JP4743983B2 - 電荷結合イメージセンサ装置 - Google Patents

電荷結合イメージセンサ装置 Download PDF

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Publication number
JP4743983B2
JP4743983B2 JP2001081327A JP2001081327A JP4743983B2 JP 4743983 B2 JP4743983 B2 JP 4743983B2 JP 2001081327 A JP2001081327 A JP 2001081327A JP 2001081327 A JP2001081327 A JP 2001081327A JP 4743983 B2 JP4743983 B2 JP 4743983B2
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charge
image sensor
phase
sensor device
electrode
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Japanese (ja)
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JP2001326344A (ja
JP2001326344A5 (enExample
Inventor
ゴードン スティーブンス エリック
エフ デジャルダン ウィリアム
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イーストマン コダック カンパニー
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Publication of JP2001326344A5 publication Critical patent/JP2001326344A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D44/00Charge transfer devices
    • H10D44/40Charge-coupled devices [CCD]
    • H10D44/45Charge-coupled devices [CCD] having field effect produced by insulated gate electrodes 
    • H10D44/454Output structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • H10F39/151Geometry or disposition of pixel elements, address lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • H10F39/153Two-dimensional or three-dimensional array CCD image sensors
    • H10F39/1536Frame transfer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/15Charge-coupled device [CCD] image sensors
    • H10F39/158Charge-coupled device [CCD] image sensors having arrangements for blooming suppression

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
JP2001081327A 2000-03-22 2001-03-21 電荷結合イメージセンサ装置 Expired - Lifetime JP4743983B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/533051 2000-03-22
US09/533,051 US6693671B1 (en) 2000-03-22 2000-03-22 Fast-dump structure for full-frame image sensors with lod antiblooming structures

Publications (3)

Publication Number Publication Date
JP2001326344A JP2001326344A (ja) 2001-11-22
JP2001326344A5 JP2001326344A5 (enExample) 2008-04-24
JP4743983B2 true JP4743983B2 (ja) 2011-08-10

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JP2001081327A Expired - Lifetime JP4743983B2 (ja) 2000-03-22 2001-03-21 電荷結合イメージセンサ装置

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US (1) US6693671B1 (enExample)
EP (1) EP1137071B1 (enExample)
JP (1) JP4743983B2 (enExample)
DE (1) DE60142943D1 (enExample)

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Publication number Priority date Publication date Assignee Title
JP2001238134A (ja) * 2000-02-23 2001-08-31 Sony Corp 固体撮像素子およびその駆動方法並びにカメラシステム
US6995795B1 (en) 2000-09-12 2006-02-07 Eastman Kodak Company Method for reducing dark current
US20050068441A1 (en) * 2003-09-26 2005-03-31 Eastman Kodak Company Multiple output CCD for color imaging
US7492404B2 (en) 2004-08-27 2009-02-17 Eastman Kodak Company Fast flush structure for solid-state image sensors
US20080007622A1 (en) * 2006-06-08 2008-01-10 Eastman Kodak Company Method of improving solid-state image sensor sensitivity
JP2009177018A (ja) * 2008-01-25 2009-08-06 Sanyo Electric Co Ltd 固体撮像素子及びその製造方法
US8134630B2 (en) * 2008-05-09 2012-03-13 Truesense Imaging, Inc. System and method for draining residual charge from charge-coupled device (CCD) shift registers in image sensors having reset drains
US8329499B2 (en) * 2008-12-10 2012-12-11 Truesense Imaging, Inc. Method of forming lateral overflow drain and channel stop regions in image sensors
JP5243983B2 (ja) * 2009-01-30 2013-07-24 浜松ホトニクス株式会社 電子増倍機能内蔵型の固体撮像素子
JP5300577B2 (ja) * 2009-04-23 2013-09-25 三菱電機株式会社 Tdi方式のイメージセンサ、及び該イメージセンサの駆動方法
US8800130B2 (en) 2011-05-25 2014-08-12 Truesense Imaging, Inc. Methods for producing image sensors having multi-purpose architecture
US8773563B2 (en) 2011-05-25 2014-07-08 Truesense Imaging, Inc. Multi-purpose architecture for CCD image sensors
US9049353B2 (en) 2011-09-28 2015-06-02 Semiconductor Components Industries, Llc Time-delay-and-integrate image sensors having variable integration times
CN105611197B (zh) * 2015-12-23 2018-08-17 中国科学院长春光学精密机械与物理研究所 无抗溢出功能帧转移ccd的抗饱和读出方法

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JPS5817788A (ja) * 1981-07-23 1983-02-02 Toshiba Corp 固体撮像装置
US4528596A (en) * 1982-11-30 1985-07-09 Rca Corporation Suppression of edge effects arising in CCD imager field registers
US4611140A (en) 1985-08-26 1986-09-09 The United States Of America As Represented By The Secretary Of The Navy Saw-CTD parallel to serial imager
KR900007234B1 (ko) * 1986-07-07 1990-10-05 가부시기가이샤 히다찌세이사구쇼 전하이송형 고체촬상소자
US4972254A (en) * 1987-02-24 1990-11-20 Kabushiki Kaisha Toshiba Solid state image sensors for reproducing high definition images
US5121214A (en) 1990-06-29 1992-06-09 The United States Of America As Represented By The United States Department Of Energy Method for eliminating artifacts in CCD imagers
US5130774A (en) * 1990-07-12 1992-07-14 Eastman Kodak Company Antiblooming structure for solid-state image sensor
AU1995092A (en) 1991-05-10 1992-12-30 Q-Dot. Inc. High-speed peristaltic ccd imager with gaas fet output
US5355165A (en) 1992-08-06 1994-10-11 Princeton Scientific Instruments, Inc. Very high frame rate CCD imager
US5343297A (en) 1992-09-17 1994-08-30 General Electric Company Charge amplifier with precise, integer gain
US5440343A (en) 1994-02-28 1995-08-08 Eastman Kodak Company Motion/still electronic image sensing apparatus
US5668597A (en) 1994-12-30 1997-09-16 Eastman Kodak Company Electronic camera with rapid automatic focus of an image upon a progressive scan image sensor
DE69632172T2 (de) * 1995-02-21 2005-04-21 Dalsa Corp Ladungsgekoppelte bildaufnahmeanordnung
JP3590944B2 (ja) * 1996-02-23 2004-11-17 日本テキサス・インスツルメンツ株式会社 電荷結合型半導体装置
JP3750221B2 (ja) * 1996-10-01 2006-03-01 ソニー株式会社 固体撮像装置
JP2894323B2 (ja) * 1997-06-23 1999-05-24 日本電気株式会社 固体撮像装置およびその製造方法
US6051857A (en) * 1998-01-07 2000-04-18 Innovision, Inc. Solid-state imaging device and method of detecting optical signals using the same
JP2000134540A (ja) * 1998-10-29 2000-05-12 Nec Corp 固体撮像装置及びその駆動方法

Also Published As

Publication number Publication date
JP2001326344A (ja) 2001-11-22
EP1137071A2 (en) 2001-09-26
DE60142943D1 (de) 2010-10-14
EP1137071A3 (en) 2005-09-14
EP1137071B1 (en) 2010-09-01
US6693671B1 (en) 2004-02-17

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