JP5920255B2 - 半導体装置の製造方法およびそれに用いられるドライエッチング装置 - Google Patents
半導体装置の製造方法およびそれに用いられるドライエッチング装置 Download PDFInfo
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- 238000001312 dry etching Methods 0.000 title claims description 89
- 239000004065 semiconductor Substances 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 claims description 54
- 150000001875 compounds Chemical class 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 150000004767 nitrides Chemical class 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 74
- 239000000758 substrate Substances 0.000 description 49
- 229910002704 AlGaN Inorganic materials 0.000 description 32
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 238000009616 inductively coupled plasma Methods 0.000 description 12
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- 230000007547 defect Effects 0.000 description 4
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- 150000002367 halogens Chemical class 0.000 description 4
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
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- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005533 two-dimensional electron gas Effects 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- XOYLJNJLGBYDTH-UHFFFAOYSA-M chlorogallium Chemical compound [Ga]Cl XOYLJNJLGBYDTH-UHFFFAOYSA-M 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
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- 238000000407 epitaxy Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
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- 238000004020 luminiscence type Methods 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Description
本発明の第1実施形態について説明する。本実施形態では、図1に示す半導体装置の製造工程中におけるドライエッチング工程において、本発明の一実施形態にかかる製造方法を適用している。
Si(111)やSiC,及びサファイヤなどの半絶縁性基板1の表面に、GaN層2およびn型のAlGaN層3が積層された構造を有する化合物半導体基板を用意する。例えば、半絶縁性基板1の表面に、GaN層2およびAlGaN層3をMOCVD(Metal Organic Chemical Vapor Deposition:有機金属気相成長)法や超高純度、高精度にしたMBE(Molecular Beam Epitaxy:分子線エピタキシー)法などによって形成する。
AlGaN層3の表面に、層間膜となる酸化膜10を形成した後、酸化膜10の表面に第2マスクとなるレジスト11を形成する。そして、フォトリソグラフィ工程を経てレジスト11をパターニングしたのち、このレジスト11をマスクとして酸化膜10をパターニングする。これにより、AlGaN層3の表面のうちリセス形状部3aの形成予定位置においてレジスト11および酸化膜10が開口させられる。この後、レジスト11および酸化膜10をマスクとして用いたドライエッチング工程を行うことで、AlGaN層3の表面をリセス加工したリセス形状部3aを形成する。このとき、ドライエッチング工程を図3に示すICP(Inductively Coupled Plasma:誘導結合型)ドライエッチング装置を用いて行っている。
リセス形状部3a内を含め、AlGaN層3の表面に酸化膜などの絶縁膜、不純物をドープしたPoly−Si、Alなどの金属材料を順に成膜したのち、図示しないマスクを用いてこれらをパターニングする。これにより、ゲート絶縁膜4、ゲート電極5およびゲート配線層6が形成される。
ゲート絶縁膜4、ゲート電極5およびゲート配線層6を覆いつつ、溝部3b、3cの形成予定領域が開口する絶縁膜及びマスクを形成する。例えば、絶縁膜は酸化膜12を形成した後、酸化膜12の表面にマスクとなるレジスト13を形成することで構成することができる。
本発明の第2実施形態について説明する。本実施形態は、第1実施形態に対してドライエッチング工程で用いるドライエッチング装置の構成を変更したものであり、その他については第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第3実施形態について説明する。本実施形態は、第1実施形態に対して被エッチング対象となる半導体装置の構成を変更したものであり、その他については第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明の第4実施形態について説明する。本実施形態は、第1実施形態に対して被エッチング対象となる半導体装置の構成を変更したものであり、その他については第1実施形態と同様であるため、第1実施形態と異なる部分についてのみ説明する。
本発明は上記した実施形態に限定されるものではなく、特許請求の範囲に記載した範囲内において適宜変更が可能である。
2 GaN層
3 AlGaN層
3a リセス形状部
4 ゲート絶縁膜
5 ゲート電極
7 ソース電極
8 ドレイン電極
20 チャンバー
20a ステージ
20b 入射部
20c 光源
Claims (3)
- 3族元素の窒化物を主成分とする化合物半導体(2、3)をチャンバー(20)内に配置されるステージ(20a)上に設置し、該チャンバー内にエッチングガスを供給すると共にプラズマを発生させて、ドライエッチングにて前記化合物半導体の表面を加工するドライエッチング工程を含み、
前記ドライエッチング工程では、前記化合物半導体の表面の全面に対して平行光を照射する光源(23)を有する誘導結合型ドライエッチング装置を用いたドライエッチングを行い、該誘導結合型ドライエッチング装置に備えられる誘導結合型電極(21)に供給する電力を10W〜1000Wに設定すると共に、バイアス電源(22)におけるバイアスパワーを100W以下に設定し、該ドライエッチング中に前記チャンバー内に前記平行光による光照射を行うと共に、該光照射を前記化合物半導体の表面の全面に行い、かつ、該表面での前記光照射の強度を0.05mW/cm 2 以上として、該表面でのエッチング反応速度に律速させて前記ドライエッチングを行うことを特徴とする半導体装置の製造方法。 - 前記ドライエッチング工程では、前記光照射される光の波長を500nmよりも短波長とすることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記ドライエッチング工程は、横型もしくは縦型の整流素子または横型もしくは縦型のスイッチングデバイスを備えた半導体装置であって、前記化合物半導体のうち、前記横型もしくは縦型の整流素子または前記横型もしくは縦型スイッチングデバイスにおける電極(5、7、8)が配置される表面をドライエッチングする際に適用されることを特徴とする請求項1または2に記載の半導体装置の製造方法。
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JP2013055206A JP5920255B2 (ja) | 2013-03-18 | 2013-03-18 | 半導体装置の製造方法およびそれに用いられるドライエッチング装置 |
US14/159,055 US9202726B2 (en) | 2013-03-18 | 2014-01-20 | Manufacturing method of semiconductor device and dry etching apparatus for the same |
DE102014204923.7A DE102014204923A1 (de) | 2013-03-18 | 2014-03-17 | Herstellungsverfahren für eine Halbleitervorrichtung und Trockenätzvorrichtung für selbiges |
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JP5920255B2 true JP5920255B2 (ja) | 2016-05-18 |
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US8592900B2 (en) * | 2010-11-03 | 2013-11-26 | Texas Instruments Incorporated | Drain extended CMOS with counter-doped drain extension |
JP6287143B2 (ja) | 2013-12-06 | 2018-03-07 | 株式会社デンソー | 半導体装置およびその製造方法 |
CN105355550B (zh) * | 2015-12-02 | 2018-05-01 | 中国科学院微电子研究所 | Iii族氮化物低损伤刻蚀方法 |
TWI811394B (zh) * | 2019-07-09 | 2023-08-11 | 聯華電子股份有限公司 | 高電子遷移率電晶體及其製作方法 |
CN112151364A (zh) * | 2020-09-27 | 2020-12-29 | 北京北方华创微电子装备有限公司 | 半导体反应腔室 |
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JPS61141141A (ja) * | 1984-12-14 | 1986-06-28 | Hitachi Ltd | ドライエツチング装置 |
JPS61154038A (ja) * | 1984-12-26 | 1986-07-12 | Plasma Syst:Kk | ドライアツシング装置 |
JP3065380B2 (ja) * | 1990-06-19 | 2000-07-17 | アプライド マテリアルズ インコーポレイテッド | エッチング速度モニタ |
JPH0582490A (ja) * | 1991-09-19 | 1993-04-02 | Hitachi Ltd | 選択エツチングの方法、装置 |
JP2002005635A (ja) * | 2000-06-23 | 2002-01-09 | Toshiba Corp | エッチング深さ測定方法および測定装置並びにエッチング装置 |
JP4479222B2 (ja) | 2002-11-22 | 2010-06-09 | 沖電気工業株式会社 | 化合物半導体層の表面処理方法及び半導体装置の製造方法 |
JP2005302771A (ja) * | 2004-04-06 | 2005-10-27 | Renesas Technology Corp | 半導体デバイスの製造装置および製造方法 |
US20060226442A1 (en) * | 2005-04-07 | 2006-10-12 | An-Ping Zhang | GaN-based high electron mobility transistor and method for making the same |
US7642205B2 (en) * | 2005-04-08 | 2010-01-05 | Mattson Technology, Inc. | Rapid thermal processing using energy transfer layers |
JP4481921B2 (ja) | 2005-11-18 | 2010-06-16 | シャープ株式会社 | プラズマプロセス方法およびプラズマプロセス装置 |
JP4653124B2 (ja) * | 2007-01-12 | 2011-03-16 | 古河電気工業株式会社 | 半導体素子製造方法 |
JP5089215B2 (ja) * | 2007-03-28 | 2012-12-05 | 古河電気工業株式会社 | 窒化物化合物半導体層のエッチング方法及びその方法を用いて製造された半導体デバイス |
US7968441B2 (en) * | 2008-10-08 | 2011-06-28 | Applied Materials, Inc. | Dopant activation anneal to achieve less dopant diffusion (better USJ profile) and higher activation percentage |
JP2010129887A (ja) * | 2008-11-28 | 2010-06-10 | Sharp Corp | 半導体レーザ素子およびその製造方法 |
JP2010258441A (ja) * | 2009-03-31 | 2010-11-11 | Furukawa Electric Co Ltd:The | 電界効果トランジスタ |
JP5559505B2 (ja) * | 2009-09-30 | 2014-07-23 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US20110237051A1 (en) * | 2010-03-26 | 2011-09-29 | Kenneth Lee Hess | Process and apparatus for deposition of multicomponent semiconductor layers |
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