JP4819608B2 - 液体吐出ヘッド、液体吐出装置、及び画像形成装置 - Google Patents
液体吐出ヘッド、液体吐出装置、及び画像形成装置 Download PDFInfo
- Publication number
- JP4819608B2 JP4819608B2 JP2006208377A JP2006208377A JP4819608B2 JP 4819608 B2 JP4819608 B2 JP 4819608B2 JP 2006208377 A JP2006208377 A JP 2006208377A JP 2006208377 A JP2006208377 A JP 2006208377A JP 4819608 B2 JP4819608 B2 JP 4819608B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- metal
- alloy
- liquid ejection
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Coating Apparatus (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
Claims (8)
- 圧電素子の変位を利用して圧力室内に充填されるインクを加圧し、前記圧力室に連通するノズルからインク滴を吐出させる液体吐出ヘッドであって、
前記圧電素子の電気接続部では第1の電極と第2の電極が接続され、
前記電気接続部は少なくともGa金属を含む合金で構成され、
前記合金は30℃未満の融点であり、
前記第1及び第2の電極の一方の電極はGa金属を含み、他方の電極は前記Ga金属に接触すると合金化を起こす金属を含み、
前記金属は、Zn又はAlであることを特徴とする液体吐出ヘッド。 - 前記第1の電極は、基板の厚さ方向に形成される貫通電極であり、
前記第2の電極は、前記圧電素子の駆動電極であって前記貫通電極の端部に接続される電極であることを特徴とする請求項1に記載の液体吐出ヘッド。 - 前記貫通電極は、前記基板の厚さ方向に形成される貫通孔に導電粒子を含む導電性ペーストが充填された構造であることを特徴とする請求項2に記載の液体吐出ヘッド。
- 前記導電粒子は、Ga金属から成る単体粒子であることを特徴とする請求項3に記載の液体吐出ヘッド。
- 前記導電粒子は、表面が前記Ga金属でコートされたコート粒子であることを特徴とする請求項3に記載の液体吐出ヘッド。
- 前記導電粒子は、前記Ga金属及び前記金属から成る合金の単体粒子、又は、表面が前記合金でコートされたコート粒子であることを特徴とする請求項3に記載の液体吐出ヘッド。
- 請求項1乃至請求項6のいずれか1項に記載の液体吐出ヘッドを備えたことを特徴とする液体吐出装置。
- 請求項1乃至請求項6のいずれか1項に記載の液体吐出ヘッドを備えたことを特徴とする画像形成装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006208377A JP4819608B2 (ja) | 2006-07-31 | 2006-07-31 | 液体吐出ヘッド、液体吐出装置、及び画像形成装置 |
US11/882,058 US7862153B2 (en) | 2006-07-31 | 2007-07-30 | Electrical wiring structure, liquid ejection head, liquid ejection apparatus and image forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006208377A JP4819608B2 (ja) | 2006-07-31 | 2006-07-31 | 液体吐出ヘッド、液体吐出装置、及び画像形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008034719A JP2008034719A (ja) | 2008-02-14 |
JP4819608B2 true JP4819608B2 (ja) | 2011-11-24 |
Family
ID=38985754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006208377A Expired - Fee Related JP4819608B2 (ja) | 2006-07-31 | 2006-07-31 | 液体吐出ヘッド、液体吐出装置、及び画像形成装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7862153B2 (ja) |
JP (1) | JP4819608B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102470671B (zh) * | 2009-07-27 | 2014-11-26 | 扎姆泰科有限公司 | 具有后侧电连接的喷墨打印头组件 |
US10586227B2 (en) | 2011-02-16 | 2020-03-10 | Visa International Service Association | Snap mobile payment apparatuses, methods and systems |
CN106803175B (zh) | 2011-02-16 | 2021-07-30 | 维萨国际服务协会 | 快拍移动支付装置,方法和系统 |
US10223691B2 (en) | 2011-02-22 | 2019-03-05 | Visa International Service Association | Universal electronic payment apparatuses, methods and systems |
US9582598B2 (en) | 2011-07-05 | 2017-02-28 | Visa International Service Association | Hybrid applications utilizing distributed models and views apparatuses, methods and systems |
US9355393B2 (en) | 2011-08-18 | 2016-05-31 | Visa International Service Association | Multi-directional wallet connector apparatuses, methods and systems |
US10121129B2 (en) | 2011-07-05 | 2018-11-06 | Visa International Service Association | Electronic wallet checkout platform apparatuses, methods and systems |
US9710807B2 (en) | 2011-08-18 | 2017-07-18 | Visa International Service Association | Third-party value added wallet features and interfaces apparatuses, methods and systems |
US10825001B2 (en) | 2011-08-18 | 2020-11-03 | Visa International Service Association | Multi-directional wallet connector apparatuses, methods and systems |
US10242358B2 (en) | 2011-08-18 | 2019-03-26 | Visa International Service Association | Remote decoupled application persistent state apparatuses, methods and systems |
US10223730B2 (en) | 2011-09-23 | 2019-03-05 | Visa International Service Association | E-wallet store injection search apparatuses, methods and systems |
AU2013214801B2 (en) | 2012-02-02 | 2018-06-21 | Visa International Service Association | Multi-source, multi-dimensional, cross-entity, multimedia database platform apparatuses, methods and systems |
JP7230276B2 (ja) * | 2020-04-03 | 2023-02-28 | 株式会社Fuji | 回路形成方法および回路形成装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5586198A (en) * | 1978-12-23 | 1980-06-28 | Sony Corp | Circuit board and method of fabricating same |
JPS55108103A (en) * | 1979-02-14 | 1980-08-19 | Sony Corp | Conductive materaial |
JP2626001B2 (ja) * | 1988-12-13 | 1997-07-02 | 富士通株式会社 | フラックスレス接合方法 |
JPH065669A (ja) * | 1992-06-18 | 1994-01-14 | Matsushita Electric Ind Co Ltd | 半導体素子検査用配線基板とそれを用いた半導体素子検査方法 |
JPH07130793A (ja) * | 1993-11-01 | 1995-05-19 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP3512225B2 (ja) | 1994-02-28 | 2004-03-29 | 株式会社日立製作所 | 多層配線基板の製造方法 |
JP3592006B2 (ja) * | 1996-11-12 | 2004-11-24 | 松下電器産業株式会社 | ビアホール充填用導電性ペースト及びそれを用いたプリント配線板 |
JP3720689B2 (ja) * | 2000-07-31 | 2005-11-30 | キヤノン株式会社 | インクジェットヘッド用基体、インクジェットヘッド、インクジェットヘッドの製造方法、インクジェットヘッドの使用方法およびインクジェット記録装置 |
JP2003124631A (ja) * | 2001-10-15 | 2003-04-25 | Fujikura Ltd | 多層プリント配線板用基材とその製造方法および多層プリント配線板 |
JP2003234576A (ja) | 2002-02-12 | 2003-08-22 | Hitachi Chem Co Ltd | 多層プリント配線板およびその製造法 |
JP2006021521A (ja) * | 2004-06-11 | 2006-01-26 | Fuji Xerox Co Ltd | 液滴吐出ヘッドの製造方法及び液滴吐出ヘッド並びに液滴吐出装置 |
JP4483562B2 (ja) * | 2004-12-13 | 2010-06-16 | パナソニック株式会社 | 導体配線の形成方法 |
US7837475B2 (en) * | 2008-08-15 | 2010-11-23 | Fujitsu Component Limited | Connector with reinforced mounting structure |
-
2006
- 2006-07-31 JP JP2006208377A patent/JP4819608B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-30 US US11/882,058 patent/US7862153B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008034719A (ja) | 2008-02-14 |
US7862153B2 (en) | 2011-01-04 |
US20080024561A1 (en) | 2008-01-31 |
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