JP4749801B2 - イオン交換樹脂を備えた切削装置 - Google Patents
イオン交換樹脂を備えた切削装置 Download PDFInfo
- Publication number
- JP4749801B2 JP4749801B2 JP2005239503A JP2005239503A JP4749801B2 JP 4749801 B2 JP4749801 B2 JP 4749801B2 JP 2005239503 A JP2005239503 A JP 2005239503A JP 2005239503 A JP2005239503 A JP 2005239503A JP 4749801 B2 JP4749801 B2 JP 4749801B2
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- JP
- Japan
- Prior art keywords
- cutting
- water
- exchange resin
- blade
- ion exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 title claims description 22
- 239000003456 ion exchange resin Substances 0.000 title claims description 21
- 229920003303 ion-exchange polymer Polymers 0.000 title claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 78
- 150000001450 anions Chemical class 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 4
- 239000003957 anion exchange resin Substances 0.000 claims description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000005323 electroforming Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- -1 Cl − Chemical class 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Treatment Of Water By Ion Exchange (AREA)
- Dicing (AREA)
Description
(条件2):図2の構成で、イオン交換樹脂を通した市水を切削水として使用。
2:チャックテーブル
3:切削手段
30:ハウジング 31:スピンドル
32:切削ブレード 33:ナット
32a:切り刃部 32b:母体金属
34:ブレードカバー 35:ノズル 36,37:切削水流入口
38:イオン交換樹脂 39:水源
4:ウェーハカセット 5:搬出入手段 6:仮置き領域 7:搬送手段
8:アライメント手段
80:撮像部
Claims (3)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削する切削ブレードを含む切削手段と、該切削ブレードと該被加工物とに切削水を吐出するノズルを含む切削水供給手段とを少なくとも備えた切削装置であって、
該切削水供給手段は、切削水を蓄える水源と該ノズルとの間にイオン交換樹脂を介在させ、該水源から流出する切削水が該イオン交換樹脂を介して該ノズルに供給される構成とし、
該水源に蓄えられた切削水は市水であり、
該切削ブレードは、電気メッキにより砥粒を金属によって固めて形成された切り刃部を有する電鋳ブレードである
切削装置。 - 前記イオン交換樹脂は、前記切削水に含まれる陰イオンを炭酸イオンに交換する陰イオン交換樹脂である請求項1に記載の切削装置。
- 前記陰イオンは塩化物イオンである請求項2に記載の切削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005239503A JP4749801B2 (ja) | 2005-08-22 | 2005-08-22 | イオン交換樹脂を備えた切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005239503A JP4749801B2 (ja) | 2005-08-22 | 2005-08-22 | イオン交換樹脂を備えた切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007059432A JP2007059432A (ja) | 2007-03-08 |
JP4749801B2 true JP4749801B2 (ja) | 2011-08-17 |
Family
ID=37922690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005239503A Active JP4749801B2 (ja) | 2005-08-22 | 2005-08-22 | イオン交換樹脂を備えた切削装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4749801B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6170404B2 (ja) * | 2013-10-24 | 2017-07-26 | 株式会社ディスコ | 切削装置 |
JP2019217568A (ja) * | 2018-06-15 | 2019-12-26 | 株式会社ディスコ | 加工方法及び加工システム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09111482A (ja) * | 1995-10-19 | 1997-04-28 | Kurita Water Ind Ltd | 水系の金属の腐食防止方法 |
JP4107528B2 (ja) * | 1998-11-30 | 2008-06-25 | 株式会社ディスコ | 加工水コントロールシステム |
JP2002119964A (ja) * | 2000-10-13 | 2002-04-23 | Enzan Seisakusho:Kk | 半導体製造工程における排水循環システム |
JP2002151444A (ja) * | 2000-11-14 | 2002-05-24 | Disco Abrasive Syst Ltd | 切削ブレードのプリカット方法 |
JP3797884B2 (ja) * | 2001-03-30 | 2006-07-19 | 独立行政法人科学技術振興機構 | 水中での鉄系金属の防食方法 |
JP2005129830A (ja) * | 2003-10-27 | 2005-05-19 | Tokyo Seimitsu Co Ltd | ダイシング方法 |
-
2005
- 2005-08-22 JP JP2005239503A patent/JP4749801B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2007059432A (ja) | 2007-03-08 |
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