JP4793169B2 - 接続体および光送受信モジュール - Google Patents

接続体および光送受信モジュール Download PDF

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Publication number
JP4793169B2
JP4793169B2 JP2006227690A JP2006227690A JP4793169B2 JP 4793169 B2 JP4793169 B2 JP 4793169B2 JP 2006227690 A JP2006227690 A JP 2006227690A JP 2006227690 A JP2006227690 A JP 2006227690A JP 4793169 B2 JP4793169 B2 JP 4793169B2
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Japan
Prior art keywords
electrode
substrate
optical
recess
bump
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Expired - Fee Related
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JP2006227690A
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English (en)
Japanese (ja)
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JP2008053423A (ja
JP2008053423A5 (enExample
Inventor
俊明 ▲高▼井
直樹 松嶋
光樹 平野
裕紀 安田
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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Priority to JP2006227690A priority Critical patent/JP4793169B2/ja
Priority to US11/834,065 priority patent/US8027553B2/en
Priority to CN2007101402327A priority patent/CN101131983B/zh
Publication of JP2008053423A publication Critical patent/JP2008053423A/ja
Publication of JP2008053423A5 publication Critical patent/JP2008053423A5/ja
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Publication of JP4793169B2 publication Critical patent/JP4793169B2/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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JP5276455B2 (ja) * 2009-01-23 2013-08-28 スタンレー電気株式会社 光半導体装置モジュール
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KR100999736B1 (ko) * 2010-02-17 2010-12-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 라이트 유닛
JP5664905B2 (ja) * 2011-01-18 2015-02-04 日立金属株式会社 光電変換モジュール
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JP6005362B2 (ja) * 2012-01-19 2016-10-12 日本航空電子工業株式会社 光モジュール及び光伝送モジュール
JP6107117B2 (ja) 2012-03-22 2017-04-05 豊田合成株式会社 固体装置及びその製造方法
JP5282838B2 (ja) * 2012-08-07 2013-09-04 日立電線株式会社 光電気変換モジュール
EP2901192B1 (en) 2012-09-28 2020-04-01 CommScope Connectivity UK Limited Fiber optic cassette
WO2014052446A1 (en) 2012-09-28 2014-04-03 Tyco Electronics Uk Ltd. Manufacture and testing of fiber optic cassette
US9223094B2 (en) 2012-10-05 2015-12-29 Tyco Electronics Nederland Bv Flexible optical circuit, cassettes, and methods
US9494741B2 (en) * 2012-12-04 2016-11-15 University Of Southampton Apparatus comprising at least one optical device optically coupled to at least one waveguide on an optical chip
JP6103401B2 (ja) * 2013-06-07 2017-03-29 パナソニックＩｐマネジメント株式会社 配線基板およびｌｅｄモジュール
US9627229B2 (en) * 2013-06-27 2017-04-18 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming trench and disposing semiconductor die over substrate to control outward flow of underfill material
WO2015033557A1 (ja) 2013-09-05 2015-03-12 パナソニックＩｐマネジメント株式会社 発光装置
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JP6878053B2 (ja) * 2017-03-14 2021-05-26 日本ルメンタム株式会社 光受信モジュール及び光モジュール
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JP2020178000A (ja) * 2019-04-17 2020-10-29 パナソニックＩｐマネジメント株式会社 光モジュールおよびその製造方法
WO2021202700A1 (en) 2020-03-31 2021-10-07 Commscope Technologies Llc Fiber optic cable management systems and methods
DE102020126376A1 (de) 2020-10-08 2022-04-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrische kontaktanordnung, verfahren für deren herstellung und diese umfassendes optoelektronisches bauteil
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