CN1994031A - 接口芯片 - Google Patents
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Abstract
具有一个集成的元件的接口芯片,用于代替在一个线路板上的元件,其中在连接口芯片中在底侧上设有连接接点(6),就如在线路板上的元件的接点那样,集成接口芯片划分成一个适配部件作为基础模块(100)和一个协议转换部件作为工具存取模块(200)。
Description
背景技术
本发明涉及一种按照独立权利要求的前序所述具有一个集成的元件的接口芯片。
这样的接口芯片用于各种不同的场合。一种方案例如可以通过一种这样的具有集成的元件的接口芯片来代替一个控制装置的存储器芯片。那么真正的存储器芯片,例如EPROM,EEPROM,闪存,RAM等等则用具有一个备用存储器的接口芯片来代替,例如通过借助于一种仿真器按钮(ETK)。这样一种接口芯片也可以称作为存储器接口。通过这种存储器接口可以借助于一个软件工具通过一种外部设备,一种工具计算机(例如PC机)来存取一个控制装置的存储数据并在控制装置上进行测量和应用使用。
通过这种具有集成的元件的接口芯片但也可以代替控制装置本身的微控制器,其中对于这个元件来说则正好是指一种微控制器。因此具有集成的元件的接口芯片另外还称作为微控制器接口。但这种名称并不意味着应用的局限性,正如上面所述的那样。
微控制器接口尤其是使软件工具能够存取微控制器(MCU)的信号的装置。微控制器装在使用地点里(例如在汽车发动机腔里的一个控制装置里)并通常位于一个控制装置线路板或电路板上。软件工具在一个外部计算机上,一个工具计算机(例如一个PC机)上执行。用这种构造可以进行各种不同的作业:
-测量和调整(Measurement & Calibration)
-旁路应用(快速原型)
-排除故障以及功能和/或故障跟踪(Debugging und Tracing)。
现有技术是应用了印刷电路,它装入在控制装置线路板和微控制器之间。为此将微控制器与系列控制装置分离开并应用一个中间插座代替。在这中间插座上插上微控制器接口,此接口在一个标准外壳里包含了用于协议转换所必需的电子元件、用于软件工具或者工具计算机的通道(插头或电缆)和微控制器。通过这种构成和附带的电子元件,微控制器接口,也就是接口芯片的底面,明显大于微控制器自身的面积。
这是一种缺点,因为在控制装置线路板上在接口芯片,也就是微控制器接口下不允许有高的元件。此外还必须注意到:接口芯片并不在一边或者多个边伸出超过控制装置的电路板底面或线路板底面。工具制造者和控制装置制造者必须对它们各自产品的机械尺寸准确地进行协调。这是困难的,因为尤其是在控制装置开发的开始阶段元件的布置可能变化很大。尽管如此必须尽可能早地开始进行接口芯片或者接口的开发,因为微控制器接口应该可以同时地具有控制装置。
另一个缺点是整体式的结构形式,具有集成的元件的整个接口芯片适应于安装位置并使要传递的信号适应于工具计算机并不可分开地在一个印刷电路里实现。然而对安装位置的适应取决于机械的结构形式(例如外壳)和微控制器的类型,而信号的适应则取决于所进行的工作活动。在测量和调整时例如必须对不同于调试时的微控制器功能和接口进行存取。因此就有许多接口芯片或接口变型方案,这些方案的制造和管理比较费事。
因此表明,现有技术在各个方面不可能提供最佳的结果。因此本发明的任务是提出一种接口芯片,它一方面具有安装位置方面的高度灵活性,另一方面可以限制变型方案的数量。
发明内容
本发明涉及一种具有一个集成的元件的接口芯片,用于代替在线路板上的元件,其中在接口芯片中在上侧上设有连接接点,正如为线路板上的元件的接点所设的那样,其中接口芯片更有利地划分成一种适配部件作为基础模块和一个协议转换部件作为工具存取模块。
集成的元件(1)更为适宜地以芯片尺寸封装(Chip-Scale-Package)技术集成在基础模块里,因此可以形成较小的封装。
另外有利的是在基础模块里包含有集成的元件,而且基础模块包含有一个适配插座,其中集成的元件和适配插座作成球形栅格排列(BGA)。
基础模块更为有利地由一个适配插座和一个支承基片构成,其中适配插座包含有适配接点而且支承基片具有连接接点,其中通过连接部分,尤其是导线,在支承基片里适配接点与连接接点连接,因此可以很灵活地适应于不同的连接方案。
工具存取模块更为有利地由一个模块基片和一个适配器构成,其中模块基片和适配器通过适配器-基片接点连接。
此外有利的是:基础模块和工具存取模块通过插接接点和插接套连接,其中适配插座具有插接套,而适配器具有插接接点。
在第一种实施形式中集成的元件就是微控制器,它也包括有处理器,尤其也有特殊的处理器,如信号处理器(DSP)等等或者其它智能元件。
在第二个实施例中集成的元件是一个存储器芯片,这尤其包括了所有可编程序存储器如EPROM,PROM,RAM,EEPROM,闪存等等。
按照本发明的接口芯片或者微控制器接口因此具有以下优点:接口具有与被替代的元件例如微控制器差不多相同的,或者精确相同的底面。因此大大简化了在工具制造者和控制装置制造者之间的协调。控制装置制造者并不受到线路板布局设计的限制。可以使任意高的元件布置在微控制器旁。
此外通过适配部件的协议转换部件的物理上的分离大大限制了尤其是必需的微控制器的方案多样性。通过具有标准化的适配部件的接口芯片或者接口可以减少所要制造产品的数量并使管理和维护更加简化。对于每一种由微控制器和实施的工作活动形成的组合因此可以提供一种由适配部件和协议转换器形成的理想组合。此处可以由各个不同的供应者提供模块。模块通过机械可靠的和汽车上有用的接点相连接。
附图说明
本发明的一个实施例表示于附图中并在以下的说明中详细加以叙述。附图包括了大大简化的,不按比例的按照发明的接口芯片,尤其是微控制器接口或存储器接口的实施例的不同的视图。接口由两个物理上分开的模块组成,这些模块借助于接点可以相互套插:基础模块(用1至8表示)实现了适配部件,而工具存取工具(用字母A至E表示)实现了协议部件。
图1表示了基础模块的俯视图;
图2表示工具存取模块的一个侧视图;
图3表示有关基础模块不同深度的侧视图;
图4最后表示了从下看到的接口芯片或者基础模块。
以下按照实施例对发明详细加以说明。
具体实施方式
按照本发明将微控制器接口按两个逻辑部分加以考察:
1)一个适配部件,它接通微控制器的必需要的输入/输出引脚(I/O引脚)。
2)一个协议转换器,它转换MCU-信号,使它们能够经过较长的距离安全可靠地进行传输。
在现有技术中这用整体式结构型式来实现。适配部件和协议转换器不可分离地在一个印刷电路里实现。适配部件然而取决于微控制器的机械结构形式(例如外壳)和类型,而协议转换器则取决于所实施的工作活动。因此在现有技术中有许多接口变型方案,它们的制造和管理都很费事。这通过按照发明物理上分离成一个适配部件作为基础模块(100)和一个协议转换部件作为工具存取模块(200)来进行控制和改善。
图1用俯视图表示了作为微控制器接口或存储器接口的按照发明的接口芯片的基础模块100的实施例。在这里所示的实施例中适配插座3形成了基础模块100的框。其是一种BGA(球形栅格阵列)插座,它在所有四个侧边具有两列的接点。为了进行防止转错,适配插座3缺一个角部插头。
在适配插座的自由空间里是集成的元件1,尤其是微控制器或存储器芯片。这个元件,尤其是微控制器,作为芯片尺寸封装(CSP)来实现。此时是指一种大大变小的外壳,此外壳含有如同标准外壳那样相同的芯片(内部芯片基片、微片),当然具有更加致密的接点布局设计,更加小的栅距。因此可以用较小的封装达到相同的微控制器功能。
适配插座3和作为集成的元件1的微控制器作成球形栅格阵列(BGA)并焊接在一个支承基片2上。备选地也可以使用粘结法。
所有对于适配来说必要的微控制器信号通过适配插座3的行接套4从上面是可以存取的。
通过所述的构造形成一种基础模块100,它具有如同标准元件相同的底面和相同的引出线,也就是相同的连接接点配置,这标准元件也就是说标准微控制器或标准存储器,通常情况下尤其是串联使用并且按照发明应该被替代。
图2和3表示了按照发明的接口芯片或者微控制器接口的实施例的侧视图,其中图3表示基础模块,图2表示了工具存取模块。
在图3中在波浪线左半部表示了经过这元件,即微控制器本身,也就是说基础模块内部的一个剖视图,波浪线的右半部表示了从外看基础模100的侧视图。
在图3中元件,也就是设有其适配接点8,尤其作为BGA接点的微控制器1,焊接在支承基片2上(或者其它方法连接),并被适配插座3的前面遮盖住。适配插座3通过插座接点5同样也焊接在支承基片2上(或者其它方法连接)。在支承基片2的底面上设有基础模块100的接点,它们对应于标准外壳里微控制器的引出线。通过连接,尤其是支承基片里的导线7在这些接点6和微控制器上侧上的接点、由插座接点5组成的适配接点8之间建立起连接。因此可以没有问题地实现很不相同的元件匹配于很不相同的接触位置。
因此表示出一种接口芯片,尤其是在线路板技术中的,并具有一个芯片尺寸封装的IC元件和一个包围着的适配插座3,其中接口芯片在标准外壳里从下面具有IC元件的引出线6并在支承基片2里所有的IC信号在芯片尺寸封装接点或适配接点8和模块连接接点6之间正确和完全地布线,并使所有用于适配所必要的信号导引到支承基片2的最上层上,并与适配插座3的接点5连接并在接点套或者插接套4上在基础模块100的上边面上供使用。
图2中表示了工具存取模块200,它可以插在基础模块100上。这工具存取模块200由一个模块基片D组成,该基片具有电子元件E,这些元件下面与一个适配器B通过适配器-基片接点C相连接。
工具存取模块200的插接接点A建立了至基础模块的插接套的连接。因此例如一个模块基片D,尤其在印刷线路板技术中表示出具有一个或多个焊上的或粘结上的电子元件E,这元件被焊在或粘结在一个(BGA)适配器B上,该适配器借助于插接接点A可以连接在基础模块100的接点套筒或插接套筒4上。这些电子元件E尤其用于将局部微控制器总线进行协议转换成能够传输的协议。作为微控制器总线例如使用JTAG、Nexus或者AUD或者也用局部地址总线、数据总线和控制总线。所提及的总线例如用于连接一个校准RAM,其中校准RAM尤其设计成一种双通道RAM。能够传输的协议尤其设计成100MBit/s以太网按照IEEE 802.3。适宜地也可以使用按照IEEE 802.3U(100MBit/s)或者按照IEEE 802.ab(1GBit/s)的协议。
图4最后表示了按照本发明的接口芯片的或者微控制器接口的或存储器接口的相同实施例的仰视图。
基础模块100的支承基片2如所述的那样与元件的标准外壳,尤其是微控制器的标准外壳具有相同的引出线,也就是说相同的接点6和差不多相同的或者精确相同的面积,。基础模块通过连接接点6与尤其是控制装置的印刷电路板或线路板连接。
Claims (12)
1.具有集成的元件的接口芯片,用于代替在线路板上的元件,其中在接口芯片的底面上设有与线路板上的元件的接点相同的连接接点(6),其特征在于,接口芯片划分成一个适配部件作为基础模块(100)和一个协议转换部件作为工具存取模块(200)。
2.按权利要求1所述的接口芯片,其特征在于,集成的元件(1)按芯片尺寸封装技术集成于基础模块里。
3.按权利要求1所述的接口芯片,其特征在于,集成的元件(1)包含在基础模块(100)里,而基础模块(100)包含适配插座(3),其中集成的元件(1)和适配插座(3)设计成球形栅格阵列(BGA)。
4.按权利要求1所述的接口芯片,其特征在于,基础模块由适配插座(3)和支承基片(2)组成。
5.按权利要求4所述的接口芯片,其特征在于,适配插座(3)包含有适配接点(8),而以承基片(2)具有连接接点(6),其中通过在支承基片(2)里的连接部分(7)将适配接点(8)与连接接点(6)连接起来。
6.按权利要求1所述的接口芯片,其特征在于,工具存取模块由模块基片(D)和适配器(B)构成。
7.按权利要求6所述的接口芯片,其特征在于,模块基片(D)和适配器(B)通过适配器-基片接点(C)相连接。
8.按权利要求1所述的接口芯片,其特征在于,基础模块(100)和工具存取模块(200)通过插接接点(A)和插接套筒(4)连接。
9.按权利要求8所述的接口芯片,其特征在于,基础模块(100)包含适配插座(3),它本身具有插接套筒(4),而工具存取模块(200)包含适配器(B),它具有插接接点(A)。
10.按权利要求1所述的接口芯片,其特征在于,集成的元件(1)是一个微控制器。
11.按权利要求1所述的接口芯片,其特征在于,集成的元件(1)是存储器芯片。
12.按权利要求11所述的接口芯片,其特征在于,存储器芯片是可编程的。
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DE102004038591A DE102004038591A1 (de) | 2004-08-06 | 2004-08-06 | Schnittstellenbaustein |
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PCT/EP2005/053053 WO2006015907A1 (de) | 2004-08-06 | 2005-06-29 | Schnittstellenbautstein |
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EP (1) | EP1776849B1 (zh) |
JP (1) | JP4705103B2 (zh) |
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CN101650899A (zh) * | 2009-07-10 | 2010-02-17 | 北京巨数数字技术开发有限公司 | Led单元板和led显示装置 |
CN112925641A (zh) * | 2021-02-20 | 2021-06-08 | 上海空间电源研究所 | 一种1553b接口芯片代替数据存储器的卫星电源下位机系统 |
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US9338918B2 (en) * | 2013-07-10 | 2016-05-10 | Samsung Electronics Co., Ltd. | Socket interposer and computer system using the socket interposer |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101650899A (zh) * | 2009-07-10 | 2010-02-17 | 北京巨数数字技术开发有限公司 | Led单元板和led显示装置 |
CN101650899B (zh) * | 2009-07-10 | 2014-01-01 | 北京巨数数字技术开发有限公司 | Led单元板和led显示装置 |
CN112925641A (zh) * | 2021-02-20 | 2021-06-08 | 上海空间电源研究所 | 一种1553b接口芯片代替数据存储器的卫星电源下位机系统 |
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US8908385B2 (en) | 2014-12-09 |
EP1776849A1 (de) | 2007-04-25 |
WO2006015907A1 (de) | 2006-02-16 |
JP4705103B2 (ja) | 2011-06-22 |
KR20070039124A (ko) | 2007-04-11 |
JP2008509546A (ja) | 2008-03-27 |
CN1994031B (zh) | 2010-05-12 |
DE102004038591A1 (de) | 2006-02-23 |
KR101118387B1 (ko) | 2012-03-09 |
EP1776849B1 (de) | 2017-01-11 |
US20090086443A1 (en) | 2009-04-02 |
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