JP4817043B2 - セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法 - Google Patents

セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法 Download PDF

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Publication number
JP4817043B2
JP4817043B2 JP2005248594A JP2005248594A JP4817043B2 JP 4817043 B2 JP4817043 B2 JP 4817043B2 JP 2005248594 A JP2005248594 A JP 2005248594A JP 2005248594 A JP2005248594 A JP 2005248594A JP 4817043 B2 JP4817043 B2 JP 4817043B2
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Japan
Prior art keywords
film
ceramic substrate
mainly composed
gold
plating
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JP2005248594A
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Japanese (ja)
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JP2007063042A (ja
JP2007063042A5 (https=
Inventor
文丈 谷口
悟 稲田
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Proterial Ltd
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Hitachi Metals Ltd
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JP2005248594A 2005-08-30 2005-08-30 セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法 Expired - Lifetime JP4817043B2 (ja)

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JP2005248594A JP4817043B2 (ja) 2005-08-30 2005-08-30 セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法

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JP2005248594A JP4817043B2 (ja) 2005-08-30 2005-08-30 セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法

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JP2007063042A JP2007063042A (ja) 2007-03-15
JP2007063042A5 JP2007063042A5 (https=) 2008-08-28
JP4817043B2 true JP4817043B2 (ja) 2011-11-16

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JP2005248594A Expired - Lifetime JP4817043B2 (ja) 2005-08-30 2005-08-30 セラミクス基板およびセラミクス基板を用いた電子部品とセラミクス基板の製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6024242B2 (ja) 2012-07-02 2016-11-09 セイコーエプソン株式会社 電子デバイスの製造方法
JP2014146652A (ja) 2013-01-28 2014-08-14 Toppan Printing Co Ltd 配線基板およびその製造方法
JP5906264B2 (ja) * 2014-02-12 2016-04-20 新光電気工業株式会社 配線基板及びその製造方法
US20230303455A1 (en) 2020-08-07 2023-09-28 U-Map Co., Ltd. Ceramic substrate, aln single crystal, aln whisker, and aln whisker composite

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2543619B2 (ja) * 1990-09-05 1996-10-16 新光電気工業株式会社 半導体装置用リ―ドフレ―ム
JPH06260577A (ja) * 1993-03-08 1994-09-16 Nec Corp 配線電極の被膜構造
JPH1050915A (ja) * 1996-08-06 1998-02-20 Hitachi Ltd 半導体装置及びその製造方法
JP3728572B2 (ja) * 1996-10-31 2005-12-21 株式会社日立製作所 配線基板の製造方法
JPH10284666A (ja) * 1997-04-01 1998-10-23 Furukawa Electric Co Ltd:The 電子部品機器
JPH10287994A (ja) * 1997-04-14 1998-10-27 World Metal:Kk ボンディング部のメッキ構造
JPH10289973A (ja) * 1997-04-16 1998-10-27 Sony Corp リードフレームの表面処理方法
JP2004055624A (ja) * 2002-07-16 2004-02-19 Murata Mfg Co Ltd 基板の製造方法
JP2005158771A (ja) * 2003-11-20 2005-06-16 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
KR20070015164A (ko) * 2004-05-25 2007-02-01 신꼬오덴기 고교 가부시키가이샤 반도체 부품의 외장 팔라듐 도금 구조 및 반도체 장치의제조 방법

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