式会社 | 熱処理装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3651286B2 (ja) * | 1998-11-18 | 2005-05-25 | 松下電器産業株式会社 | 基板のプラズマクリーニング装置 |
| JP2000312463A (ja) * | 1999-04-27 | 2000-11-07 | Shinko Electric Co Ltd | リニアモータのレール接続構造 |
| JP2001117064A (ja) * | 1999-10-19 | 2001-04-27 | Tokyo Electron Ltd | 搬送装置の位置合わせ機構および位置合わせ方法、ならびに基板処理装置 |
| JP2004214696A (ja) * | 1999-10-19 | 2004-07-29 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
| KR100348938B1 (ko) * | 1999-12-06 | 2002-08-14 | 한국디엔에스 주식회사 | 포토리소그라피 공정을 위한 반도체 제조장치 |
| JP3793004B2 (ja) * | 2000-08-09 | 2006-07-05 | 東京エレクトロン株式会社 | 基板の搬送方法 |
| JP2003285902A (ja) * | 2002-03-29 | 2003-10-07 | Murata Mach Ltd | 搬送設備 |
| JP2004128249A (ja) * | 2002-10-03 | 2004-04-22 | Sendai Nikon:Kk | 基板保持搬送方法、基板ホルダ、基板搬送装置、基板保持搬送装置及び露光装置 |
| JP4133208B2 (ja) * | 2002-10-22 | 2008-08-13 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP4137711B2 (ja) * | 2003-06-16 | 2008-08-20 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送手段の位置合わせ方法 |
| JP4069035B2 (ja) * | 2003-08-12 | 2008-03-26 | 東京エレクトロン株式会社 | 基板の処理システム及び基板の熱処理方法 |
| JP2004235659A (ja) * | 2004-03-15 | 2004-08-19 | Tokyo Electron Ltd | 基板処理装置用ブロック及び基板処理装置 |
-
2009
- 2009-12-18 JP JP2009287783A patent/JP5158066B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4535499B2 (ja) | 加熱装置、塗布、現像装置及び加熱方法 | |
| JP4410147B2 (ja) | 加熱装置、塗布、現像装置及び加熱方法 | |
| JP4606355B2 (ja) | 熱処理装置、熱処理方法及び記憶媒体 | |
| JP4421501B2 (ja) | 加熱装置、塗布、現像装置及び加熱方法 | |
| TWI425586B (zh) | 基板搬送裝置及熱處理裝置 | |
| US7987019B2 (en) | Substrate transfer method and substrate transfer apparatus | |
| JP4450784B2 (ja) | 塗布、現像装置及びその方法 | |
| TW504735B (en) | Film forming method and film forming apparatus | |
| KR20070026198A (ko) | 가열장치 및 도포, 현상장치 | |
| JP2007220983A (ja) | 加熱装置、加熱方法、塗布装置及び記憶媒体 | |
| JP4765750B2 (ja) | 熱処理装置、熱処理方法、記憶媒体 | |
| JP2008166604A (ja) | 加熱装置及び塗布、現像装置並びに加熱方法 | |
| JP3180048U (ja) | 熱処理装置 | |
| JP2005340286A (ja) | 熱処理装置及び熱処理方法 | |
| JP5158066B2 (ja) | 塗布、現像装置 | |
| JP3898895B2 (ja) | 加熱処理装置及び加熱処理方法 | |
| JP2010074185A5 (ko) | ||
| JP2007067111A (ja) | 加熱装置、塗布、現像装置及び加熱方法 | |
| JP2001237157A (ja) | 加熱処理装置 | |
| JP2002203779A (ja) | 加熱処理装置 | |
| JP4302646B2 (ja) | 加熱処理装置 | |
| JP4800226B2 (ja) | 熱処理装置 | |
| JP2008166658A (ja) | 熱処理装置 |