JP4760070B2 - 接着剤、回路接続用接着剤、接続体及び半導体装置 - Google Patents

接着剤、回路接続用接着剤、接続体及び半導体装置 Download PDF

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Publication number
JP4760070B2
JP4760070B2 JP2005074999A JP2005074999A JP4760070B2 JP 4760070 B2 JP4760070 B2 JP 4760070B2 JP 2005074999 A JP2005074999 A JP 2005074999A JP 2005074999 A JP2005074999 A JP 2005074999A JP 4760070 B2 JP4760070 B2 JP 4760070B2
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JP
Japan
Prior art keywords
adhesive
weight
meth
general formula
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005074999A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006257208A (ja
Inventor
茂樹 加藤木
弘行 伊澤
貢 藤縄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005074999A priority Critical patent/JP4760070B2/ja
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to KR1020117006892A priority patent/KR101140122B1/ko
Priority to PCT/JP2006/305092 priority patent/WO2006098352A1/ja
Priority to KR1020117006895A priority patent/KR101140095B1/ko
Priority to CN2011102233002A priority patent/CN102391822A/zh
Priority to KR1020107019373A priority patent/KR101081671B1/ko
Priority to KR1020077023601A priority patent/KR101013277B1/ko
Priority to EP11160369A priority patent/EP2357215A1/en
Priority to CN201110222705.4A priority patent/CN102382613B/zh
Priority to CN201210279658.1A priority patent/CN102796486B/zh
Priority to CN2011102205106A priority patent/CN102277123B/zh
Priority to CN201210279675.5A priority patent/CN102796487B/zh
Priority to CN2006800081746A priority patent/CN101142292B/zh
Priority to CN201110222529.4A priority patent/CN102277124B/zh
Priority to CN201210284584.0A priority patent/CN102807836B/zh
Priority to EP06729113A priority patent/EP1860170A4/en
Priority to KR1020117006893A priority patent/KR101140062B1/ko
Priority to CN2012102796789A priority patent/CN102786908B/zh
Priority to US11/908,897 priority patent/US8518303B2/en
Priority to CN2011102224874A priority patent/CN102355793A/zh
Priority to TW100121031A priority patent/TW201202374A/zh
Priority to TW100103469A priority patent/TWI383028B/zh
Priority to TW095109011A priority patent/TW200704738A/zh
Publication of JP2006257208A publication Critical patent/JP2006257208A/ja
Publication of JP4760070B2 publication Critical patent/JP4760070B2/ja
Application granted granted Critical
Priority to US13/494,474 priority patent/US8696942B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2005074999A 2005-03-16 2005-03-16 接着剤、回路接続用接着剤、接続体及び半導体装置 Active JP4760070B2 (ja)

Priority Applications (24)

Application Number Priority Date Filing Date Title
JP2005074999A JP4760070B2 (ja) 2005-03-16 2005-03-16 接着剤、回路接続用接着剤、接続体及び半導体装置
CN201210284584.0A CN102807836B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
KR1020117006895A KR101140095B1 (ko) 2005-03-16 2006-03-15 회로 부재의 접속 구조체 및 회로 접속 부재
CN2011102233002A CN102391822A (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
KR1020107019373A KR101081671B1 (ko) 2005-03-16 2006-03-15 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조체 및 반도체 장치
KR1020077023601A KR101013277B1 (ko) 2005-03-16 2006-03-15 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조체 및 반도체 장치
EP11160369A EP2357215A1 (en) 2005-03-16 2006-03-15 Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device
CN201110222705.4A CN102382613B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
CN201210279658.1A CN102796486B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
CN2011102205106A CN102277123B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
CN201210279675.5A CN102796487B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
CN2006800081746A CN101142292B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
KR1020117006892A KR101140122B1 (ko) 2005-03-16 2006-03-15 필름상 접착제, 회로 부재의 접속 구조체 및 반도체 장치
CN201110222529.4A CN102277124B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
CN2011102224874A CN102355793A (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
KR1020117006893A KR101140062B1 (ko) 2005-03-16 2006-03-15 접착제 조성물, 회로 접속 재료, 회로 부재의 접속 구조체 및 반도체 장치
CN2012102796789A CN102786908B (zh) 2005-03-16 2006-03-15 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
US11/908,897 US8518303B2 (en) 2005-03-16 2006-03-15 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
EP06729113A EP1860170A4 (en) 2005-03-16 2006-03-15 ADHESIVE COMPOSITION, CONNECTION MATERIAL FOR CIRCUITS, CONNECTION STRUCTURE FOR CIRCUIT COMPONENTS, AND SEMICONDUCTOR DEVICE
PCT/JP2006/305092 WO2006098352A1 (ja) 2005-03-16 2006-03-15 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
TW100121031A TW201202374A (en) 2005-03-16 2006-03-16 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
TW100103469A TWI383028B (zh) 2005-03-16 2006-03-16 An adhesive composition, a circuit connection material, a connection structure of a circuit member, and a semiconductor device
TW095109011A TW200704738A (en) 2005-03-16 2006-03-16 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
US13/494,474 US8696942B2 (en) 2005-03-16 2012-06-12 Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005074999A JP4760070B2 (ja) 2005-03-16 2005-03-16 接着剤、回路接続用接着剤、接続体及び半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011063076A Division JP2011157557A (ja) 2011-03-22 2011-03-22 接着剤、回路接続用接着剤、接続体及び半導体装置

Publications (2)

Publication Number Publication Date
JP2006257208A JP2006257208A (ja) 2006-09-28
JP4760070B2 true JP4760070B2 (ja) 2011-08-31

Family

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Family Applications (1)

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JP2005074999A Active JP4760070B2 (ja) 2005-03-16 2005-03-16 接着剤、回路接続用接着剤、接続体及び半導体装置

Country Status (2)

Country Link
JP (1) JP4760070B2 (zh)
CN (1) CN101142292B (zh)

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Publication number Priority date Publication date Assignee Title
KR101140122B1 (ko) 2005-03-16 2012-04-30 히다치 가세고교 가부시끼가이샤 필름상 접착제, 회로 부재의 접속 구조체 및 반도체 장치
JPWO2007046190A1 (ja) * 2005-10-18 2009-04-23 日立化成工業株式会社 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
KR101035810B1 (ko) * 2005-10-18 2011-05-20 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치
JP2008291199A (ja) * 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 回路接続材料およびそれを用いた接続構造体
US20080292801A1 (en) * 2007-05-23 2008-11-27 National Starch And Chemical Investment Holding Corporation Corrosion-Preventive Adhesive Compositions
JP5135564B2 (ja) * 2007-06-12 2013-02-06 デクセリアルズ株式会社 接着剤組成物
JP5456475B2 (ja) * 2007-09-05 2014-03-26 日立化成株式会社 接着剤及びそれを用いた接続構造体
CN101849179B (zh) * 2007-09-13 2013-12-18 3M创新有限公司 低温粘结的电子粘合剂
KR101240009B1 (ko) * 2007-09-19 2013-03-06 히타치가세이가부시끼가이샤 접착제 조성물 및 접합체
JPWO2009128530A1 (ja) * 2008-04-17 2011-08-04 日立化成工業株式会社 接着剤組成物、回路接続用接着剤、接続体、及び半導体装置
JP2010100840A (ja) * 2008-09-24 2010-05-06 Hitachi Chem Co Ltd 接着剤フィルム及び回路接続材料
JP5577635B2 (ja) * 2008-10-09 2014-08-27 日立化成株式会社 接着剤組成物、回路接続用接着剤及び回路接続体
JP2010111847A (ja) * 2008-10-09 2010-05-20 Hitachi Chem Co Ltd 接着剤組成物及び接続体
JP5338753B2 (ja) * 2009-07-17 2013-11-13 日立化成株式会社 接着剤組成物及び接続構造体
CN102791820B (zh) * 2010-03-25 2015-04-29 日立化成株式会社 粘接剂组合物及其用途、以及电路部件的连接结构体及其制造方法
US9822253B2 (en) * 2010-07-05 2017-11-21 Huntsman International Llc Cross-linkable thermoplastic polyurethanes
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
EP2770000B1 (en) * 2011-10-19 2016-05-18 DIC Corporation Active-energy-ray-curable resin composition, adhesive, and laminate film
KR20150005516A (ko) * 2012-04-25 2015-01-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 접속 구조체, 접착 필름 및 권중체
KR102457667B1 (ko) * 2017-02-17 2022-10-20 쇼와덴코머티리얼즈가부시끼가이샤 접착제 필름
TW202124549A (zh) * 2019-12-25 2021-07-01 日商Ｄｉｃ股份有限公司 預浸體及成形品
DE102020107240A1 (de) * 2020-03-17 2021-09-23 Nanowired Gmbh Kompositverbindung zweier Bauteile

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JPH10287718A (ja) * 1997-02-13 1998-10-27 Jsr Corp 光硬化型樹脂組成物
JP2002501556A (ja) * 1998-02-12 2002-01-15 ディーエスエム エヌ．ブイ． 光硬化性樹脂組成物
JP2003513122A (ja) * 1999-10-28 2003-04-08 スリーエム イノベイティブ プロパティズ カンパニー 組成物およびそれらから製造された物品
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JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤

Also Published As

Publication number Publication date
CN101142292A (zh) 2008-03-12
CN101142292B (zh) 2012-09-26
JP2006257208A (ja) 2006-09-28

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