JP4781961B2 - 電子装置及び照明器具 - Google Patents

電子装置及び照明器具 Download PDF

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Publication number
JP4781961B2
JP4781961B2 JP2006273796A JP2006273796A JP4781961B2 JP 4781961 B2 JP4781961 B2 JP 4781961B2 JP 2006273796 A JP2006273796 A JP 2006273796A JP 2006273796 A JP2006273796 A JP 2006273796A JP 4781961 B2 JP4781961 B2 JP 4781961B2
Authority
JP
Japan
Prior art keywords
heat
solder
case
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006273796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008091817A5 (enrdf_load_stackoverflow
JP2008091817A (ja
Inventor
信一 芝原
典明 奥田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp
Priority to JP2006273796A priority Critical patent/JP4781961B2/ja
Publication of JP2008091817A publication Critical patent/JP2008091817A/ja
Publication of JP2008091817A5 publication Critical patent/JP2008091817A5/ja
Application granted granted Critical
Publication of JP4781961B2 publication Critical patent/JP4781961B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2006273796A 2006-10-05 2006-10-05 電子装置及び照明器具 Expired - Fee Related JP4781961B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006273796A JP4781961B2 (ja) 2006-10-05 2006-10-05 電子装置及び照明器具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006273796A JP4781961B2 (ja) 2006-10-05 2006-10-05 電子装置及び照明器具

Publications (3)

Publication Number Publication Date
JP2008091817A JP2008091817A (ja) 2008-04-17
JP2008091817A5 JP2008091817A5 (enrdf_load_stackoverflow) 2009-11-12
JP4781961B2 true JP4781961B2 (ja) 2011-09-28

Family

ID=39375627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006273796A Expired - Fee Related JP4781961B2 (ja) 2006-10-05 2006-10-05 電子装置及び照明器具

Country Status (1)

Country Link
JP (1) JP4781961B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130099313A (ko) * 2012-02-29 2013-09-06 엘지이노텍 주식회사 조명 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5343542B2 (ja) * 2008-12-08 2013-11-13 三菱電機株式会社 点灯装置及びこの点灯装置を備える照明器具
KR101229656B1 (ko) * 2011-08-24 2013-02-04 김근배 스위칭 모드 파워 서플라이의 방열구조
JP6200693B2 (ja) * 2013-05-24 2017-09-20 日立オートモティブシステムズ株式会社 電子制御装置
JP2013254742A (ja) * 2013-07-30 2013-12-19 Mitsubishi Electric Corp 点灯装置
JP2024078656A (ja) * 2022-11-30 2024-06-11 パナソニックＩｐマネジメント株式会社 照明器具

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2567974B2 (ja) * 1990-06-30 1996-12-25 株式会社テック 放電灯点灯装置
JPH1065385A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 基板ケース構造体
JPH10224065A (ja) * 1997-02-05 1998-08-21 Japan Servo Co Ltd 電子回路の放熱構造
JPH10308484A (ja) * 1997-05-08 1998-11-17 Casio Comput Co Ltd 電子機器の放熱構造
JPH11213737A (ja) * 1998-01-22 1999-08-06 Toshiba Tec Corp 放電灯器具
JP4200876B2 (ja) * 2003-10-28 2008-12-24 株式会社明電舎 電子機器の冷却構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130099313A (ko) * 2012-02-29 2013-09-06 엘지이노텍 주식회사 조명 장치

Also Published As

Publication number Publication date
JP2008091817A (ja) 2008-04-17

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