CN101444993B - 一种打印头和喷墨打印盒 - Google Patents
一种打印头和喷墨打印盒 Download PDFInfo
- Publication number
- CN101444993B CN101444993B CN2007101616152A CN200710161615A CN101444993B CN 101444993 B CN101444993 B CN 101444993B CN 2007101616152 A CN2007101616152 A CN 2007101616152A CN 200710161615 A CN200710161615 A CN 200710161615A CN 101444993 B CN101444993 B CN 101444993B
- Authority
- CN
- China
- Prior art keywords
- layer
- printhead
- district
- ink
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007639 printing Methods 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 33
- 230000008569 process Effects 0.000 claims description 21
- 230000010354 integration Effects 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000000694 effects Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 35
- 229910052710 silicon Inorganic materials 0.000 description 35
- 239000010703 silicon Substances 0.000 description 35
- 239000000758 substrate Substances 0.000 description 32
- 238000005530 etching Methods 0.000 description 28
- 239000000976 ink Substances 0.000 description 25
- 239000000463 material Substances 0.000 description 16
- 229920005591 polysilicon Polymers 0.000 description 13
- 230000004888 barrier function Effects 0.000 description 12
- 230000005611 electricity Effects 0.000 description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 11
- 230000032798 delamination Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 238000002161 passivation Methods 0.000 description 7
- 241001074085 Scophthalmus aquosus Species 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000012010 growth Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000003487 electrochemical reaction Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000005445 natural material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000013138 pruning Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/13—Heads having an integrated circuit
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Facsimile Heads (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/055,161 US6740536B2 (en) | 2001-10-26 | 2001-10-26 | Devices and methods for integrated circuit manufacturing |
| US10/055161 | 2002-10-25 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN021470529A Division CN1442901B (zh) | 2001-10-26 | 2002-10-25 | 器件和制造集成电路的方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101444993A CN101444993A (zh) | 2009-06-03 |
| CN101444993B true CN101444993B (zh) | 2011-04-13 |
Family
ID=21996024
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101616152A Expired - Lifetime CN101444993B (zh) | 2001-10-26 | 2002-10-25 | 一种打印头和喷墨打印盒 |
| CN021470529A Expired - Lifetime CN1442901B (zh) | 2001-10-26 | 2002-10-25 | 器件和制造集成电路的方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN021470529A Expired - Lifetime CN1442901B (zh) | 2001-10-26 | 2002-10-25 | 器件和制造集成电路的方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6740536B2 (enExample) |
| EP (1) | EP1306214B1 (enExample) |
| JP (1) | JP4746814B2 (enExample) |
| KR (1) | KR100962888B1 (enExample) |
| CN (2) | CN101444993B (enExample) |
| DE (1) | DE60231462D1 (enExample) |
| TW (2) | TWI315904B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6740536B2 (en) * | 2001-10-26 | 2004-05-25 | Hewlett-Packard Develpment Corporation, L.P. | Devices and methods for integrated circuit manufacturing |
| JP2003224269A (ja) * | 2001-10-26 | 2003-08-08 | Hewlett Packard Co <Hp> | 集積回路を製造するための装置および方法 |
| US20050236358A1 (en) * | 2004-04-26 | 2005-10-27 | Shen Buswell | Micromachining methods and systems |
| US7767103B2 (en) * | 2004-09-14 | 2010-08-03 | Lexmark International, Inc. | Micro-fluid ejection assemblies |
| US7150516B2 (en) * | 2004-09-28 | 2006-12-19 | Hewlett-Packard Development Company, L.P. | Integrated circuit and method for manufacturing |
| US8029105B2 (en) | 2007-10-17 | 2011-10-04 | Eastman Kodak Company | Ambient plasma treatment of printer components |
| CN101883683B (zh) | 2007-12-02 | 2012-06-20 | 惠普开发有限公司 | 喷墨打印设备的打印头组件、其制造方法及喷墨打印设备 |
| JP5777762B2 (ja) * | 2014-03-20 | 2015-09-09 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 電気的に絶縁されるプリントヘッドダイ接地ネットワークをフレキシブル回路で電気的に接続する方法 |
| US10569544B2 (en) | 2016-07-12 | 2020-02-25 | Hewlett-Packard Development Company, L.P. | Multi-layered nozzle fluid ejection device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1114613A (zh) * | 1993-12-28 | 1996-01-10 | 罗姆股份有限公司 | 热敏打印头 |
| CN1229727A (zh) * | 1997-12-15 | 1999-09-29 | 莱克斯马克国际公司 | 可减小应力的打印头及其制造方法 |
| EP0950524A2 (en) * | 1998-04-16 | 1999-10-20 | Canon Kabushiki Kaisha | Improved liquid discharge head, cartridge having such head, liquid discharge apparatus provided with such cartridge, and method for manufacturing liquid discharge heads |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719477A (en) * | 1986-01-17 | 1988-01-12 | Hewlett-Packard Company | Integrated thermal ink jet printhead and method of manufacture |
| EP0525787B1 (en) * | 1991-08-01 | 1996-10-16 | Canon Kabushiki Kaisha | Method for manufacturing a recording head |
| US6406740B1 (en) | 1992-06-23 | 2002-06-18 | Canon Kabushiki Kaisha | Method of manufacturing a liquid jet recording apparatus and such a liquid jet recording apparatus |
| US5448273A (en) | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
| KR970008496A (ko) * | 1995-07-04 | 1997-02-24 | 모리시다 요이치 | Mis 반도체 장치와 그 제조방법 및 그 진단방법 |
| JP3380836B2 (ja) * | 1995-07-04 | 2003-02-24 | 松下電器産業株式会社 | Mis半導体装置及びその製造方法 |
| JP3315321B2 (ja) * | 1996-08-29 | 2002-08-19 | 株式会社東芝 | 半導体装置とその製造方法および不揮発性半導体記憶装置とその製造方法 |
| GB9622177D0 (en) * | 1996-10-24 | 1996-12-18 | Xaar Ltd | Passivation of ink jet print heads |
| US6290337B1 (en) | 1996-10-31 | 2001-09-18 | Hewlett-Packard Company | Print head for ink-jet printing and a method for making print heads |
| JPH1126757A (ja) * | 1997-06-30 | 1999-01-29 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6284147B1 (en) | 1997-07-15 | 2001-09-04 | Silverbrook Research Pty Ltd | Method of manufacture of a stacked electrostatic ink jet printer |
| US6286939B1 (en) | 1997-09-26 | 2001-09-11 | Hewlett-Packard Company | Method of treating a metal surface to increase polymer adhesion |
| US6039438A (en) | 1997-10-21 | 2000-03-21 | Hewlett-Packard Company | Limiting propagation of thin film failures in an inkjet printhead |
| US5998288A (en) * | 1998-04-17 | 1999-12-07 | Advanced Micro Devices, Inc. | Ultra thin spacers formed laterally adjacent a gate conductor recessed below the upper surface of a substrate |
| JP2002261277A (ja) * | 2001-03-06 | 2002-09-13 | Toshiba Corp | 半導体装置及びその製造方法 |
| US6740536B2 (en) * | 2001-10-26 | 2004-05-25 | Hewlett-Packard Develpment Corporation, L.P. | Devices and methods for integrated circuit manufacturing |
-
2001
- 2001-10-26 US US10/055,161 patent/US6740536B2/en not_active Expired - Fee Related
-
2002
- 2002-10-04 JP JP2002292236A patent/JP4746814B2/ja not_active Expired - Lifetime
- 2002-10-25 US US10/280,414 patent/US7004558B2/en not_active Expired - Lifetime
- 2002-10-25 CN CN2007101616152A patent/CN101444993B/zh not_active Expired - Lifetime
- 2002-10-25 TW TW091125139A patent/TWI315904B/zh not_active IP Right Cessation
- 2002-10-25 CN CN021470529A patent/CN1442901B/zh not_active Expired - Lifetime
- 2002-10-25 KR KR1020020065410A patent/KR100962888B1/ko not_active Expired - Lifetime
- 2002-10-25 DE DE60231462T patent/DE60231462D1/de not_active Expired - Lifetime
- 2002-10-25 TW TW096133040A patent/TWI324813B/zh not_active IP Right Cessation
- 2002-10-25 EP EP02023965A patent/EP1306214B1/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1114613A (zh) * | 1993-12-28 | 1996-01-10 | 罗姆股份有限公司 | 热敏打印头 |
| CN1229727A (zh) * | 1997-12-15 | 1999-09-29 | 莱克斯马克国际公司 | 可减小应力的打印头及其制造方法 |
| EP0950524A2 (en) * | 1998-04-16 | 1999-10-20 | Canon Kabushiki Kaisha | Improved liquid discharge head, cartridge having such head, liquid discharge apparatus provided with such cartridge, and method for manufacturing liquid discharge heads |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI315904B (en) | 2009-10-11 |
| EP1306214A2 (en) | 2003-05-02 |
| KR100962888B1 (ko) | 2010-06-10 |
| US20030207477A1 (en) | 2003-11-06 |
| JP2003218353A (ja) | 2003-07-31 |
| CN1442901A (zh) | 2003-09-17 |
| CN101444993A (zh) | 2009-06-03 |
| EP1306214A3 (en) | 2004-03-03 |
| EP1306214B1 (en) | 2009-03-11 |
| DE60231462D1 (de) | 2009-04-23 |
| TWI324813B (en) | 2010-05-11 |
| US7004558B2 (en) | 2006-02-28 |
| TW200802716A (en) | 2008-01-01 |
| JP4746814B2 (ja) | 2011-08-10 |
| US6740536B2 (en) | 2004-05-25 |
| US20030080362A1 (en) | 2003-05-01 |
| KR20030035950A (ko) | 2003-05-09 |
| CN1442901B (zh) | 2012-05-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110413 |