JP4710735B2 - 電子装置の製造方法 - Google Patents

電子装置の製造方法 Download PDF

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Publication number
JP4710735B2
JP4710735B2 JP2006172526A JP2006172526A JP4710735B2 JP 4710735 B2 JP4710735 B2 JP 4710735B2 JP 2006172526 A JP2006172526 A JP 2006172526A JP 2006172526 A JP2006172526 A JP 2006172526A JP 4710735 B2 JP4710735 B2 JP 4710735B2
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Japan
Prior art keywords
substrate
radiator
heat
heat transfer
electronic device
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JP2006172526A
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English (en)
Japanese (ja)
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JP2008004745A5 (enExample
JP2008004745A (ja
Inventor
大佳 國枝
祐司 大谷
博和 今井
康富 浅井
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Denso Corp
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Denso Corp
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Priority to JP2006172526A priority Critical patent/JP4710735B2/ja
Publication of JP2008004745A publication Critical patent/JP2008004745A/ja
Publication of JP2008004745A5 publication Critical patent/JP2008004745A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006172526A 2006-06-22 2006-06-22 電子装置の製造方法 Active JP4710735B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006172526A JP4710735B2 (ja) 2006-06-22 2006-06-22 電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006172526A JP4710735B2 (ja) 2006-06-22 2006-06-22 電子装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010284826A Division JP5348121B2 (ja) 2010-12-21 2010-12-21 電子装置

Publications (3)

Publication Number Publication Date
JP2008004745A JP2008004745A (ja) 2008-01-10
JP2008004745A5 JP2008004745A5 (enExample) 2010-02-12
JP4710735B2 true JP4710735B2 (ja) 2011-06-29

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ID=39008887

Family Applications (1)

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JP2006172526A Active JP4710735B2 (ja) 2006-06-22 2006-06-22 電子装置の製造方法

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JP (1) JP4710735B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071550A (ja) * 2010-12-21 2011-04-07 Denso Corp 電子装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5314933B2 (ja) * 2008-06-02 2013-10-16 本田技研工業株式会社 電力変換装置
JP4623167B2 (ja) * 2008-08-26 2011-02-02 トヨタ自動車株式会社 放熱構造及び車両用インバータ
JP2010057345A (ja) * 2008-08-29 2010-03-11 Hitachi Automotive Systems Ltd 電子制御装置
JP2011134858A (ja) * 2009-12-24 2011-07-07 Li-Hong Science & Technology Co Ltd Ｌｅｄランプ用ヒートシンク及びその製造方法
JP5211118B2 (ja) * 2010-07-27 2013-06-12 株式会社日立メディアエレクトロニクス 光ピックアップ装置
JP5807801B2 (ja) * 2011-04-20 2015-11-10 トヨタ自動車株式会社 半導体モジュール
JP5623463B2 (ja) * 2012-06-25 2014-11-12 三菱電機株式会社 半導体モジュール
JP2014075429A (ja) * 2012-10-03 2014-04-24 Sharp Corp 発光装置および発光装置へのヒートシンク取付方法
JP6024838B2 (ja) 2013-12-27 2016-11-16 三菱電機株式会社 半導体装置
US10049960B2 (en) 2014-01-06 2018-08-14 Mitsubishi Electric Corporation Semiconductor device
JP6429587B2 (ja) * 2014-10-21 2018-11-28 古河電気工業株式会社 接続体及び冷却構造
JP2020120003A (ja) * 2019-01-24 2020-08-06 株式会社オートネットワーク技術研究所 回路構成体、電気接続箱及び回路構成体の製造方法
EP3770956A1 (en) 2019-07-25 2021-01-27 ABB Schweiz AG Power semiconductor module
US11488885B2 (en) * 2019-12-02 2022-11-01 Mitsubishi Electric Corporation Heat sink
JP7656174B2 (ja) * 2021-03-11 2025-04-03 株式会社今仙電機製作所 電子装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727634Y2 (ja) * 1989-02-03 1995-06-21 富士通株式会社 空冷フィン構造
JPH03178154A (ja) * 1989-12-06 1991-08-02 Hitachi Ltd 半導体集積回路装置
JPH0555419A (ja) * 1991-08-23 1993-03-05 Uchu Tsushin Kiso Gijutsu Kenkyusho:Kk 半導体デバイスの放熱取付け構造
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
US6016006A (en) * 1996-06-24 2000-01-18 Intel Corporation Thermal grease insertion and retention
JPH10200048A (ja) * 1997-01-13 1998-07-31 Hitachi Ltd 電力用半導体モジュール
JPH11111897A (ja) * 1997-10-03 1999-04-23 Hitachi Ltd マルチチップ型半導体装置
JP2002217346A (ja) * 2001-01-19 2002-08-02 Toyota Motor Corp 電子素子チップモジュール
JP2004247684A (ja) * 2003-02-17 2004-09-02 Toyota Motor Corp 放熱板および放熱装置
JP2004253495A (ja) * 2003-02-19 2004-09-09 Hitachi Ltd 液冷型電力用半導体モジュール及びそれを包含するインバータ
US20060087816A1 (en) * 2004-09-21 2006-04-27 Ingo Ewes Heat-transfer devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071550A (ja) * 2010-12-21 2011-04-07 Denso Corp 電子装置

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Publication number Publication date
JP2008004745A (ja) 2008-01-10

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