KR100870606B1 - 가공장치 및 디바이스 제조방법 - Google Patents

가공장치 및 디바이스 제조방법 Download PDF

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Publication number
KR100870606B1
KR100870606B1 KR1020070055769A KR20070055769A KR100870606B1 KR 100870606 B1 KR100870606 B1 KR 100870606B1 KR 1020070055769 A KR1020070055769 A KR 1020070055769A KR 20070055769 A KR20070055769 A KR 20070055769A KR 100870606 B1 KR100870606 B1 KR 100870606B1
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KR
South Korea
Prior art keywords
mold
resin
state
driver
wafer
Prior art date
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Expired - Fee Related
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KR1020070055769A
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English (en)
Korean (ko)
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KR20070118024A (ko
Inventor
카즈유키 카스미
에이고 카와카미
Original Assignee
캐논 가부시끼가이샤
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Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20070118024A publication Critical patent/KR20070118024A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
KR1020070055769A 2006-06-09 2007-06-08 가공장치 및 디바이스 제조방법 Expired - Fee Related KR100870606B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00160510 2006-06-09
JP2006160510A JP4810319B2 (ja) 2006-06-09 2006-06-09 加工装置及びデバイス製造方法

Publications (2)

Publication Number Publication Date
KR20070118024A KR20070118024A (ko) 2007-12-13
KR100870606B1 true KR100870606B1 (ko) 2008-11-25

Family

ID=38929627

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070055769A Expired - Fee Related KR100870606B1 (ko) 2006-06-09 2007-06-08 가공장치 및 디바이스 제조방법

Country Status (4)

Country Link
US (1) US7785091B2 (enExample)
JP (1) JP4810319B2 (enExample)
KR (1) KR100870606B1 (enExample)
TW (1) TWI366073B (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
JP5371349B2 (ja) * 2008-09-19 2013-12-18 キヤノン株式会社 インプリント装置、および物品の製造方法
JP2010093187A (ja) * 2008-10-10 2010-04-22 Renesas Technology Corp 半導体集積回路装置の製造方法
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
WO2010087082A1 (ja) * 2009-01-30 2010-08-05 コニカミノルタオプト株式会社 ウエハレンズ製造装置及びウエハレンズの製造方法
JP5267939B2 (ja) * 2009-02-03 2013-08-21 富士電機株式会社 インプリント装置及びインプリント方法
JP4940262B2 (ja) 2009-03-25 2012-05-30 株式会社東芝 インプリントパターン形成方法
JP5563243B2 (ja) * 2009-06-01 2014-07-30 キヤノン株式会社 インプリント装置、および、物品の製造方法
JP2011009641A (ja) * 2009-06-29 2011-01-13 Toshiba Corp 半導体装置の製造方法及びインプリント用テンプレート
KR101005583B1 (ko) * 2009-08-04 2011-01-05 한국기계연구원 기판 정렬 모듈 및 이를 구비하는 리소그래피 장치
NL2004945A (en) * 2009-08-14 2011-02-15 Asml Netherlands Bv Imprint lithography apparatus and method.
JP5583374B2 (ja) * 2009-09-07 2014-09-03 株式会社島津製作所 光硬化樹脂の特性試験装置、その試験装置で使用する保持具、特性試験方法
WO2011050073A1 (en) * 2009-10-23 2011-04-28 President And Fellows Of Harvard College Self-aligned barrier and capping layers for interconnects
NL2005735A (en) * 2009-12-23 2011-06-27 Asml Netherlands Bv Imprint lithographic apparatus and imprint lithographic method.
KR101642545B1 (ko) * 2009-12-26 2016-07-25 캐논 가부시끼가이샤 임프린트 장치 및 물품의 제조 방법
JP5438578B2 (ja) 2010-03-29 2014-03-12 富士フイルム株式会社 微細凹凸パターンの形成方法及び形成装置
KR100978612B1 (ko) * 2010-05-25 2010-08-27 (주)아이에스티 코리아 자동 평행 조정 스크레이퍼 가공 장치
JP5820707B2 (ja) * 2011-11-30 2015-11-24 株式会社Ｓｃｒｅｅｎホールディングス パターン転写方法およびパターン転写装置
JP6000712B2 (ja) 2012-07-24 2016-10-05 キヤノン株式会社 樹脂の製造方法及び樹脂の製造装置
JP6315963B2 (ja) * 2013-12-09 2018-04-25 キヤノン株式会社 インプリント装置、及び物品の製造方法
JP6294686B2 (ja) * 2014-02-04 2018-03-14 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP5745129B2 (ja) * 2014-04-02 2015-07-08 キヤノン株式会社 インプリント装置及びインプリント方法
JP2015135975A (ja) * 2015-02-23 2015-07-27 キヤノン株式会社 インプリント装置及びインプリント方法
US10534259B2 (en) * 2017-03-28 2020-01-14 Canon Kabushiki Kaisha Method and system for imprint force control

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004097518A2 (en) * 2003-04-25 2004-11-11 Molecular Imprints, Inc. A method of forming stepped structures employing imprint lithography
WO2005000552A2 (en) * 2003-06-17 2005-01-06 Molecular Imprints, Inc. Method to reduce adhesion between a conformable region and a pattern of a mold
KR20050019557A (ko) * 2003-08-19 2005-03-03 엘지전자 주식회사 나노 임프린트 방법 및 이에 이용되는 고분자 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309580B1 (en) * 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
DE19648844C1 (de) * 1996-11-26 1997-09-18 Jenoptik Jena Gmbh Einrichtung und Verfahren zur Abformung mikrosystemtechnischer Strukturen
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
WO2004093171A1 (ja) * 2003-04-11 2004-10-28 Scivax Corporation パターン形成装置、パターン形成方法
JP4217551B2 (ja) * 2003-07-02 2009-02-04 キヤノン株式会社 微細加工方法及び微細加工装置
JP2005101201A (ja) * 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP2005191444A (ja) * 2003-12-26 2005-07-14 Bussan Nanotech Research Institute Inc パターン転写装置、型の洗浄方法、パターン転写方法
JP4787993B2 (ja) * 2005-04-22 2011-10-05 株式会社日立製作所 インプリント方式の転写印刷方法、および転写印刷版

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004097518A2 (en) * 2003-04-25 2004-11-11 Molecular Imprints, Inc. A method of forming stepped structures employing imprint lithography
WO2005000552A2 (en) * 2003-06-17 2005-01-06 Molecular Imprints, Inc. Method to reduce adhesion between a conformable region and a pattern of a mold
KR20050019557A (ko) * 2003-08-19 2005-03-03 엘지전자 주식회사 나노 임프린트 방법 및 이에 이용되는 고분자 조성물

Also Published As

Publication number Publication date
TWI366073B (en) 2012-06-11
KR20070118024A (ko) 2007-12-13
US7785091B2 (en) 2010-08-31
US20080093339A1 (en) 2008-04-24
JP4810319B2 (ja) 2011-11-09
JP2007329367A (ja) 2007-12-20
TW200815930A (en) 2008-04-01

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