JP4796884B2 - 光導波路デバイスの製造方法 - Google Patents
光導波路デバイスの製造方法 Download PDFInfo
- Publication number
- JP4796884B2 JP4796884B2 JP2006113349A JP2006113349A JP4796884B2 JP 4796884 B2 JP4796884 B2 JP 4796884B2 JP 2006113349 A JP2006113349 A JP 2006113349A JP 2006113349 A JP2006113349 A JP 2006113349A JP 4796884 B2 JP4796884 B2 JP 4796884B2
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- layer
- film
- waveguide device
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 122
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000010410 layer Substances 0.000 claims description 141
- 239000010408 film Substances 0.000 claims description 76
- 238000005253 cladding Methods 0.000 claims description 52
- 239000012792 core layer Substances 0.000 claims description 47
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 33
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 28
- 239000011651 chromium Substances 0.000 claims description 27
- 229910052804 chromium Inorganic materials 0.000 claims description 26
- 239000010409 thin film Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000003550 marker Substances 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 238000005530 etching Methods 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006113349A JP4796884B2 (ja) | 2006-04-17 | 2006-04-17 | 光導波路デバイスの製造方法 |
| TW096111742A TW200804883A (en) | 2006-04-17 | 2007-04-03 | Optical waveguide device and manufacturing method thereof |
| US11/733,044 US7492984B2 (en) | 2006-04-17 | 2007-04-09 | Optical waveguide device and manufacturing method thereof |
| EP07007461.2A EP1847860B1 (en) | 2006-04-17 | 2007-04-11 | Optical waveguide device with optical component and its manufacturing method |
| CN2007100904839A CN101059586B (zh) | 2006-04-17 | 2007-04-12 | 光波导器件及其制造方法 |
| US12/348,205 US7778504B2 (en) | 2006-04-17 | 2009-01-02 | Optical waveguide device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006113349A JP4796884B2 (ja) | 2006-04-17 | 2006-04-17 | 光導波路デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007286340A JP2007286340A (ja) | 2007-11-01 |
| JP2007286340A5 JP2007286340A5 (enExample) | 2009-01-22 |
| JP4796884B2 true JP4796884B2 (ja) | 2011-10-19 |
Family
ID=38328223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006113349A Expired - Fee Related JP4796884B2 (ja) | 2006-04-17 | 2006-04-17 | 光導波路デバイスの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7492984B2 (enExample) |
| EP (1) | EP1847860B1 (enExample) |
| JP (1) | JP4796884B2 (enExample) |
| CN (1) | CN101059586B (enExample) |
| TW (1) | TW200804883A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025071897A1 (en) * | 2023-09-25 | 2025-04-03 | Ciena Corporation | Managing co-packaging of photonic integrated circuits |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007298770A (ja) * | 2006-04-28 | 2007-11-15 | Nec Corp | 光導波路デバイス及びその製造方法 |
| JP5186785B2 (ja) * | 2007-03-23 | 2013-04-24 | 日本電気株式会社 | 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム |
| JP5229617B2 (ja) * | 2008-07-11 | 2013-07-03 | 日本電気株式会社 | 光導波路デバイスとその製造方法 |
| JPWO2010106995A1 (ja) * | 2009-03-17 | 2012-09-20 | 日本電気株式会社 | 光導波路デバイス及びその製造方法 |
| KR101199302B1 (ko) | 2009-10-13 | 2012-11-09 | 한국전자통신연구원 | 광 소자 및 그 제조 방법 |
| US10009106B2 (en) | 2012-05-14 | 2018-06-26 | Acacia Communications, Inc. | Silicon photonics multicarrier optical transceiver |
| US9217836B2 (en) * | 2012-10-23 | 2015-12-22 | Kotura, Inc. | Edge coupling of optical devices |
| TWI565985B (zh) * | 2012-12-14 | 2017-01-11 | 鴻海精密工業股份有限公司 | 脊型光波導的製造方法 |
| JP6286853B2 (ja) * | 2013-04-04 | 2018-03-07 | 富士通株式会社 | 電子装置とその製造方法、及び電子機器 |
| US9099145B1 (en) * | 2013-12-24 | 2015-08-04 | Western Digital (Fremont), Llc | High contrast alignment marker |
| KR102604742B1 (ko) | 2015-12-23 | 2023-11-22 | 삼성전자주식회사 | 광 소자 및 그 제조 방법 |
| JP6820671B2 (ja) | 2016-06-02 | 2021-01-27 | 富士通株式会社 | 光回路デバイスとこれを用いた光トランシーバ |
| US12471598B2 (en) | 2020-10-07 | 2025-11-18 | Newleaf Symbiotics, Inc. | Methylobacterium strains for enhancing plant production and methods related thereto |
| US12481109B2 (en) * | 2021-01-29 | 2025-11-25 | Kyocera Corporation | Optical circuit board and electronic component mounting structure using the same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3117107B2 (ja) * | 1993-08-03 | 2000-12-11 | シャープ株式会社 | 光集積回路素子の組立構造 |
| JPH09145965A (ja) * | 1995-11-22 | 1997-06-06 | Hitachi Ltd | 光モジュール及びその製造方法 |
| JP2823044B2 (ja) * | 1996-05-14 | 1998-11-11 | 日本電気株式会社 | 光結合回路及びその製造方法 |
| JP2000075153A (ja) * | 1998-08-31 | 2000-03-14 | Fujitsu Ltd | 光学部品付基板及び光学装置の製造方法 |
| JP2000098157A (ja) * | 1998-09-25 | 2000-04-07 | Japan Aviation Electronics Industry Ltd | 光分岐装置およびその製造方法 |
| JP2003517630A (ja) * | 1999-07-16 | 2003-05-27 | ハイブリッド マイクロ テクノロジーズ アンパーツゼルスカブ | Si基板上の能動光学素子および受動光学素子のハイブリッド集積 |
| JP3698601B2 (ja) * | 1999-10-08 | 2005-09-21 | 日本電信電話株式会社 | 光モジュール |
| KR100442609B1 (ko) * | 2002-03-05 | 2004-08-02 | 삼성전자주식회사 | 플립칩 본딩구조 및 본딩방법 |
| KR100456672B1 (ko) * | 2002-03-30 | 2004-11-10 | 한국전자통신연구원 | 광도파로 플랫폼 및 그 제조 방법 |
| KR100427582B1 (ko) * | 2002-08-08 | 2004-04-28 | 한국전자통신연구원 | 광도파로 플랫폼 및 그 제조 방법 |
| JP2004294655A (ja) * | 2003-03-26 | 2004-10-21 | Nec Corp | 光導波路の製造方法 |
| CN1690747A (zh) * | 2004-04-20 | 2005-11-02 | 中国科学院半导体研究所 | 光纤定位槽、光斑转换器和光波导器件的一体化制作方法 |
| JP2007298770A (ja) * | 2006-04-28 | 2007-11-15 | Nec Corp | 光導波路デバイス及びその製造方法 |
-
2006
- 2006-04-17 JP JP2006113349A patent/JP4796884B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-03 TW TW096111742A patent/TW200804883A/zh unknown
- 2007-04-09 US US11/733,044 patent/US7492984B2/en not_active Expired - Fee Related
- 2007-04-11 EP EP07007461.2A patent/EP1847860B1/en active Active
- 2007-04-12 CN CN2007100904839A patent/CN101059586B/zh not_active Expired - Fee Related
-
2009
- 2009-01-02 US US12/348,205 patent/US7778504B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025071897A1 (en) * | 2023-09-25 | 2025-04-03 | Ciena Corporation | Managing co-packaging of photonic integrated circuits |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070274653A1 (en) | 2007-11-29 |
| EP1847860A2 (en) | 2007-10-24 |
| US20090116803A1 (en) | 2009-05-07 |
| CN101059586A (zh) | 2007-10-24 |
| CN101059586B (zh) | 2010-04-07 |
| EP1847860A3 (en) | 2011-11-30 |
| TW200804883A (en) | 2008-01-16 |
| JP2007286340A (ja) | 2007-11-01 |
| US7492984B2 (en) | 2009-02-17 |
| EP1847860B1 (en) | 2013-06-26 |
| US7778504B2 (en) | 2010-08-17 |
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