JP4793169B2 - 接続体および光送受信モジュール - Google Patents

接続体および光送受信モジュール Download PDF

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Publication number
JP4793169B2
JP4793169B2 JP2006227690A JP2006227690A JP4793169B2 JP 4793169 B2 JP4793169 B2 JP 4793169B2 JP 2006227690 A JP2006227690 A JP 2006227690A JP 2006227690 A JP2006227690 A JP 2006227690A JP 4793169 B2 JP4793169 B2 JP 4793169B2
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JP
Japan
Prior art keywords
electrode
substrate
optical
recess
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006227690A
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English (en)
Japanese (ja)
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JP2008053423A5 (https=
JP2008053423A (ja
Inventor
俊明 ▲高▼井
直樹 松嶋
光樹 平野
裕紀 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2006227690A priority Critical patent/JP4793169B2/ja
Priority to CN2007101402327A priority patent/CN101131983B/zh
Priority to US11/834,065 priority patent/US8027553B2/en
Publication of JP2008053423A publication Critical patent/JP2008053423A/ja
Publication of JP2008053423A5 publication Critical patent/JP2008053423A5/ja
Application granted granted Critical
Publication of JP4793169B2 publication Critical patent/JP4793169B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H10W72/07233—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
JP2006227690A 2006-08-24 2006-08-24 接続体および光送受信モジュール Expired - Fee Related JP4793169B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006227690A JP4793169B2 (ja) 2006-08-24 2006-08-24 接続体および光送受信モジュール
CN2007101402327A CN101131983B (zh) 2006-08-24 2007-08-06 连接体和光发送接收模块
US11/834,065 US8027553B2 (en) 2006-08-24 2007-08-06 Connected body and optical transceiver module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006227690A JP4793169B2 (ja) 2006-08-24 2006-08-24 接続体および光送受信モジュール

Publications (3)

Publication Number Publication Date
JP2008053423A JP2008053423A (ja) 2008-03-06
JP2008053423A5 JP2008053423A5 (https=) 2009-01-29
JP4793169B2 true JP4793169B2 (ja) 2011-10-12

Family

ID=39129175

Family Applications (1)

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JP2006227690A Expired - Fee Related JP4793169B2 (ja) 2006-08-24 2006-08-24 接続体および光送受信モジュール

Country Status (3)

Country Link
US (1) US8027553B2 (https=)
JP (1) JP4793169B2 (https=)
CN (1) CN101131983B (https=)

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JP5029193B2 (ja) * 2007-07-31 2012-09-19 日本電気株式会社 光送受信サブアセンブリ、及び光送受信モジュール
JP5276455B2 (ja) * 2009-01-23 2013-08-28 スタンレー電気株式会社 光半導体装置モジュール
WO2011040372A1 (ja) 2009-10-01 2011-04-07 日亜化学工業株式会社 発光装置
KR101199302B1 (ko) 2009-10-13 2012-11-09 한국전자통신연구원 광 소자 및 그 제조 방법
TWI401825B (zh) * 2009-11-27 2013-07-11 財團法人工業技術研究院 發光二極體晶片的固晶方法及固晶完成之發光二極體
KR100999736B1 (ko) * 2010-02-17 2010-12-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 라이트 유닛
JP5664905B2 (ja) * 2011-01-18 2015-02-04 日立金属株式会社 光電変換モジュール
US9417418B2 (en) 2011-09-12 2016-08-16 Commscope Technologies Llc Flexible lensed optical interconnect device for signal distribution
JP6005362B2 (ja) 2012-01-19 2016-10-12 日本航空電子工業株式会社 光モジュール及び光伝送モジュール
JP6107117B2 (ja) 2012-03-22 2017-04-05 豊田合成株式会社 固体装置及びその製造方法
JP5282838B2 (ja) * 2012-08-07 2013-09-04 日立電線株式会社 光電気変換モジュール
IN2015DN02869A (https=) 2012-09-28 2015-09-11 Tyco Electronics Ltd Uk
WO2014052446A1 (en) 2012-09-28 2014-04-03 Tyco Electronics Uk Ltd. Manufacture and testing of fiber optic cassette
US9223094B2 (en) 2012-10-05 2015-12-29 Tyco Electronics Nederland Bv Flexible optical circuit, cassettes, and methods
US9494741B2 (en) * 2012-12-04 2016-11-15 University Of Southampton Apparatus comprising at least one optical device optically coupled to at least one waveguide on an optical chip
WO2014196175A1 (ja) * 2013-06-07 2014-12-11 パナソニックＩｐマネジメント株式会社 配線基板およびｌｅｄモジュール
US9627229B2 (en) * 2013-06-27 2017-04-18 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming trench and disposing semiconductor die over substrate to control outward flow of underfill material
JP5712368B2 (ja) * 2013-09-05 2015-05-07 パナソニックＩｐマネジメント株式会社 発光装置
EP3043395B1 (en) 2013-09-05 2018-11-07 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device
JP6878053B2 (ja) * 2017-03-14 2021-05-26 日本ルメンタム株式会社 光受信モジュール及び光モジュール
EP3692404A4 (en) 2017-10-02 2021-06-16 Commscope Technologies LLC FIBER OPTIC CIRCUIT AND MANUFACTURING METHOD
JP2020178000A (ja) * 2019-04-17 2020-10-29 パナソニックＩｐマネジメント株式会社 光モジュールおよびその製造方法
US12339511B2 (en) 2020-03-31 2025-06-24 Commscope Technologies Llc Fiber optic cable management systems and methods
DE102020126376A1 (de) 2020-10-08 2022-04-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrische kontaktanordnung, verfahren für deren herstellung und diese umfassendes optoelektronisches bauteil
JP7398036B2 (ja) * 2021-06-23 2023-12-14 日亜化学工業株式会社 発光モジュール及びその製造方法
FI20215792A1 (en) * 2021-07-06 2023-01-07 Teknologian Tutkimuskeskus Vtt Oy Connection structure
JP7381937B2 (ja) 2021-12-24 2023-11-16 日亜化学工業株式会社 発光モジュールおよび発光モジュールの製造方法

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JP3414696B2 (ja) 2000-05-12 2003-06-09 日本電気株式会社 半導体装置のキャリア基板の電極構造
JP4105409B2 (ja) * 2001-06-22 2008-06-25 株式会社ルネサステクノロジ マルチチップモジュールの製造方法
JP4104889B2 (ja) 2002-03-29 2008-06-18 株式会社東芝 光半導体装置
JP2004158701A (ja) * 2002-11-07 2004-06-03 Seiko Epson Corp 素子チップ実装用のバンプ構造及びその形成方法
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JP2005164801A (ja) 2003-12-01 2005-06-23 Nippon Telegr & Teleph Corp <Ntt> 光導波路フィルムおよびその作製方法
JP2006091241A (ja) * 2004-09-22 2006-04-06 Hitachi Cable Ltd 光電気複合配線部品及びこれを用いた電子機器
JP4409455B2 (ja) * 2005-01-31 2010-02-03 株式会社ルネサステクノロジ 半導体装置の製造方法

Also Published As

Publication number Publication date
CN101131983B (zh) 2010-12-01
US8027553B2 (en) 2011-09-27
CN101131983A (zh) 2008-02-27
JP2008053423A (ja) 2008-03-06
US20080310854A1 (en) 2008-12-18

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