JP4766180B2 - 接着剤組成物 - Google Patents

接着剤組成物 Download PDF

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Publication number
JP4766180B2
JP4766180B2 JP2010102495A JP2010102495A JP4766180B2 JP 4766180 B2 JP4766180 B2 JP 4766180B2 JP 2010102495 A JP2010102495 A JP 2010102495A JP 2010102495 A JP2010102495 A JP 2010102495A JP 4766180 B2 JP4766180 B2 JP 4766180B2
Authority
JP
Japan
Prior art keywords
adhesive
parts
adhesive composition
mass
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010102495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010285602A (ja
JP2010285602A5 (enExample
Inventor
恵介 大久保
朗 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010102495A priority Critical patent/JP4766180B2/ja
Publication of JP2010285602A publication Critical patent/JP2010285602A/ja
Publication of JP2010285602A5 publication Critical patent/JP2010285602A5/ja
Application granted granted Critical
Publication of JP4766180B2 publication Critical patent/JP4766180B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H10P72/7402—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H10P72/7422—
    • H10P72/7442—
    • H10W72/072—
    • H10W72/07232—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/20—
    • H10W72/241—
    • H10W72/30—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/354—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010102495A 2009-05-13 2010-04-27 接着剤組成物 Expired - Fee Related JP4766180B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010102495A JP4766180B2 (ja) 2009-05-13 2010-04-27 接着剤組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009116699 2009-05-13
JP2009116699 2009-05-13
JP2010102495A JP4766180B2 (ja) 2009-05-13 2010-04-27 接着剤組成物

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2011046809A Division JP2011157552A (ja) 2009-05-13 2011-03-03 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011046921A Division JP4766200B2 (ja) 2009-05-13 2011-03-03 接着剤組成物及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010285602A JP2010285602A (ja) 2010-12-24
JP2010285602A5 JP2010285602A5 (enExample) 2011-04-21
JP4766180B2 true JP4766180B2 (ja) 2011-09-07

Family

ID=43084948

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2010102495A Expired - Fee Related JP4766180B2 (ja) 2009-05-13 2010-04-27 接着剤組成物
JP2011046809A Pending JP2011157552A (ja) 2009-05-13 2011-03-03 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011046921A Expired - Fee Related JP4766200B2 (ja) 2009-05-13 2011-03-03 接着剤組成物及び半導体装置の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2011046809A Pending JP2011157552A (ja) 2009-05-13 2011-03-03 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011046921A Expired - Fee Related JP4766200B2 (ja) 2009-05-13 2011-03-03 接着剤組成物及び半導体装置の製造方法

Country Status (3)

Country Link
JP (3) JP4766180B2 (enExample)
KR (1) KR101136599B1 (enExample)
WO (1) WO2010131575A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577767B (zh) * 2012-04-10 2017-04-11 住友電木股份有限公司 半導體裝置、晶粒黏附材料及半導體裝置之製造方法
KR20150011072A (ko) 2013-07-22 2015-01-30 삼성전자주식회사 임시 접착제 조성물 및 이를 이용한 반도체 소자의 제조 방법
JP6244183B2 (ja) * 2013-11-20 2017-12-06 東京応化工業株式会社 処理方法
KR101649760B1 (ko) * 2015-04-29 2016-08-19 한국신발피혁연구원 내수 및 내열 특성이 우수한 1액형 수성 접착제 조성물의 제조방법 및 이 방법에 의해 제조된 1액형 수성 접착제 조성물
KR101870777B1 (ko) * 2017-03-28 2018-06-26 한국신발피혁연구원 마이크로캡슐형 잠재성 경화제의 제조방법 및 이 방법에 의해 제조된 마이크로캡슐형 잠재성 경화제
JP7031141B2 (ja) * 2017-06-01 2022-03-08 昭和電工マテリアルズ株式会社 半導体加工用テープ
CN113454758B (zh) * 2019-02-25 2024-04-26 三菱电机株式会社 半导体元件的制造方法
CN112552853B (zh) * 2020-12-29 2022-08-02 烟台信友新材料有限公司 一种紫外光引发常温快速固化单组分环氧胶及其制备方法
JP2024047022A (ja) * 2022-09-26 2024-04-05 株式会社レゾナック 半導体装置の製造方法及び半導体ウエハ加工用接着フィルム
JP2024047019A (ja) * 2022-09-26 2024-04-05 株式会社レゾナック 半導体装置の製造方法及び半導体ウエハ加工用接着フィルム
JP2024078062A (ja) * 2022-11-29 2024-06-10 株式会社レゾナック 接着剤フィルム、接着剤テープ、剥離フィルム付き接着剤テープ、半導体装置の製造方法及び半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3900588A1 (de) * 1989-01-11 1990-07-19 Toepholm & Westermann Fernsteuerbares, programmierbares hoergeraetesystem
JPH1135699A (ja) * 1997-07-17 1999-02-09 Toray Ind Inc 湿気硬化樹脂からなる製品の製造方法
JPH11130841A (ja) * 1997-10-29 1999-05-18 Hitachi Chem Co Ltd エポキシ樹脂組成物、接着剤、回路接続用組成物及びこれを用いたフィルム
JP2002145985A (ja) * 2000-11-10 2002-05-22 Toshiba Chem Corp 液状封止用樹脂組成物
JP2002285135A (ja) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びこれを用いた接続構造
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
JP4907840B2 (ja) * 2003-11-12 2012-04-04 日立化成工業株式会社 異方導電フィルム及びこれを用いた回路板
JP2005235530A (ja) 2004-02-18 2005-09-02 Hitachi Chem Co Ltd 回路接続材料
JP4492148B2 (ja) * 2004-02-18 2010-06-30 日立化成工業株式会社 回路接続方法
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
CN102157407B (zh) * 2007-07-11 2014-01-08 日立化成工业株式会社 电路部件连接用粘接剂的使用方法
JP5510911B2 (ja) * 2007-08-17 2014-06-04 株式会社伸興サンライズ 建造物用複合内装塗材
JP4900198B2 (ja) * 2007-11-02 2012-03-21 住友ベークライト株式会社 フラックス機能を有する感光性樹脂組成物
JP5499516B2 (ja) * 2009-05-13 2014-05-21 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
KR20120005550A (ko) 2012-01-16
JP2010285602A (ja) 2010-12-24
JP2011146731A (ja) 2011-07-28
WO2010131575A1 (ja) 2010-11-18
JP4766200B2 (ja) 2011-09-07
KR101136599B1 (ko) 2012-04-18
JP2011157552A (ja) 2011-08-18

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