JP4698435B2 - 感光性組成物除去液 - Google Patents

感光性組成物除去液 Download PDF

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Publication number
JP4698435B2
JP4698435B2 JP2006031922A JP2006031922A JP4698435B2 JP 4698435 B2 JP4698435 B2 JP 4698435B2 JP 2006031922 A JP2006031922 A JP 2006031922A JP 2006031922 A JP2006031922 A JP 2006031922A JP 4698435 B2 JP4698435 B2 JP 4698435B2
Authority
JP
Japan
Prior art keywords
photosensitive composition
mass
pigment
cyclic
acid esters
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006031922A
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English (en)
Japanese (ja)
Other versions
JP2006251785A5 (enExample
JP2006251785A (ja
Inventor
昌人 金田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2006031922A priority Critical patent/JP4698435B2/ja
Publication of JP2006251785A publication Critical patent/JP2006251785A/ja
Publication of JP2006251785A5 publication Critical patent/JP2006251785A5/ja
Application granted granted Critical
Publication of JP4698435B2 publication Critical patent/JP4698435B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2006031922A 2005-02-09 2006-02-09 感光性組成物除去液 Expired - Fee Related JP4698435B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006031922A JP4698435B2 (ja) 2005-02-09 2006-02-09 感光性組成物除去液

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005032732 2005-02-09
JP2005032732 2005-02-09
JP2006031922A JP4698435B2 (ja) 2005-02-09 2006-02-09 感光性組成物除去液

Publications (3)

Publication Number Publication Date
JP2006251785A JP2006251785A (ja) 2006-09-21
JP2006251785A5 JP2006251785A5 (enExample) 2009-02-19
JP4698435B2 true JP4698435B2 (ja) 2011-06-08

Family

ID=36793236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006031922A Expired - Fee Related JP4698435B2 (ja) 2005-02-09 2006-02-09 感光性組成物除去液

Country Status (7)

Country Link
US (1) US7510815B2 (enExample)
EP (1) EP1847876A4 (enExample)
JP (1) JP4698435B2 (enExample)
KR (1) KR100825865B1 (enExample)
CN (1) CN101044435B (enExample)
TW (1) TW200641560A (enExample)
WO (1) WO2006085681A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
WO2008072193A2 (en) * 2006-12-15 2008-06-19 Liquid Colours (Pty) Ltd Security composition
CN102093918B (zh) * 2009-12-11 2014-07-09 济南开发区星火科学技术研究院 一种汽油辛烷值改进剂及制备方法
KR101595977B1 (ko) * 2013-03-07 2016-02-19 주식회사 엘지화학 포토레지스트 제거용 스트리퍼 조성물 및 이를 사용한 포토레지스트의 박리방법
JP6100669B2 (ja) * 2013-10-11 2017-03-22 Ｊｘエネルギー株式会社 洗浄液組成物
KR102414295B1 (ko) * 2016-01-22 2022-06-30 주식회사 이엔에프테크놀로지 포토레지스트 제거용 박리액 조성물
KR102465602B1 (ko) * 2018-08-31 2022-11-11 주식회사 이엔에프테크놀로지 신너 조성물
KR102795444B1 (ko) * 2020-08-11 2025-04-16 가부시끼가이샤 레조낙 용제 조성물
WO2023092278A1 (zh) * 2021-11-23 2023-06-01 才将科技股份有限公司 一种清洗粘结层的组合物及其应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3248781B2 (ja) * 1993-06-28 2002-01-21 東京応化工業株式会社 レジスト洗浄除去用溶剤及びそれを使用する電子部品製造用基材の製造方法
JPH07160008A (ja) * 1993-12-06 1995-06-23 Tokyo Ohka Kogyo Co Ltd レジスト形成用塗布物あるいはレジストの洗浄除去用溶剤及びそれを使用する電子部品製造用基材の製造方法
CN1033464C (zh) * 1994-09-14 1996-12-04 山东大学 去胶剂组合物
KR100234532B1 (ko) * 1996-09-21 1999-12-15 윤종용 반도체 제조공정의 포토레지스트 세정용 시너 조성물 및 그를 이용한 반도체장치의 제조방법
JP3978255B2 (ja) * 1997-06-24 2007-09-19 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用洗浄剤
FR2773813B1 (fr) * 1998-01-21 2001-09-07 Rhodia Chimie Sa Composition pour decaper les peintures a base d'une cetone cyclique
JP2000204302A (ja) * 1998-11-13 2000-07-25 Masao Umemoto 塗料剥離剤
JP2000164671A (ja) * 1998-11-27 2000-06-16 Tokyo Electron Ltd 基板処理装置
JP2001194806A (ja) * 1999-10-25 2001-07-19 Toray Ind Inc レジスト剥離方法
JP4564683B2 (ja) * 2001-05-21 2010-10-20 大日本印刷株式会社 樹脂膜除去装置およびその方法
JP2003167114A (ja) * 2001-11-30 2003-06-13 Toshiba Corp 平面表示装置の製造方法
KR100483846B1 (ko) * 2002-10-15 2005-04-19 삼성전자주식회사 신너 조성물 및 이를 사용한 포토레지스트의 스트립핑 방법
KR101215429B1 (ko) * 2003-10-20 2012-12-26 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
KR101142868B1 (ko) * 2004-05-25 2012-05-10 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물

Also Published As

Publication number Publication date
CN101044435A (zh) 2007-09-26
EP1847876A1 (en) 2007-10-24
CN101044435B (zh) 2010-09-08
EP1847876A4 (en) 2011-10-26
WO2006085681A1 (ja) 2006-08-17
KR20070088271A (ko) 2007-08-29
US20070196775A1 (en) 2007-08-23
KR100825865B1 (ko) 2008-04-28
JP2006251785A (ja) 2006-09-21
WO2006085681A9 (ja) 2006-09-28
TWI346260B (enExample) 2011-08-01
TW200641560A (en) 2006-12-01
US7510815B2 (en) 2009-03-31

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