KR100962888B1 - 다층 집적 회로, 유체 분출 장치, 프린트 헤드, 잉크젯 프린트 카트리지, 슬롯 피드 프린트 헤드, 다층 집적 회로 제조 공정 및 캐비테이션층의 층분리 억제 방법 - Google Patents

다층 집적 회로, 유체 분출 장치, 프린트 헤드, 잉크젯 프린트 카트리지, 슬롯 피드 프린트 헤드, 다층 집적 회로 제조 공정 및 캐비테이션층의 층분리 억제 방법 Download PDF

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KR100962888B1
KR100962888B1 KR1020020065410A KR20020065410A KR100962888B1 KR 100962888 B1 KR100962888 B1 KR 100962888B1 KR 1020020065410 A KR1020020065410 A KR 1020020065410A KR 20020065410 A KR20020065410 A KR 20020065410A KR 100962888 B1 KR100962888 B1 KR 100962888B1
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South Korea
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layer
integrated circuit
multilayer integrated
semiconductor region
region
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English (en)
Korean (ko)
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KR20030035950A (ko
Inventor
도드시몬
브라이언트프랭크랜돌프
미클란폴아이
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휴렛-팩커드 컴퍼니(델라웨어주법인)
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Facsimile Heads (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020020065410A 2001-10-26 2002-10-25 다층 집적 회로, 유체 분출 장치, 프린트 헤드, 잉크젯 프린트 카트리지, 슬롯 피드 프린트 헤드, 다층 집적 회로 제조 공정 및 캐비테이션층의 층분리 억제 방법 Expired - Lifetime KR100962888B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/055,161 US6740536B2 (en) 2001-10-26 2001-10-26 Devices and methods for integrated circuit manufacturing
US10/055,161 2001-10-26

Publications (2)

Publication Number Publication Date
KR20030035950A KR20030035950A (ko) 2003-05-09
KR100962888B1 true KR100962888B1 (ko) 2010-06-10

Family

ID=21996024

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020065410A Expired - Lifetime KR100962888B1 (ko) 2001-10-26 2002-10-25 다층 집적 회로, 유체 분출 장치, 프린트 헤드, 잉크젯 프린트 카트리지, 슬롯 피드 프린트 헤드, 다층 집적 회로 제조 공정 및 캐비테이션층의 층분리 억제 방법

Country Status (7)

Country Link
US (2) US6740536B2 (enExample)
EP (1) EP1306214B1 (enExample)
JP (1) JP4746814B2 (enExample)
KR (1) KR100962888B1 (enExample)
CN (2) CN1442901B (enExample)
DE (1) DE60231462D1 (enExample)
TW (2) TWI324813B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224269A (ja) * 2001-10-26 2003-08-08 Hewlett Packard Co <Hp> 集積回路を製造するための装置および方法
US6740536B2 (en) * 2001-10-26 2004-05-25 Hewlett-Packard Develpment Corporation, L.P. Devices and methods for integrated circuit manufacturing
US20050236358A1 (en) * 2004-04-26 2005-10-27 Shen Buswell Micromachining methods and systems
US7767103B2 (en) * 2004-09-14 2010-08-03 Lexmark International, Inc. Micro-fluid ejection assemblies
US7150516B2 (en) * 2004-09-28 2006-12-19 Hewlett-Packard Development Company, L.P. Integrated circuit and method for manufacturing
US8029105B2 (en) * 2007-10-17 2011-10-04 Eastman Kodak Company Ambient plasma treatment of printer components
ES2386481T3 (es) 2007-12-02 2012-08-21 Hewlett-Packard Development Company, L.P. Conexión eléctrica de redes de tierra de matriz de cabezal de impresión aisladas eléctricamente como circuito flexible
JP5777762B2 (ja) * 2014-03-20 2015-09-09 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 電気的に絶縁されるプリントヘッドダイ接地ネットワークをフレキシブル回路で電気的に接続する方法
WO2018013092A1 (en) * 2016-07-12 2018-01-18 Hewlett-Packard Development Company, L.P. Multi-layered nozzle fluid ejection device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974200A (ja) * 1995-07-04 1997-03-18 Matsushita Electric Ind Co Ltd Ｍｉｓ半導体装置及びその製造方法
JPH1074832A (ja) * 1996-08-29 1998-03-17 Toshiba Corp 半導体装置とその製造方法および不揮発性半導体記憶装置とその製造方法
US6072221A (en) * 1997-06-30 2000-06-06 Kabushiki Kaisha Toshiba Semiconductor device having self-aligned contact plug and metallized gate electrode
US20020125539A1 (en) * 2001-03-06 2002-09-12 Kabushiki Kaisha Toshiba Semiconductor device having contact electrode to semiconductor substrate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719477A (en) * 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
US5322811A (en) * 1991-08-01 1994-06-21 Canon Kabushiki Kaisha Method for manufacturing a recording head with integrally housed semiconductor functional elements
US6406740B1 (en) 1992-06-23 2002-06-18 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording apparatus and such a liquid jet recording apparatus
US5448273A (en) 1993-06-22 1995-09-05 Xerox Corporation Thermal ink jet printhead protective layers
JP2909796B2 (ja) * 1993-12-28 1999-06-23 ローム株式会社 サーマルプリントヘッドおよびその製造方法
KR970008496A (ko) * 1995-07-04 1997-02-24 모리시다 요이치 Mis 반도체 장치와 그 제조방법 및 그 진단방법
GB9622177D0 (en) * 1996-10-24 1996-12-18 Xaar Ltd Passivation of ink jet print heads
US6290337B1 (en) 1996-10-31 2001-09-18 Hewlett-Packard Company Print head for ink-jet printing and a method for making print heads
US6284147B1 (en) 1997-07-15 2001-09-04 Silverbrook Research Pty Ltd Method of manufacture of a stacked electrostatic ink jet printer
US6286939B1 (en) 1997-09-26 2001-09-11 Hewlett-Packard Company Method of treating a metal surface to increase polymer adhesion
US6039438A (en) 1997-10-21 2000-03-21 Hewlett-Packard Company Limiting propagation of thin film failures in an inkjet printhead
US6106096A (en) * 1997-12-15 2000-08-22 Lexmark International, Inc. Printhead stress relief
US6474780B1 (en) * 1998-04-16 2002-11-05 Canon Kabushiki Kaisha Liquid discharge head, cartridge having such head, liquid discharge apparatus provided with such cartridge, and method for manufacturing liquid discharge heads
US5998288A (en) * 1998-04-17 1999-12-07 Advanced Micro Devices, Inc. Ultra thin spacers formed laterally adjacent a gate conductor recessed below the upper surface of a substrate
US6740536B2 (en) * 2001-10-26 2004-05-25 Hewlett-Packard Develpment Corporation, L.P. Devices and methods for integrated circuit manufacturing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0974200A (ja) * 1995-07-04 1997-03-18 Matsushita Electric Ind Co Ltd Ｍｉｓ半導体装置及びその製造方法
JPH1074832A (ja) * 1996-08-29 1998-03-17 Toshiba Corp 半導体装置とその製造方法および不揮発性半導体記憶装置とその製造方法
US6072221A (en) * 1997-06-30 2000-06-06 Kabushiki Kaisha Toshiba Semiconductor device having self-aligned contact plug and metallized gate electrode
US20020125539A1 (en) * 2001-03-06 2002-09-12 Kabushiki Kaisha Toshiba Semiconductor device having contact electrode to semiconductor substrate

Also Published As

Publication number Publication date
DE60231462D1 (de) 2009-04-23
US20030207477A1 (en) 2003-11-06
US7004558B2 (en) 2006-02-28
JP2003218353A (ja) 2003-07-31
JP4746814B2 (ja) 2011-08-10
CN101444993A (zh) 2009-06-03
US6740536B2 (en) 2004-05-25
CN1442901A (zh) 2003-09-17
TW200802716A (en) 2008-01-01
EP1306214B1 (en) 2009-03-11
TWI315904B (en) 2009-10-11
CN101444993B (zh) 2011-04-13
TWI324813B (en) 2010-05-11
US20030080362A1 (en) 2003-05-01
EP1306214A2 (en) 2003-05-02
KR20030035950A (ko) 2003-05-09
CN1442901B (zh) 2012-05-09
EP1306214A3 (en) 2004-03-03

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