JP2003218353A5 - - Google Patents
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- Publication number
- JP2003218353A5 JP2003218353A5 JP2002292236A JP2002292236A JP2003218353A5 JP 2003218353 A5 JP2003218353 A5 JP 2003218353A5 JP 2002292236 A JP2002292236 A JP 2002292236A JP 2002292236 A JP2002292236 A JP 2002292236A JP 2003218353 A5 JP2003218353 A5 JP 2003218353A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/055161 | 2001-10-26 | ||
| US10/055,161 US6740536B2 (en) | 2001-10-26 | 2001-10-26 | Devices and methods for integrated circuit manufacturing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003218353A JP2003218353A (ja) | 2003-07-31 |
| JP2003218353A5 true JP2003218353A5 (enExample) | 2005-11-17 |
| JP4746814B2 JP4746814B2 (ja) | 2011-08-10 |
Family
ID=21996024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002292236A Expired - Lifetime JP4746814B2 (ja) | 2001-10-26 | 2002-10-04 | 集積回路を製造するための装置および方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6740536B2 (enExample) |
| EP (1) | EP1306214B1 (enExample) |
| JP (1) | JP4746814B2 (enExample) |
| KR (1) | KR100962888B1 (enExample) |
| CN (2) | CN1442901B (enExample) |
| DE (1) | DE60231462D1 (enExample) |
| TW (2) | TWI324813B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003224269A (ja) * | 2001-10-26 | 2003-08-08 | Hewlett Packard Co <Hp> | 集積回路を製造するための装置および方法 |
| US6740536B2 (en) * | 2001-10-26 | 2004-05-25 | Hewlett-Packard Develpment Corporation, L.P. | Devices and methods for integrated circuit manufacturing |
| US20050236358A1 (en) * | 2004-04-26 | 2005-10-27 | Shen Buswell | Micromachining methods and systems |
| US7767103B2 (en) * | 2004-09-14 | 2010-08-03 | Lexmark International, Inc. | Micro-fluid ejection assemblies |
| US7150516B2 (en) * | 2004-09-28 | 2006-12-19 | Hewlett-Packard Development Company, L.P. | Integrated circuit and method for manufacturing |
| US8029105B2 (en) | 2007-10-17 | 2011-10-04 | Eastman Kodak Company | Ambient plasma treatment of printer components |
| PT2229279E (pt) | 2007-12-02 | 2012-07-25 | Hewlett Packard Development Co | Redes terrestres de matriz de cabeça de impressão electricamente ligadas e electricamente isoladas como circuito flexível |
| JP5777762B2 (ja) * | 2014-03-20 | 2015-09-09 | ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． | 電気的に絶縁されるプリントヘッドダイ接地ネットワークをフレキシブル回路で電気的に接続する方法 |
| US10569544B2 (en) | 2016-07-12 | 2020-02-25 | Hewlett-Packard Development Company, L.P. | Multi-layered nozzle fluid ejection device |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| ATE144194T1 (de) * | 1991-08-01 | 1996-11-15 | Canon Kk | Aufzeichnungskopfherstellungsverfahren |
| US6406740B1 (en) | 1992-06-23 | 2002-06-18 | Canon Kabushiki Kaisha | Method of manufacturing a liquid jet recording apparatus and such a liquid jet recording apparatus |
| US5448273A (en) | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
| JP2909796B2 (ja) * | 1993-12-28 | 1999-06-23 | ローム株式会社 | サーマルプリントヘッドおよびその製造方法 |
| JP3380836B2 (ja) * | 1995-07-04 | 2003-02-24 | 松下電器産業株式会社 | Ｍｉｓ半導体装置及びその製造方法 |
| US5903031A (en) * | 1995-07-04 | 1999-05-11 | Matsushita Electric Industrial Co., Ltd. | MIS device, method of manufacturing the same, and method of diagnosing the same |
| JP3315321B2 (ja) * | 1996-08-29 | 2002-08-19 | 株式会社東芝 | 半導体装置とその製造方法および不揮発性半導体記憶装置とその製造方法 |
| GB9622177D0 (en) * | 1996-10-24 | 1996-12-18 | Xaar Ltd | Passivation of ink jet print heads |
| US6290337B1 (en) | 1996-10-31 | 2001-09-18 | Hewlett-Packard Company | Print head for ink-jet printing and a method for making print heads |
| JPH1126757A (ja) * | 1997-06-30 | 1999-01-29 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6284147B1 (en) | 1997-07-15 | 2001-09-04 | Silverbrook Research Pty Ltd | Method of manufacture of a stacked electrostatic ink jet printer |
| US6286939B1 (en) | 1997-09-26 | 2001-09-11 | Hewlett-Packard Company | Method of treating a metal surface to increase polymer adhesion |
| US6039438A (en) | 1997-10-21 | 2000-03-21 | Hewlett-Packard Company | Limiting propagation of thin film failures in an inkjet printhead |
| US6106096A (en) * | 1997-12-15 | 2000-08-22 | Lexmark International, Inc. | Printhead stress relief |
| US6474780B1 (en) * | 1998-04-16 | 2002-11-05 | Canon Kabushiki Kaisha | Liquid discharge head, cartridge having such head, liquid discharge apparatus provided with such cartridge, and method for manufacturing liquid discharge heads |
| US5998288A (en) * | 1998-04-17 | 1999-12-07 | Advanced Micro Devices, Inc. | Ultra thin spacers formed laterally adjacent a gate conductor recessed below the upper surface of a substrate |
| JP2002261277A (ja) * | 2001-03-06 | 2002-09-13 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6740536B2 (en) * | 2001-10-26 | 2004-05-25 | Hewlett-Packard Develpment Corporation, L.P. | Devices and methods for integrated circuit manufacturing |
-
2001
- 2001-10-26 US US10/055,161 patent/US6740536B2/en not_active Expired - Fee Related
-
2002
- 2002-10-04 JP JP2002292236A patent/JP4746814B2/ja not_active Expired - Lifetime
- 2002-10-25 KR KR1020020065410A patent/KR100962888B1/ko not_active Expired - Lifetime
- 2002-10-25 CN CN021470529A patent/CN1442901B/zh not_active Expired - Lifetime
- 2002-10-25 TW TW096133040A patent/TWI324813B/zh not_active IP Right Cessation
- 2002-10-25 US US10/280,414 patent/US7004558B2/en not_active Expired - Lifetime
- 2002-10-25 TW TW091125139A patent/TWI315904B/zh not_active IP Right Cessation
- 2002-10-25 EP EP02023965A patent/EP1306214B1/en not_active Expired - Lifetime
- 2002-10-25 DE DE60231462T patent/DE60231462D1/de not_active Expired - Lifetime
- 2002-10-25 CN CN2007101616152A patent/CN101444993B/zh not_active Expired - Lifetime