JP4784012B2 - 窒化物半導体基板、及びその製造方法 - Google Patents
窒化物半導体基板、及びその製造方法 Download PDFInfo
- Publication number
- JP4784012B2 JP4784012B2 JP2001228429A JP2001228429A JP4784012B2 JP 4784012 B2 JP4784012 B2 JP 4784012B2 JP 2001228429 A JP2001228429 A JP 2001228429A JP 2001228429 A JP2001228429 A JP 2001228429A JP 4784012 B2 JP4784012 B2 JP 4784012B2
- Authority
- JP
- Japan
- Prior art keywords
- nitride semiconductor
- substrate
- layer
- semiconductor layer
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001228429A JP4784012B2 (ja) | 2001-07-27 | 2001-07-27 | 窒化物半導体基板、及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001228429A JP4784012B2 (ja) | 2001-07-27 | 2001-07-27 | 窒化物半導体基板、及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003045807A JP2003045807A (ja) | 2003-02-14 |
| JP2003045807A5 JP2003045807A5 (enExample) | 2008-09-04 |
| JP4784012B2 true JP4784012B2 (ja) | 2011-09-28 |
Family
ID=19060941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001228429A Expired - Fee Related JP4784012B2 (ja) | 2001-07-27 | 2001-07-27 | 窒化物半導体基板、及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4784012B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4883931B2 (ja) * | 2005-04-26 | 2012-02-22 | 京セラ株式会社 | 半導体積層基板の製造方法 |
| JP5136437B2 (ja) * | 2009-01-23 | 2013-02-06 | 住友電気工業株式会社 | 窒化物系半導体光素子を作製する方法 |
| JP2011114160A (ja) * | 2009-11-26 | 2011-06-09 | Sumitomo Chemical Co Ltd | 半導体基板、電子デバイスおよび半導体基板の製造方法 |
| JP5667360B2 (ja) * | 2009-12-21 | 2015-02-12 | 住友化学株式会社 | 半導体基板、電子デバイスおよび半導体基板の製造方法 |
| JP2014072428A (ja) * | 2012-09-28 | 2014-04-21 | Fujitsu Ltd | 半導体結晶基板の製造方法、半導体装置の製造方法、半導体結晶基板及び半導体装置 |
| JP5685617B2 (ja) * | 2013-03-29 | 2015-03-18 | ▲さん▼圓光電股▲ふん▼有限公司 | 発光ダイオード装置の製造方法 |
| JP2015065465A (ja) * | 2014-12-04 | 2015-04-09 | ▲さん▼圓光電股▲ふん▼有限公司 | 発光ダイオード装置の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754806B2 (ja) * | 1987-01-20 | 1995-06-07 | 日本電信電話株式会社 | 化合物半導体単結晶膜の成長方法 |
| JP2704931B2 (ja) * | 1993-11-19 | 1998-01-26 | 光技術研究開発株式会社 | 選択成長用マスクの形成方法及びその除去方法 |
| JP4301592B2 (ja) * | 1998-01-16 | 2009-07-22 | 三菱マテリアル株式会社 | 窒化物半導体層付き基板の製造方法 |
| JP3791246B2 (ja) * | 1999-06-15 | 2006-06-28 | 日亜化学工業株式会社 | 窒化物半導体の成長方法、及びそれを用いた窒化物半導体素子の製造方法、窒化物半導体レーザ素子の製造方法 |
| JP2001148544A (ja) * | 1999-09-10 | 2001-05-29 | Sharp Corp | 半導体発光素子 |
| JP3427047B2 (ja) * | 1999-09-24 | 2003-07-14 | 三洋電機株式会社 | 窒化物系半導体素子、窒化物系半導体の形成方法および窒化物系半導体素子の製造方法 |
| AU8009500A (en) * | 1999-10-14 | 2001-04-23 | Cree, Inc. | Single step pendeo- and lateral epitaxial overgrowth of group iii-nitride layers |
| JP2001144014A (ja) * | 1999-11-17 | 2001-05-25 | Ngk Insulators Ltd | エピタキシャル成長用基板およびその製造方法 |
-
2001
- 2001-07-27 JP JP2001228429A patent/JP4784012B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003045807A (ja) | 2003-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4288743B2 (ja) | 窒化物半導体の成長方法 | |
| JP3791246B2 (ja) | 窒化物半導体の成長方法、及びそれを用いた窒化物半導体素子の製造方法、窒化物半導体レーザ素子の製造方法 | |
| JP3770014B2 (ja) | 窒化物半導体素子 | |
| JP3436128B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
| JP3988018B2 (ja) | 結晶膜、結晶基板および半導体装置 | |
| JP3659050B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
| JP4304750B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
| JP3491538B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
| JP2000277437A5 (enExample) | ||
| JP2001267242A (ja) | Iii族窒化物系化合物半導体及びその製造方法 | |
| JP2001007447A (ja) | 窒化物半導体レーザ素子 | |
| JP4734786B2 (ja) | 窒化ガリウム系化合物半導体基板、及びその製造方法 | |
| JP3395631B2 (ja) | 窒化物半導体素子及び窒化物半導体素子の製造方法 | |
| JP4106516B2 (ja) | 窒化物半導体基板の成長方法 | |
| JP3678061B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
| JP3925127B2 (ja) | 窒化物半導体基板、及びその成長方法 | |
| JP4165040B2 (ja) | 窒化物半導体基板の製造方法 | |
| JP4211358B2 (ja) | 窒化物半導体、窒化物半導体素子及びそれらの製造方法 | |
| JP2001345282A (ja) | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 | |
| JP2001044570A (ja) | 窒化物半導体レーザ素子 | |
| JP2003045807A (ja) | 窒化物半導体基板、及びその製造方法 | |
| JP4628651B2 (ja) | 窒化物半導体発光素子の製造方法 | |
| JP3906739B2 (ja) | 窒化物半導体基板の製造方法 | |
| JP3870869B2 (ja) | 窒化物半導体基板の製造方法 | |
| JP4304883B2 (ja) | 窒化物半導体レーザダイオード、並びにその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080723 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080723 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110311 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110322 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110523 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110614 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110627 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4784012 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140722 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140722 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |