CN102791820B - 粘接剂组合物及其用途、以及电路部件的连接结构体及其制造方法 - Google Patents
粘接剂组合物及其用途、以及电路部件的连接结构体及其制造方法 Download PDFInfo
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- CN102791820B CN102791820B CN201180012858.4A CN201180012858A CN102791820B CN 102791820 B CN102791820 B CN 102791820B CN 201180012858 A CN201180012858 A CN 201180012858A CN 102791820 B CN102791820 B CN 102791820B
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- H01L2224/92—Specific sequence of method steps
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
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- Power Engineering (AREA)
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- Conductive Materials (AREA)
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Abstract
Description
Claims (46)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2010-070544 | 2010-03-25 | ||
JP2010070544 | 2010-03-25 | ||
PCT/JP2011/057208 WO2011118719A1 (ja) | 2010-03-25 | 2011-03-24 | 接着剤組成物及びその使用、並びに、回路部材の接続構造体及びその製造方法 |
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CN102791820A CN102791820A (zh) | 2012-11-21 |
CN102791820B true CN102791820B (zh) | 2015-04-29 |
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JP (1) | JP5594359B2 (zh) |
KR (1) | KR101383933B1 (zh) |
CN (1) | CN102791820B (zh) |
TW (1) | TWI509045B (zh) |
WO (1) | WO2011118719A1 (zh) |
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JP6024261B2 (ja) * | 2012-07-26 | 2016-11-16 | 日立化成株式会社 | 回路接続用接着剤、回路部材の接続構造体及び太陽電池モジュール |
JP6051662B2 (ja) * | 2012-08-03 | 2016-12-27 | 日立化成株式会社 | 回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体 |
JP6061644B2 (ja) * | 2012-09-24 | 2017-01-18 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
CN107636107B (zh) * | 2015-06-10 | 2021-01-05 | 昭和电工材料株式会社 | 粘接剂组合物以及连接体 |
JP6672953B2 (ja) * | 2016-03-29 | 2020-03-25 | 味の素株式会社 | 樹脂シート |
CN109314327B (zh) * | 2016-10-06 | 2022-04-05 | 积水化学工业株式会社 | 导电材料、连接结构体以及连接结构体的制造方法 |
KR102230951B1 (ko) * | 2018-04-17 | 2021-03-23 | 주식회사 엘지화학 | 본딩장치 및 방법 |
JP2021006491A (ja) * | 2019-06-27 | 2021-01-21 | 日東電工株式会社 | Low−Eガラス板、Low−Eガラス板用保護シートおよびその利用 |
JP6946395B2 (ja) * | 2019-10-25 | 2021-10-06 | 日本化学工業株式会社 | 導電性接着剤、それを用いた接着構造体及び電子部品 |
JP7424868B2 (ja) * | 2020-03-06 | 2024-01-30 | 日本航空電子工業株式会社 | 電気接続部材を生産する方法及び配線構造 |
WO2023247213A1 (en) * | 2022-06-24 | 2023-12-28 | Dyconex Ag | Medical device, electronic module and method for producing same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101506321A (zh) * | 2006-08-22 | 2009-08-12 | 日立化成工业株式会社 | 电路连接材料、电路部件的连接结构及电路部件的连接结构的制造方法 |
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JPH10313161A (ja) * | 1997-05-12 | 1998-11-24 | Hitachi Chem Co Ltd | 配線基板 |
JP4259055B2 (ja) * | 2002-07-10 | 2009-04-30 | 株式会社ブリヂストン | 異方性導電フィルム |
JP4259056B2 (ja) * | 2002-07-15 | 2009-04-30 | 株式会社ブリヂストン | 異方性導電フィルム |
JP4461767B2 (ja) * | 2003-10-16 | 2010-05-12 | 株式会社ブリヂストン | 異方性導電フィルム |
JP4760070B2 (ja) * | 2005-03-16 | 2011-08-31 | 日立化成工業株式会社 | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
JP5223679B2 (ja) * | 2006-12-01 | 2013-06-26 | 日立化成株式会社 | 接着剤及びこれを用いた接続構造体 |
JP4428400B2 (ja) * | 2007-05-11 | 2010-03-10 | 日立化成工業株式会社 | 電極の接続構造 |
JP5292838B2 (ja) * | 2007-08-30 | 2013-09-18 | 日立化成株式会社 | 接着剤、及び回路部材の接続構造体 |
JP2009114352A (ja) * | 2007-11-07 | 2009-05-28 | Bridgestone Corp | 接着性樹脂組成物及びそれを用いた接着材料 |
JP2009155387A (ja) * | 2007-12-25 | 2009-07-16 | Bridgestone Corp | 接着性樹脂組成物及びそれを用いた接着材料 |
KR20130006549A (ko) * | 2008-04-17 | 2013-01-16 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 회로 접속용 접착제, 접속체 및 반도체 장치 |
JP5176139B2 (ja) * | 2008-05-12 | 2013-04-03 | 日立化成株式会社 | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP2009277769A (ja) * | 2008-05-13 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
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- 2011-03-24 US US13/637,182 patent/US20130075142A1/en not_active Abandoned
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TWI509045B (zh) | 2015-11-21 |
WO2011118719A1 (ja) | 2011-09-29 |
CN102791820A (zh) | 2012-11-21 |
TW201144397A (en) | 2011-12-16 |
JPWO2011118719A1 (ja) | 2013-07-04 |
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