JP4746814B2 - 集積回路を製造するための装置および方法 - Google Patents
集積回路を製造するための装置および方法 Download PDFInfo
- Publication number
- JP4746814B2 JP4746814B2 JP2002292236A JP2002292236A JP4746814B2 JP 4746814 B2 JP4746814 B2 JP 4746814B2 JP 2002292236 A JP2002292236 A JP 2002292236A JP 2002292236 A JP2002292236 A JP 2002292236A JP 4746814 B2 JP4746814 B2 JP 4746814B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- region
- integrated circuit
- slot
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 25
- 239000012530 fluid Substances 0.000 claims description 12
- 229910052715 tantalum Inorganic materials 0.000 claims description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 139
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 46
- 229910052710 silicon Inorganic materials 0.000 description 46
- 239000010703 silicon Substances 0.000 description 46
- 239000000758 substrate Substances 0.000 description 33
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 28
- 229920005591 polysilicon Polymers 0.000 description 23
- 238000010304 firing Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 16
- 239000004020 conductor Substances 0.000 description 14
- 238000005553 drilling Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 8
- 230000032798 delamination Effects 0.000 description 8
- 230000000873 masking effect Effects 0.000 description 8
- 238000002161 passivation Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- VRZFDJOWKAFVOO-UHFFFAOYSA-N [O-][Si]([O-])([O-])O.[B+3].P Chemical compound [O-][Si]([O-])([O-])O.[B+3].P VRZFDJOWKAFVOO-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000005445 natural material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Facsimile Heads (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/055161 | 2001-10-26 | ||
| US10/055,161 US6740536B2 (en) | 2001-10-26 | 2001-10-26 | Devices and methods for integrated circuit manufacturing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003218353A JP2003218353A (ja) | 2003-07-31 |
| JP2003218353A5 JP2003218353A5 (enExample) | 2005-11-17 |
| JP4746814B2 true JP4746814B2 (ja) | 2011-08-10 |
Family
ID=21996024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002292236A Expired - Lifetime JP4746814B2 (ja) | 2001-10-26 | 2002-10-04 | 集積回路を製造するための装置および方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6740536B2 (enExample) |
| EP (1) | EP1306214B1 (enExample) |
| JP (1) | JP4746814B2 (enExample) |
| KR (1) | KR100962888B1 (enExample) |
| CN (2) | CN1442901B (enExample) |
| DE (1) | DE60231462D1 (enExample) |
| TW (2) | TWI324813B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003224269A (ja) * | 2001-10-26 | 2003-08-08 | Hewlett Packard Co <Hp> | 集積回路を製造するための装置および方法 |
| US6740536B2 (en) * | 2001-10-26 | 2004-05-25 | Hewlett-Packard Develpment Corporation, L.P. | Devices and methods for integrated circuit manufacturing |
| US20050236358A1 (en) * | 2004-04-26 | 2005-10-27 | Shen Buswell | Micromachining methods and systems |
| US7767103B2 (en) * | 2004-09-14 | 2010-08-03 | Lexmark International, Inc. | Micro-fluid ejection assemblies |
| US7150516B2 (en) * | 2004-09-28 | 2006-12-19 | Hewlett-Packard Development Company, L.P. | Integrated circuit and method for manufacturing |
| US8029105B2 (en) | 2007-10-17 | 2011-10-04 | Eastman Kodak Company | Ambient plasma treatment of printer components |
| PT2229279E (pt) | 2007-12-02 | 2012-07-25 | Hewlett Packard Development Co | Redes terrestres de matriz de cabeça de impressão electricamente ligadas e electricamente isoladas como circuito flexível |
| JP5777762B2 (ja) * | 2014-03-20 | 2015-09-09 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 電気的に絶縁されるプリントヘッドダイ接地ネットワークをフレキシブル回路で電気的に接続する方法 |
| US10569544B2 (en) | 2016-07-12 | 2020-02-25 | Hewlett-Packard Development Company, L.P. | Multi-layered nozzle fluid ejection device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| ATE144194T1 (de) * | 1991-08-01 | 1996-11-15 | Canon Kk | Aufzeichnungskopfherstellungsverfahren |
| US6406740B1 (en) | 1992-06-23 | 2002-06-18 | Canon Kabushiki Kaisha | Method of manufacturing a liquid jet recording apparatus and such a liquid jet recording apparatus |
| US5448273A (en) | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
| JP2909796B2 (ja) * | 1993-12-28 | 1999-06-23 | ローム株式会社 | サーマルプリントヘッドおよびその製造方法 |
| JP3380836B2 (ja) * | 1995-07-04 | 2003-02-24 | 松下電器産業株式会社 | Mis半導体装置及びその製造方法 |
| US5903031A (en) * | 1995-07-04 | 1999-05-11 | Matsushita Electric Industrial Co., Ltd. | MIS device, method of manufacturing the same, and method of diagnosing the same |
| JP3315321B2 (ja) * | 1996-08-29 | 2002-08-19 | 株式会社東芝 | 半導体装置とその製造方法および不揮発性半導体記憶装置とその製造方法 |
| GB9622177D0 (en) * | 1996-10-24 | 1996-12-18 | Xaar Ltd | Passivation of ink jet print heads |
| US6290337B1 (en) | 1996-10-31 | 2001-09-18 | Hewlett-Packard Company | Print head for ink-jet printing and a method for making print heads |
| JPH1126757A (ja) * | 1997-06-30 | 1999-01-29 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6284147B1 (en) | 1997-07-15 | 2001-09-04 | Silverbrook Research Pty Ltd | Method of manufacture of a stacked electrostatic ink jet printer |
| US6286939B1 (en) | 1997-09-26 | 2001-09-11 | Hewlett-Packard Company | Method of treating a metal surface to increase polymer adhesion |
| US6039438A (en) | 1997-10-21 | 2000-03-21 | Hewlett-Packard Company | Limiting propagation of thin film failures in an inkjet printhead |
| US6106096A (en) * | 1997-12-15 | 2000-08-22 | Lexmark International, Inc. | Printhead stress relief |
| US6474780B1 (en) * | 1998-04-16 | 2002-11-05 | Canon Kabushiki Kaisha | Liquid discharge head, cartridge having such head, liquid discharge apparatus provided with such cartridge, and method for manufacturing liquid discharge heads |
| US5998288A (en) * | 1998-04-17 | 1999-12-07 | Advanced Micro Devices, Inc. | Ultra thin spacers formed laterally adjacent a gate conductor recessed below the upper surface of a substrate |
| JP2002261277A (ja) * | 2001-03-06 | 2002-09-13 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6740536B2 (en) * | 2001-10-26 | 2004-05-25 | Hewlett-Packard Develpment Corporation, L.P. | Devices and methods for integrated circuit manufacturing |
-
2001
- 2001-10-26 US US10/055,161 patent/US6740536B2/en not_active Expired - Fee Related
-
2002
- 2002-10-04 JP JP2002292236A patent/JP4746814B2/ja not_active Expired - Lifetime
- 2002-10-25 KR KR1020020065410A patent/KR100962888B1/ko not_active Expired - Lifetime
- 2002-10-25 CN CN021470529A patent/CN1442901B/zh not_active Expired - Lifetime
- 2002-10-25 TW TW096133040A patent/TWI324813B/zh not_active IP Right Cessation
- 2002-10-25 US US10/280,414 patent/US7004558B2/en not_active Expired - Lifetime
- 2002-10-25 TW TW091125139A patent/TWI315904B/zh not_active IP Right Cessation
- 2002-10-25 EP EP02023965A patent/EP1306214B1/en not_active Expired - Lifetime
- 2002-10-25 DE DE60231462T patent/DE60231462D1/de not_active Expired - Lifetime
- 2002-10-25 CN CN2007101616152A patent/CN101444993B/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1442901A (zh) | 2003-09-17 |
| KR100962888B1 (ko) | 2010-06-10 |
| TW200802716A (en) | 2008-01-01 |
| TWI324813B (en) | 2010-05-11 |
| TWI315904B (en) | 2009-10-11 |
| EP1306214A3 (en) | 2004-03-03 |
| CN101444993A (zh) | 2009-06-03 |
| EP1306214B1 (en) | 2009-03-11 |
| US20030080362A1 (en) | 2003-05-01 |
| JP2003218353A (ja) | 2003-07-31 |
| CN1442901B (zh) | 2012-05-09 |
| DE60231462D1 (de) | 2009-04-23 |
| US7004558B2 (en) | 2006-02-28 |
| EP1306214A2 (en) | 2003-05-02 |
| US6740536B2 (en) | 2004-05-25 |
| CN101444993B (zh) | 2011-04-13 |
| US20030207477A1 (en) | 2003-11-06 |
| KR20030035950A (ko) | 2003-05-09 |
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