JP4810319B2 - 加工装置及びデバイス製造方法 - Google Patents

加工装置及びデバイス製造方法 Download PDF

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Publication number
JP4810319B2
JP4810319B2 JP2006160510A JP2006160510A JP4810319B2 JP 4810319 B2 JP4810319 B2 JP 4810319B2 JP 2006160510 A JP2006160510 A JP 2006160510A JP 2006160510 A JP2006160510 A JP 2006160510A JP 4810319 B2 JP4810319 B2 JP 4810319B2
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JP
Japan
Prior art keywords
mold
resin
load
drive unit
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006160510A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007329367A5 (enExample
JP2007329367A (ja
Inventor
和之 春見
英悟 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006160510A priority Critical patent/JP4810319B2/ja
Priority to US11/755,973 priority patent/US7785091B2/en
Priority to TW096120000A priority patent/TWI366073B/zh
Priority to KR1020070055769A priority patent/KR100870606B1/ko
Publication of JP2007329367A publication Critical patent/JP2007329367A/ja
Publication of JP2007329367A5 publication Critical patent/JP2007329367A5/ja
Application granted granted Critical
Publication of JP4810319B2 publication Critical patent/JP4810319B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
JP2006160510A 2006-06-09 2006-06-09 加工装置及びデバイス製造方法 Expired - Fee Related JP4810319B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006160510A JP4810319B2 (ja) 2006-06-09 2006-06-09 加工装置及びデバイス製造方法
US11/755,973 US7785091B2 (en) 2006-06-09 2007-05-31 Processing apparatus and device manufacturing method
TW096120000A TWI366073B (en) 2006-06-09 2007-06-04 Processing apparatus and device manufacturing method
KR1020070055769A KR100870606B1 (ko) 2006-06-09 2007-06-08 가공장치 및 디바이스 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006160510A JP4810319B2 (ja) 2006-06-09 2006-06-09 加工装置及びデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2007329367A JP2007329367A (ja) 2007-12-20
JP2007329367A5 JP2007329367A5 (enExample) 2010-05-06
JP4810319B2 true JP4810319B2 (ja) 2011-11-09

Family

ID=38929627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006160510A Expired - Fee Related JP4810319B2 (ja) 2006-06-09 2006-06-09 加工装置及びデバイス製造方法

Country Status (4)

Country Link
US (1) US7785091B2 (enExample)
JP (1) JP4810319B2 (enExample)
KR (1) KR100870606B1 (enExample)
TW (1) TWI366073B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
JP5371349B2 (ja) 2008-09-19 2013-12-18 キヤノン株式会社 インプリント装置、および物品の製造方法
JP2010093187A (ja) * 2008-10-10 2010-04-22 Renesas Technology Corp 半導体集積回路装置の製造方法
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
EP2384875A4 (en) * 2009-01-30 2014-03-12 Konica Minolta Opto Inc DEVICE FOR PREPARING A WAFER LENS AND METHOD FOR PRODUCING A WAFER LENS
JP5267939B2 (ja) * 2009-02-03 2013-08-21 富士電機株式会社 インプリント装置及びインプリント方法
JP4940262B2 (ja) 2009-03-25 2012-05-30 株式会社東芝 インプリントパターン形成方法
JP5563243B2 (ja) * 2009-06-01 2014-07-30 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP2011009641A (ja) * 2009-06-29 2011-01-13 Toshiba Corp 半導体装置の製造方法及びインプリント用テンプレート
KR101005583B1 (ko) * 2009-08-04 2011-01-05 한국기계연구원 기판 정렬 모듈 및 이를 구비하는 리소그래피 장치
NL2004945A (en) * 2009-08-14 2011-02-15 Asml Netherlands Bv Imprint lithography apparatus and method.
JP5583374B2 (ja) * 2009-09-07 2014-09-03 株式会社島津製作所 光硬化樹脂の特性試験装置、その試験装置で使用する保持具、特性試験方法
KR101770538B1 (ko) * 2009-10-23 2017-08-22 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 상호 접속부를 위한 자기―정렬 배리어 및 캡핑 층
NL2005735A (en) * 2009-12-23 2011-06-27 Asml Netherlands Bv Imprint lithographic apparatus and imprint lithographic method.
KR20150008448A (ko) * 2009-12-26 2015-01-22 캐논 가부시끼가이샤 임프린트 장치 및 물품의 제조 방법
JP5438578B2 (ja) 2010-03-29 2014-03-12 富士フイルム株式会社 微細凹凸パターンの形成方法及び形成装置
KR100978612B1 (ko) * 2010-05-25 2010-08-27 (주)아이에스티 코리아 자동 평행 조정 스크레이퍼 가공 장치
JP5820707B2 (ja) * 2011-11-30 2015-11-24 株式会社Ｓｃｒｅｅｎホールディングス パターン転写方法およびパターン転写装置
JP6000712B2 (ja) * 2012-07-24 2016-10-05 キヤノン株式会社 樹脂の製造方法及び樹脂の製造装置
JP6315963B2 (ja) * 2013-12-09 2018-04-25 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP6294686B2 (ja) * 2014-02-04 2018-03-14 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP5745129B2 (ja) * 2014-04-02 2015-07-08 キヤノン株式会社 インプリント装置及びインプリント方法
JP2015135975A (ja) * 2015-02-23 2015-07-27 キヤノン株式会社 インプリント装置及びインプリント方法
US10534259B2 (en) * 2017-03-28 2020-01-14 Canon Kabushiki Kaisha Method and system for imprint force control

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
DE19648844C1 (de) * 1996-11-26 1997-09-18 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Abformung mikrosystemtechnischer Strukturen
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
JPWO2004093171A1 (ja) * 2003-04-11 2006-07-06 Ｓｃｉｖａｘ株式会社 パターン形成装置、パターン形成方法
US7396475B2 (en) * 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
US7157036B2 (en) * 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
JP4217551B2 (ja) * 2003-07-02 2009-02-04 キヤノン株式会社 微細加工方法及び微細加工装置
KR20050019557A (ko) * 2003-08-19 2005-03-03 엘지전자 주식회사 나노 임프린트 방법 및 이에 이용되는 고분자 조성물
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP2005191444A (ja) * 2003-12-26 2005-07-14 Bussan Nanotech Research Institute Inc パターン転写装置、型の洗浄方法、パターン転写方法
JP4787993B2 (ja) * 2005-04-22 2011-10-05 株式会社日立製作所 インプリント方式の転写印刷方法、および転写印刷版

Also Published As

Publication number Publication date
US20080093339A1 (en) 2008-04-24
TWI366073B (en) 2012-06-11
KR100870606B1 (ko) 2008-11-25
JP2007329367A (ja) 2007-12-20
TW200815930A (en) 2008-04-01
US7785091B2 (en) 2010-08-31
KR20070118024A (ko) 2007-12-13

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