JP4720462B2 - フレキシブル回路基板およびその製造方法 - Google Patents

フレキシブル回路基板およびその製造方法 Download PDF

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Publication number
JP4720462B2
JP4720462B2 JP2005345653A JP2005345653A JP4720462B2 JP 4720462 B2 JP4720462 B2 JP 4720462B2 JP 2005345653 A JP2005345653 A JP 2005345653A JP 2005345653 A JP2005345653 A JP 2005345653A JP 4720462 B2 JP4720462 B2 JP 4720462B2
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JP
Japan
Prior art keywords
circuit board
capacitor
resin
predetermined
flexible circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005345653A
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English (en)
Japanese (ja)
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JP2007150180A (ja
JP2007150180A5 (enrdf_load_stackoverflow
Inventor
憲一 山本
大道 光明寺
孝弘 西倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2005345653A priority Critical patent/JP4720462B2/ja
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Publication of JP2007150180A5 publication Critical patent/JP2007150180A5/ja
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  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2005345653A 2005-11-30 2005-11-30 フレキシブル回路基板およびその製造方法 Expired - Fee Related JP4720462B2 (ja)

Priority Applications (1)

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JP2005345653A JP4720462B2 (ja) 2005-11-30 2005-11-30 フレキシブル回路基板およびその製造方法

Applications Claiming Priority (1)

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JP2005345653A JP4720462B2 (ja) 2005-11-30 2005-11-30 フレキシブル回路基板およびその製造方法

Publications (3)

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JP2007150180A JP2007150180A (ja) 2007-06-14
JP2007150180A5 JP2007150180A5 (enrdf_load_stackoverflow) 2008-10-16
JP4720462B2 true JP4720462B2 (ja) 2011-07-13

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ID=38211179

Family Applications (1)

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JP2005345653A Expired - Fee Related JP4720462B2 (ja) 2005-11-30 2005-11-30 フレキシブル回路基板およびその製造方法

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JP (1) JP4720462B2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4912992B2 (ja) 2007-09-12 2012-04-11 新光電気工業株式会社 キャパシタ内蔵基板及びその製造方法
JP5460155B2 (ja) 2009-07-14 2014-04-02 新光電気工業株式会社 キャパシタ及び配線基板
US9231548B2 (en) * 2012-03-23 2016-01-05 Marvell Israel (M.I.S.L) Ltd. Package with printed filters
CN204668075U (zh) 2013-02-19 2015-09-23 株式会社村田制作所 电感电桥及电子设备
WO2014129278A1 (ja) * 2013-02-19 2014-08-28 株式会社村田製作所 インダクタブリッジおよび電子機器
JP2015141687A (ja) * 2014-01-30 2015-08-03 Ｎｅｃトーキン株式会社 ワイヤレス充電アンテナ、入力装置、ホルダ、検出装置、および座標入力装置
AU2015218603B2 (en) * 2014-02-24 2019-12-05 Element Science, Inc External defibrillator
TWI617223B (zh) * 2014-02-25 2018-03-01 財團法人工業技術研究院 嵌有導線之軟性基板及其製造方法
CN104869754B (zh) * 2014-02-25 2018-06-26 财团法人工业技术研究院 嵌有导线的软性基板及其制造方法
CA2994436A1 (en) 2015-08-26 2017-03-02 Element Science, Inc. Wearable devices
JP6544488B2 (ja) * 2016-06-22 2019-07-17 株式会社村田製作所 インダクタブリッジおよび電子機器
EP4438108A3 (en) 2018-10-10 2024-11-06 Element Science, Inc. Wearable medical device with disposable and reusable components
CN111243862A (zh) * 2019-11-27 2020-06-05 成都迈科科技有限公司 带有集成电容的玻璃基板及制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123089A (ja) * 1983-12-07 1985-07-01 東光株式会社 厚膜導体パタ−ンの製造方法
JPH0242792A (ja) * 1988-08-02 1990-02-13 Mitsubishi Plastics Ind Ltd プリント配線板の製法
JPH04208591A (ja) * 1990-07-13 1992-07-30 Toyobo Co Ltd セラミック・プリント配線板
JPH1168288A (ja) * 1997-08-21 1999-03-09 Matsushita Electric Ind Co Ltd 回路基板の製造方法及び回路基板
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
JP2004152934A (ja) * 2002-10-30 2004-05-27 Mitsui Chemicals Inc 回路基板およびその製造方法

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JP2007150180A (ja) 2007-06-14

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