JP4766180B2 - 接着剤組成物 - Google Patents

接着剤組成物 Download PDF

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Publication number
JP4766180B2
JP4766180B2 JP2010102495A JP2010102495A JP4766180B2 JP 4766180 B2 JP4766180 B2 JP 4766180B2 JP 2010102495 A JP2010102495 A JP 2010102495A JP 2010102495 A JP2010102495 A JP 2010102495A JP 4766180 B2 JP4766180 B2 JP 4766180B2
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Japan
Prior art keywords
adhesive
parts
adhesive composition
mass
film
Prior art date
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Expired - Fee Related
Application number
JP2010102495A
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English (en)
Japanese (ja)
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JP2010285602A (ja
JP2010285602A5 (enExample
Inventor
恵介 大久保
朗 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010102495A priority Critical patent/JP4766180B2/ja
Publication of JP2010285602A publication Critical patent/JP2010285602A/ja
Publication of JP2010285602A5 publication Critical patent/JP2010285602A5/ja
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Publication of JP4766180B2 publication Critical patent/JP4766180B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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DE3900588A1 (de) * 1989-01-11 1990-07-19 Toepholm & Westermann Fernsteuerbares, programmierbares hoergeraetesystem
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JPH11130841A (ja) * 1997-10-29 1999-05-18 Hitachi Chem Co Ltd エポキシ樹脂組成物、接着剤、回路接続用組成物及びこれを用いたフィルム
JP2002145985A (ja) * 2000-11-10 2002-05-22 Toshiba Chem Corp 液状封止用樹脂組成物
JP2002285135A (ja) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びこれを用いた接続構造
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
JP4907840B2 (ja) * 2003-11-12 2012-04-04 日立化成工業株式会社 異方導電フィルム及びこれを用いた回路板
JP4492148B2 (ja) * 2004-02-18 2010-06-30 日立化成工業株式会社 回路接続方法
JP2005235530A (ja) * 2004-02-18 2005-09-02 Hitachi Chem Co Ltd 回路接続材料
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
CN101689518A (zh) * 2007-07-11 2010-03-31 日立化成工业株式会社 电路部件连接用粘接剂
JP5510911B2 (ja) * 2007-08-17 2014-06-04 株式会社伸興サンライズ 建造物用複合内装塗材
JP4900198B2 (ja) * 2007-11-02 2012-03-21 住友ベークライト株式会社 フラックス機能を有する感光性樹脂組成物
JP5499516B2 (ja) * 2009-05-13 2014-05-21 日立化成株式会社 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法

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