CN101044435B - 感光性组合物除去液 - Google Patents

感光性组合物除去液 Download PDF

Info

Publication number
CN101044435B
CN101044435B CN2006800001648A CN200680000164A CN101044435B CN 101044435 B CN101044435 B CN 101044435B CN 2006800001648 A CN2006800001648 A CN 2006800001648A CN 200680000164 A CN200680000164 A CN 200680000164A CN 101044435 B CN101044435 B CN 101044435B
Authority
CN
China
Prior art keywords
methyl
ether acetate
photosensitive composition
ethyl
acetate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800001648A
Other languages
English (en)
Chinese (zh)
Other versions
CN101044435A (zh
Inventor
金田昌人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Resonac Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN101044435A publication Critical patent/CN101044435A/zh
Application granted granted Critical
Publication of CN101044435B publication Critical patent/CN101044435B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2006800001648A 2005-02-09 2006-02-09 感光性组合物除去液 Expired - Fee Related CN101044435B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005032732 2005-02-09
JP032732/2005 2005-02-09
PCT/JP2006/302678 WO2006085681A1 (ja) 2005-02-09 2006-02-09 感光性組成物除去液

Publications (2)

Publication Number Publication Date
CN101044435A CN101044435A (zh) 2007-09-26
CN101044435B true CN101044435B (zh) 2010-09-08

Family

ID=36793236

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800001648A Expired - Fee Related CN101044435B (zh) 2005-02-09 2006-02-09 感光性组合物除去液

Country Status (7)

Country Link
US (1) US7510815B2 (enExample)
EP (1) EP1847876A4 (enExample)
JP (1) JP4698435B2 (enExample)
KR (1) KR100825865B1 (enExample)
CN (1) CN101044435B (enExample)
TW (1) TW200641560A (enExample)
WO (1) WO2006085681A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
WO2008072193A2 (en) * 2006-12-15 2008-06-19 Liquid Colours (Pty) Ltd Security composition
CN102093918B (zh) * 2009-12-11 2014-07-09 济南开发区星火科学技术研究院 一种汽油辛烷值改进剂及制备方法
CN105143984B (zh) * 2013-03-07 2017-09-05 株式会社Lg化学 用于去除光阻剂的剥离剂组合物及使用其剥离光阻剂的方法
JP6100669B2 (ja) * 2013-10-11 2017-03-22 Ｊｘエネルギー株式会社 洗浄液組成物
KR102414295B1 (ko) * 2016-01-22 2022-06-30 주식회사 이엔에프테크놀로지 포토레지스트 제거용 박리액 조성물
KR102465602B1 (ko) * 2018-08-31 2022-11-11 주식회사 이엔에프테크놀로지 신너 조성물
CN116171404A (zh) * 2020-08-11 2023-05-26 株式会社力森诺科 溶剂组合物
CN118382688A (zh) * 2021-11-23 2024-07-23 才将科技股份有限公司 一种清洗粘结层的组合物及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1103964A (zh) * 1994-09-14 1995-06-21 山东大学 去胶剂组合物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3248781B2 (ja) * 1993-06-28 2002-01-21 東京応化工業株式会社 レジスト洗浄除去用溶剤及びそれを使用する電子部品製造用基材の製造方法
JPH07160008A (ja) 1993-12-06 1995-06-23 Tokyo Ohka Kogyo Co Ltd レジスト形成用塗布物あるいはレジストの洗浄除去用溶剤及びそれを使用する電子部品製造用基材の製造方法
KR100234532B1 (ko) * 1996-09-21 1999-12-15 윤종용 반도체 제조공정의 포토레지스트 세정용 시너 조성물 및 그를 이용한 반도체장치의 제조방법
JP3978255B2 (ja) * 1997-06-24 2007-09-19 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用洗浄剤
FR2773813B1 (fr) 1998-01-21 2001-09-07 Rhodia Chimie Sa Composition pour decaper les peintures a base d'une cetone cyclique
JP2000204302A (ja) 1998-11-13 2000-07-25 Masao Umemoto 塗料剥離剤
JP2000164671A (ja) 1998-11-27 2000-06-16 Tokyo Electron Ltd 基板処理装置
JP2001194806A (ja) * 1999-10-25 2001-07-19 Toray Ind Inc レジスト剥離方法
JP4564683B2 (ja) 2001-05-21 2010-10-20 大日本印刷株式会社 樹脂膜除去装置およびその方法
JP2003167114A (ja) 2001-11-30 2003-06-13 Toshiba Corp 平面表示装置の製造方法
KR100483846B1 (ko) * 2002-10-15 2005-04-19 삼성전자주식회사 신너 조성물 및 이를 사용한 포토레지스트의 스트립핑 방법
KR101215429B1 (ko) 2003-10-20 2012-12-26 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
KR101142868B1 (ko) * 2004-05-25 2012-05-10 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1103964A (zh) * 1994-09-14 1995-06-21 山东大学 去胶剂组合物

Also Published As

Publication number Publication date
JP4698435B2 (ja) 2011-06-08
EP1847876A1 (en) 2007-10-24
JP2006251785A (ja) 2006-09-21
TWI346260B (enExample) 2011-08-01
TW200641560A (en) 2006-12-01
WO2006085681A9 (ja) 2006-09-28
KR20070088271A (ko) 2007-08-29
EP1847876A4 (en) 2011-10-26
CN101044435A (zh) 2007-09-26
WO2006085681A1 (ja) 2006-08-17
US20070196775A1 (en) 2007-08-23
US7510815B2 (en) 2009-03-31
KR100825865B1 (ko) 2008-04-28

Similar Documents

Publication Publication Date Title
CN1894629B (zh) 光敏组合物去除剂
CN101044435B (zh) 感光性组合物除去液
CN101116037B (zh) 光敏组合物清除液
JP4596894B2 (ja) 感光性組成物除去液
JP2015022307A (ja) 着色感光性樹脂組成物、これを含むカラーフィルタおよび表示装置
TWI341962B (en) Removing solution for photosensitive composition
JP4812453B2 (ja) 感光性組成物除去液
JP4698515B2 (ja) 感光性組成物除去液
JP2010070724A (ja) 硬化性組成物除去液
US20090208887A1 (en) Removing solution for photosensitive composition
JP2007219513A (ja) 感光性組成物除去液

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Showa electrical materials Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230512

Address after: Tokyo, Japan

Patentee after: Showa electrical materials Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: SHOWA DENKO Kabushiki Kaisha

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100908