JP4751827B2 - サブストレートを貯蔵又は輸送するための機器及びそれを用いた方法 - Google Patents
サブストレートを貯蔵又は輸送するための機器及びそれを用いた方法 Download PDFInfo
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- JP4751827B2 JP4751827B2 JP2006519739A JP2006519739A JP4751827B2 JP 4751827 B2 JP4751827 B2 JP 4751827B2 JP 2006519739 A JP2006519739 A JP 2006519739A JP 2006519739 A JP2006519739 A JP 2006519739A JP 4751827 B2 JP4751827 B2 JP 4751827B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
12 積重ね
14 突出部
16 貯蔵手段
20 クリーンエアユニット
30 制御盤
40 ウエハ
50 器具
52 持上げ面
54 持上げ面
80 案内要素
110 カバープレート
111 ボトムプレート
112 アーム
114 開口器具
116 下側つかみ部
117 上側つかみ部
118 溝
119 中央つかみ部
121 サブストレート
122 切断部
123 センタリングドーム
200 輸送容器
210 カバープレート
211 ボトムプレート
Claims (12)
- 電子部品の製造で見受けられるプレート形状のサブストレートを貯蔵するための機器にして、
・当該機器は、積重ね方向に、複数の連続する貯蔵要素を有し、当該貯蔵要素のそれぞれは、少なくとも一つのサブストレートを収容するために設けられ、
・当該貯蔵要素のそれぞれには、連続する貯蔵要素を互いに積重ね方向に配置させるためのリング形状部として構成された積重ね領域と、収容されるサブストレートを支持するための複数の支持要素であって、積重ね領域に接続される支持要素とが設けられ、当該支持要素は、半径方向内側を向いた突出部として構成され、且つ、サブストレートを支持する部位が積重ね領域に対して上方にオフセットされた形状であり、
・連続する複数の貯蔵要素における所定の貯蔵要素と、当該所定の貯蔵要素に隣接する貯蔵要素の上側積重ね部分及び下側積重ね部分との間に増加間隔を作り出し、当該所定の貯蔵要素に収容されたサブストレートにアクセスすることを可能にするための器具であって、当該器具が、少なくとも所定の貯蔵要素と、上側貯蔵要素部分又は下側貯蔵要素部分とに接触して、積重ね方向に動作することにより、当該連続する複数の貯蔵要素を、当該所定の貯蔵要素、上側貯蔵要素部分及び下側貯蔵要素部分に分割する器具が設けられる、
機器。 - 貯蔵要素のリング形状部として構成された積重ね領域を互いに直接積重ねることで、貯蔵要素を互いに直接積重ねることが可能であることを特徴とする請求項1に記載の機器。
- 器具が、隣接する貯蔵要素のそれぞれに接触する第一接触面と第二接触面とを有し、
第一接触面が所定の貯蔵要素の上方で隣接する貯蔵要素に接触して、上側積重ね部分を上方に移動させる際に、第二接触面が所定の貯蔵要素に接触して、当該貯蔵要素を上方に移動させ、当該所定の貯蔵要素に配置されたサブストレートにアクセス可能となることを特徴とする請求項1又は2に記載の機器。 - 器具が、隣接する貯蔵要素のそれぞれに接触する第一接触面と第二接触面とを少なくとも有し、
第一接触面が所定の貯蔵要素の上方又は下方に隣接する貯蔵要素に接触し、第二接触面が所定の貯蔵要素に接触し、第一接触面と第二接触面との少なくとも一方を積重ね方向に相対的に移動させることで、当該所定の貯蔵要素に配置されたサブストレートにアクセス可能となることを特徴とする請求項1又は2に記載の機器。 - 器具の第一接触面と第二接触面とが、貯蔵要素の積重ね方向で互い違いにされることを特徴とする請求項3又は4に記載の機器。
- 貯蔵要素が、内蔵式の貯蔵リングとして具体化されることを特徴とする請求項1〜5のいずれか一項に記載の機器。
- 突出部が、水平方向を向いた接触面を有していることを特徴とする請求項1〜6のいずれか一項に記載の機器。
- 貯蔵要素には、シール要素が設けられ、次々と上に重ねて配置された貯蔵要素が、当該シール要素を用いて、積重ねられた連続する複数の貯蔵要素の積重ねの側方が密閉された側方密閉空間を形成することを特徴とする請求項1〜7のいずれか一項に記載の機器。
- 積重ねられた貯蔵要素の正確な位置調整と安定性増加との少なくとも一方のために貯蔵要素に配置される少なくとも一つのセンタリングドームであって、積重ね方向に隣接する貯蔵要素のセンタリングドームとかみあうセンタリングドームによって特徴付けられる請求項1〜8のいずれか一項に記載の機器。
- 器具が、ディスク形状のサブストレートの面に対して平行な面で移動可能であることを特徴とする請求項1〜9のいずれか一項に記載の機器。
- 積重ねられた貯蔵要素同士をロックしてサブストレートを輸送するための輸送容器となすための機能を更に有することを特徴とする請求項1〜10のいずれか一項に記載の機器。
- 半導体部品の製造のために提供されるディスク形状のサブストレートを請求項1〜11のいずれか一項に記載の機器を用いて取扱うための方法にして、分離可能な貯蔵要素の積重ね内部で特定の貯蔵要素に、二つの接触面を有する器具を近づけるために、第一相対動作は、特定の貯蔵要素が第一接触面と接触させられ、且つ隣接する貯蔵要素が第二接触面と接触させられることで実施され、その後、第二相対動作は、積重ね方向における二つの貯蔵要素間の間隔を、器具を用いて増加させることで実施される方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1219/03 | 2003-07-11 | ||
CH12192003 | 2003-07-11 | ||
CH00237/04A CH717426B1 (de) | 2003-07-11 | 2004-02-16 | Vorrichtung zum Lagern von plattenförmigen Substraten in der Fertigung von elektronischen Bauteilen. |
CH237/04 | 2004-02-16 | ||
PCT/CH2004/000428 WO2005006407A1 (de) | 2003-07-11 | 2004-07-08 | Vorrichtung zum lagern und/oder transportieren von plattenförmigen substraten in der fertigung von elektronischen bauteilen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007529109A JP2007529109A (ja) | 2007-10-18 |
JP4751827B2 true JP4751827B2 (ja) | 2011-08-17 |
Family
ID=34064030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006519739A Expired - Lifetime JP4751827B2 (ja) | 2003-07-11 | 2004-07-08 | サブストレートを貯蔵又は輸送するための機器及びそれを用いた方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7682455B2 (ja) |
EP (1) | EP1644959B1 (ja) |
JP (1) | JP4751827B2 (ja) |
KR (1) | KR101229132B1 (ja) |
WO (1) | WO2005006407A1 (ja) |
Cited By (1)
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JPWO2021044791A1 (ja) * | 2019-09-02 | 2021-03-11 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021044791A1 (ja) * | 2019-09-02 | 2021-03-11 | ||
WO2021044791A1 (ja) | 2019-09-02 | 2021-03-11 | 村田機械株式会社 | ウェハ受渡装置、ウェハ貯蔵容器、及びウェハ貯蔵システム |
JP7156547B2 (ja) | 2019-09-02 | 2022-10-19 | 村田機械株式会社 | ウェハ受渡装置、ウェハ貯蔵容器、及びウェハ貯蔵システム |
US12037193B2 (en) | 2019-09-02 | 2024-07-16 | Murata Machinery, Ltd. | Wafer delivery device, wafer storage container, and wafer storage system |
Also Published As
Publication number | Publication date |
---|---|
KR101229132B1 (ko) | 2013-02-01 |
EP1644959B1 (de) | 2013-09-11 |
WO2005006407A1 (de) | 2005-01-20 |
JP2007529109A (ja) | 2007-10-18 |
EP1644959A1 (de) | 2006-04-12 |
US20060151404A1 (en) | 2006-07-13 |
US7682455B2 (en) | 2010-03-23 |
KR20060058676A (ko) | 2006-05-30 |
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