JP4805299B2 - 電界効果トランジスタの製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 88
- 238000000034 method Methods 0.000 title claims description 56
- 230000005669 field effect Effects 0.000 title claims description 45
- 239000012535 impurity Substances 0.000 claims description 147
- 238000002513 implantation Methods 0.000 claims description 57
- 239000004065 semiconductor Substances 0.000 claims description 32
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 27
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 23
- 150000004767 nitrides Chemical class 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- 230000004913 activation Effects 0.000 claims description 9
- 229910052733 gallium Inorganic materials 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 9
- 239000011241 protective layer Substances 0.000 claims 1
- 229910002601 GaN Inorganic materials 0.000 description 169
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 146
- 239000000758 substrate Substances 0.000 description 62
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 25
- 229910010271 silicon carbide Inorganic materials 0.000 description 24
- 150000002500 ions Chemical class 0.000 description 20
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 16
- 238000001994 activation Methods 0.000 description 13
- 238000010521 absorption reaction Methods 0.000 description 12
- 238000005530 etching Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 125000004429 atom Chemical group 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 9
- 239000007864 aqueous solution Substances 0.000 description 8
- 125000004433 nitrogen atom Chemical group N* 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- 238000002955 isolation Methods 0.000 description 6
- 238000001451 molecular beam epitaxy Methods 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000005533 two-dimensional electron gas Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
- H01L21/26546—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds of electrically active species
- H01L21/26553—Through-implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66522—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with an active layer made of a group 13/15 material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7834—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a non-planar structure, e.g. the gate or the source or the drain being non-planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Description
101 基板
103 GaN層
103a チャネル形成領域
104 N+GaN領域
105,305,505,605 ゲート絶縁膜
106,306,506,606 ゲート電極
107 ソース電極
108 ドレイン電極
204 RESURF領域
303,403 N−GaN層
405 N−AlGaN層
Claims (10)
- III族窒化物半導体材料、GaAsまたはSiCの少なくとも一つによって形成されたキャリア移動層を有する電界効果トランジスタの製造方法において、
前記キャリア移動層の所定領域に不純物を注入する不純物注入工程と、
前記キャリア移動層における不純物注入領域上および非不純物注入領域上に絶縁膜を形成する絶縁膜形成工程と、
前記キャリア移動層における非不純物注入領域上に、前記絶縁膜を介して、前記キャリア移動層形成材料のバンドギャップエネルギーよりも低いバンドギャップエネルギーを有する保護膜を、キャリア移動層形成材料のバンドギャップエネルギーよりも高いエネルギーを有するレーザ光が透過できない膜厚に形成する保護膜形成工程と、
前記絶縁膜および前記保護膜の形成後に、前記レーザ光を照射することによって、前記不純物を活性化させる活性化工程と、
を含み、
前記絶縁膜は、前記レーザ光を透過できるとともに、前記保護膜よりも熱伝導率の低いもので形成されている
ことを特徴とする電界効果トランジスタの製造方法。 - 前記保護膜は、誘電体膜であることを特徴とする請求項1に記載の電界効果トランジスタの製造方法。
- 前記保護膜は、不純物を含むポリシリコン膜であって、ゲート電極として機能し、
前記活性化工程は、前記レーザ光を照射することによって前記キャリア移動層形成材料に含まれる不純物とともに前記保護膜に含まれる不純物を活性化することを特徴とする請求項1に記載の電界効果トランジスタの製造方法。 - 前記絶縁膜は、ゲート絶縁膜として機能することを特徴とする請求項1〜3のいずれか一つに記載の電界効果トランジスタの製造方法。
- 前記絶縁膜は、SiO2膜、SiNx膜、Al2O3膜またはMgO膜のいずれかであることを特徴とする請求項1〜4のいずれか一つに記載の電界効果トランジスタの製造方法。
- 前記III族窒化物半導体材料におけるIII族元素は、Ga、Al、Bの少なくともいずれかであることを特徴とする請求項1〜5のいずれか一つに記載の電界効果トランジスタの
製造方法。 - 前記レーザ光は、0.15μm以上0.365μm以下の波長を有することを特徴とする請求項1〜6のいずれか一つに記載の電界効果トランジスタの製造方法。
- 前記保護膜は、1.1eV以下のバンドギャップエネルギーを有することを特徴とする請求項1〜7のいずれか一つに記載の電界効果トランジスタの製造方法。
- 前記レーザ光の光源は、パルス光源であることを特徴とする請求項1〜8のいずれか一つに記載の電界効果トランジスタの製造方法。
- 前記不純物注入工程は、前記キャリア移動層表面から10nm以上150nm以下の深さに前記不純物を注入することを特徴とする請求項1〜9のいずれか一つに記載の電界効果トランジスタの製造方法。
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JP2008088603A JP4805299B2 (ja) | 2008-03-28 | 2008-03-28 | 電界効果トランジスタの製造方法 |
US12/382,943 US7998848B2 (en) | 2008-03-28 | 2009-03-26 | Method of producing field effect transistor |
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JP (1) | JP4805299B2 (ja) |
Families Citing this family (9)
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JP5555985B2 (ja) * | 2008-06-23 | 2014-07-23 | サンケン電気株式会社 | 半導体装置 |
JP5496635B2 (ja) * | 2008-12-19 | 2014-05-21 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
JP2011061094A (ja) * | 2009-09-11 | 2011-03-24 | Furukawa Electric Co Ltd:The | 電界効果トランジスタの製造方法 |
JP2013084951A (ja) * | 2011-09-30 | 2013-05-09 | Asahi Kasei Electronics Co Ltd | 半導体装置および半導体装置の製造方法 |
JP5654512B2 (ja) * | 2012-03-26 | 2015-01-14 | 株式会社東芝 | 窒化物半導体装置 |
US10164038B2 (en) | 2013-01-30 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of implanting dopants into a group III-nitride structure and device formed |
JP6728960B2 (ja) * | 2016-05-18 | 2020-07-22 | 富士電機株式会社 | 処理装置および半導体装置の製造方法 |
JP7157596B2 (ja) | 2018-08-30 | 2022-10-20 | 株式会社Screenホールディングス | ゲート絶縁膜の形成方法および熱処理方法 |
JP2023513262A (ja) | 2020-02-11 | 2023-03-30 | クロミス,インコーポレイテッド | スパッタリングされたマグネシウム源を使用して窒化ガリウム材料中のマグネシウムを拡散させるための方法およびシステム |
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JPS6079769A (ja) * | 1983-10-07 | 1985-05-07 | Hitachi Ltd | 半導体装置の製造方法 |
JPH05299434A (ja) * | 1992-04-24 | 1993-11-12 | Sony Corp | 半導体装置の製造方法 |
JP3615068B2 (ja) | 1998-12-09 | 2005-01-26 | 古河電気工業株式会社 | ヘテロ接合型窒化物半導体装置 |
JP4581270B2 (ja) * | 2001-03-05 | 2010-11-17 | 住友電気工業株式会社 | SiC半導体のイオン注入層及びその製造方法 |
JP3820424B2 (ja) * | 2001-03-27 | 2006-09-13 | 独立行政法人産業技術総合研究所 | 不純物イオン注入層の活性化法 |
JP4190754B2 (ja) * | 2001-11-27 | 2008-12-03 | 古河電気工業株式会社 | 電界効果トランジスタの製造方法 |
JP4084039B2 (ja) * | 2001-11-19 | 2008-04-30 | 株式会社 液晶先端技術開発センター | 薄膜半導体装置及びその製造方法 |
JPWO2004114413A1 (ja) * | 2003-06-20 | 2006-07-27 | 富士通株式会社 | 半導体装置及びその製造方法 |
US7002188B2 (en) * | 2003-08-29 | 2006-02-21 | The Titan Corporation | Laser-gated and pumped multi-layer semiconductor power switch with reduced forward losses |
JP2005332845A (ja) * | 2004-05-18 | 2005-12-02 | Sony Corp | 窒化物半導体素子の製造方法 |
JP2006253224A (ja) * | 2005-03-08 | 2006-09-21 | Toyota Central Res & Dev Lab Inc | 半導体装置とその製造方法 |
JP4451811B2 (ja) * | 2005-05-09 | 2010-04-14 | ローム株式会社 | 窒化物半導体素子の製法 |
JP5099576B2 (ja) * | 2006-02-23 | 2012-12-19 | 株式会社Ihi | 化合物半導体の活性化方法及び装置 |
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JP2009246034A (ja) | 2009-10-22 |
US20090246924A1 (en) | 2009-10-01 |
US7998848B2 (en) | 2011-08-16 |
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