JP4705103B2 - インターフェイスモジュール - Google Patents
インターフェイスモジュール Download PDFInfo
- Publication number
- JP4705103B2 JP4705103B2 JP2007524313A JP2007524313A JP4705103B2 JP 4705103 B2 JP4705103 B2 JP 4705103B2 JP 2007524313 A JP2007524313 A JP 2007524313A JP 2007524313 A JP2007524313 A JP 2007524313A JP 4705103 B2 JP4705103 B2 JP 4705103B2
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- Prior art keywords
- module
- interface module
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- Prior art date
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Test And Diagnosis Of Digital Computers (AREA)
- Microcomputers (AREA)
- Bus Control (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
−測定と調節(Measurement & Calibration)
−バイパス適用(Rapid−Prototyping)
−エラー除去と機能および/またはエラー追求(Debugging and Tracing)
本発明は、プリント回路基板上の構成素子を代用するための、集積された構成素子を有するインターフェイスモジュールに基づいており、その場合にインターフェイスモジュールの下側に、接続接点がプリント回路基板上の構成素子の接触のために設けられているように形成されており、その場合にインターフェイスモジュールは、好ましくはベースモジュールとしての適応部分と、ツールアクセスモジュールとしてのプロトコル変換器部分に分割されている。
1)マイクロコントローラの必要な入/出力ピン(I/Oピン)を接触させる、適応部分、
2)比較的長い距離にわたって確実かつ信頼できるように伝送することができるようにMCU信号を変換する、プロトコル変換器。
Claims (9)
- プリント回路基板上の構成素子を適合させるためのインターフェイスモジュールであって、前記インターフェイスモジュールは集積された構成素子(1)を有し、前記インターフェイスモジュールの下側に、接続接点(6)がプリント回路基板上の構成素子の接触のために設けられるように形成されている、前記インターフェイスモジュールにおいて、
前記インターフェイスモジュールが、ベースモジュール(100)としての適合部分と、ツールアクセスモジュール(200)としてのプロトコル変換器部分に分割されており、前記ベースモジュールは、適合ベース(3)と支持体基板(2)から形成され、前記支持体基板(2)は下側に前記接続接点(6)を有しており、前記支持体基板(2)内の接続を介して、前記支持体基板上に配置された前記集積された構成素子の適応接点(8)と前記接続接点(6)とが接続されており、
前記適合ベース(3)を通じて、前記構成素子の、適合に必要な全ての信号が前記ベースモジュール(100)の上側へと導かれ、
前記ベースモジュール(100)と前記ツールアクセスモジュール(200)は差込み接点(A)と差込みジャック(4)とを介して接続されており、
前記ツールアクセスモジュール(200)は、ローカルなマイクロコントローラバスを伝送可能なプロトコルにプロトコル変換するための電気的構成素子を有することを特徴とする、インターフェイスモジュール。 - 前記集積された構成素子(1)は、前記ベースモジュール内に、チップスケールパッケージ技術で集積されていることを特徴とする、請求項1に記載のインターフェイスモジュール。
- 前記集積された構成素子(1)と前記適合ベース(3)とは、ボールグリッドアレイ(BGA)として形成されていることを特徴とする、請求項1に記載のインターフェイスモジュール。
- 前記ツールアクセスモジュールは、モジュール基板(D)とアダプタ(B)から形成されることを特徴とする、請求項1に記載のインターフェイスモジュール。
- 前記モジュール基板(D)と前記アダプタ(B)は、アダプタ−基板−接点(C)を介して接続されていることを特徴とする、請求項4に記載のインターフェイスモジュール。
- 前記ベースモジュール(100)は、前記差込みジャック(4)を有しており、
前記ツールアクセスモジュール(200)は、前記アダプタ(B)を有し、当該アダプタは、前記差込み接点(A)を有していることを特徴とする、請求項1に記載のインターフェイスモジュール。 - 前記集積された構成素子(1)は、マイクロコントローラであることを特徴とする、請求項1に記載のインターフェイスモジュール。
- 前記集積された構成素子(1)は、メモリモジュールであることを特徴とする、請求項1に記載のインターフェイスモジュール。
- 前記メモリモジュールは、プログラミング可能であることを特徴とする、請求項8に記載のインターフェイスモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004038591A DE102004038591A1 (de) | 2004-08-06 | 2004-08-06 | Schnittstellenbaustein |
DE102004038591.2 | 2004-08-06 | ||
PCT/EP2005/053053 WO2006015907A1 (de) | 2004-08-06 | 2005-06-29 | Schnittstellenbautstein |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008509546A JP2008509546A (ja) | 2008-03-27 |
JP4705103B2 true JP4705103B2 (ja) | 2011-06-22 |
Family
ID=35229740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007524313A Expired - Fee Related JP4705103B2 (ja) | 2004-08-06 | 2005-06-29 | インターフェイスモジュール |
Country Status (7)
Country | Link |
---|---|
US (1) | US8908385B2 (ja) |
EP (1) | EP1776849B1 (ja) |
JP (1) | JP4705103B2 (ja) |
KR (1) | KR101118387B1 (ja) |
CN (1) | CN1994031B (ja) |
DE (1) | DE102004038591A1 (ja) |
WO (1) | WO2006015907A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101650899B (zh) * | 2009-07-10 | 2014-01-01 | 北京巨数数字技术开发有限公司 | Led单元板和led显示装置 |
US9338918B2 (en) * | 2013-07-10 | 2016-05-10 | Samsung Electronics Co., Ltd. | Socket interposer and computer system using the socket interposer |
CN112925641B (zh) * | 2021-02-20 | 2023-02-03 | 上海空间电源研究所 | 一种1553b接口芯片代替数据存储器的卫星电源下位机系统 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091501A (ja) * | 1998-09-16 | 2000-03-31 | Ibiden Co Ltd | 電子部品搭載装置及びその製造方法 |
JP2000138329A (ja) * | 1998-10-29 | 2000-05-16 | Ibiden Co Ltd | 変換モジュールの製造方法 |
JP2000150734A (ja) * | 1998-11-06 | 2000-05-30 | Ibiden Co Ltd | ソケット様構造部を持つ電子部品搭載用基板 |
JP2002006161A (ja) * | 2000-06-19 | 2002-01-09 | Sony Corp | 光配線基板および光配線モジュール並びにそれらの製造方法 |
JP2002141462A (ja) * | 2000-11-07 | 2002-05-17 | Toshiba Corp | 3次元実装装置および3次元実装システム |
JP2002329891A (ja) * | 2000-12-22 | 2002-11-15 | Ibiden Co Ltd | Icチップ実装用基板、icチップ実装用基板の製造方法、および、光通信用デバイス |
JP2003215372A (ja) * | 2002-01-25 | 2003-07-30 | Ibiden Co Ltd | 光通信用デバイス、および、光通信用デバイスの製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3319624B2 (ja) * | 1993-02-24 | 2002-09-03 | 株式会社日立製作所 | 情報機器用モジュールおよびこれに用いられるコネクタ |
US5982635A (en) * | 1996-10-23 | 1999-11-09 | Concept Manufacturing, Incorporated | Signal adaptor board for a pin grid array |
FR2811509B1 (fr) * | 2000-01-31 | 2004-01-02 | Wavecom Sa | Module de radiocommunication se presentant sous la forme d'un macro composant electronique, structure d'interposition et procede de report sur une carte-mere correspondante |
JP3680760B2 (ja) * | 2001-04-25 | 2005-08-10 | 日本電気株式会社 | 半導体装置の端子変換用アダプタ装置及びそれを用いた半導体装置並びにその実装方法 |
WO2003073251A2 (en) * | 2002-02-25 | 2003-09-04 | Molex Incorporated | Power delivery to base of processor |
TW567601B (en) * | 2002-10-18 | 2003-12-21 | Siliconware Precision Industries Co Ltd | Module device of stacked semiconductor package and method for fabricating the same |
US6903941B2 (en) * | 2002-10-24 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Printed circuit board assembly employing a press fit electrical connector |
US7209366B2 (en) * | 2004-03-19 | 2007-04-24 | Intel Corporation | Delivery regions for power, ground and I/O signal paths in an IC package |
-
2004
- 2004-08-06 DE DE102004038591A patent/DE102004038591A1/de not_active Withdrawn
-
2005
- 2005-06-29 KR KR1020077002795A patent/KR101118387B1/ko active IP Right Grant
- 2005-06-29 CN CN2005800265336A patent/CN1994031B/zh not_active Expired - Fee Related
- 2005-06-29 US US11/659,124 patent/US8908385B2/en not_active Expired - Fee Related
- 2005-06-29 WO PCT/EP2005/053053 patent/WO2006015907A1/de active Application Filing
- 2005-06-29 EP EP05758615.8A patent/EP1776849B1/de not_active Expired - Fee Related
- 2005-06-29 JP JP2007524313A patent/JP4705103B2/ja not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091501A (ja) * | 1998-09-16 | 2000-03-31 | Ibiden Co Ltd | 電子部品搭載装置及びその製造方法 |
JP2000138329A (ja) * | 1998-10-29 | 2000-05-16 | Ibiden Co Ltd | 変換モジュールの製造方法 |
JP2000150734A (ja) * | 1998-11-06 | 2000-05-30 | Ibiden Co Ltd | ソケット様構造部を持つ電子部品搭載用基板 |
JP2002006161A (ja) * | 2000-06-19 | 2002-01-09 | Sony Corp | 光配線基板および光配線モジュール並びにそれらの製造方法 |
JP2002141462A (ja) * | 2000-11-07 | 2002-05-17 | Toshiba Corp | 3次元実装装置および3次元実装システム |
JP2002329891A (ja) * | 2000-12-22 | 2002-11-15 | Ibiden Co Ltd | Icチップ実装用基板、icチップ実装用基板の製造方法、および、光通信用デバイス |
JP2003215372A (ja) * | 2002-01-25 | 2003-07-30 | Ibiden Co Ltd | 光通信用デバイス、および、光通信用デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090086443A1 (en) | 2009-04-02 |
JP2008509546A (ja) | 2008-03-27 |
KR20070039124A (ko) | 2007-04-11 |
CN1994031A (zh) | 2007-07-04 |
DE102004038591A1 (de) | 2006-02-23 |
EP1776849B1 (de) | 2017-01-11 |
EP1776849A1 (de) | 2007-04-25 |
CN1994031B (zh) | 2010-05-12 |
WO2006015907A1 (de) | 2006-02-16 |
KR101118387B1 (ko) | 2012-03-09 |
US8908385B2 (en) | 2014-12-09 |
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