KR100825865B1 - 감광성 조성물 제거액 - Google Patents

감광성 조성물 제거액 Download PDF

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Publication number
KR100825865B1
KR100825865B1 KR1020067018245A KR20067018245A KR100825865B1 KR 100825865 B1 KR100825865 B1 KR 100825865B1 KR 1020067018245 A KR1020067018245 A KR 1020067018245A KR 20067018245 A KR20067018245 A KR 20067018245A KR 100825865 B1 KR100825865 B1 KR 100825865B1
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KR
South Korea
Prior art keywords
photosensitive composition
mass
removal liquid
pigment
amides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067018245A
Other languages
English (en)
Korean (ko)
Other versions
KR20070088271A (ko
Inventor
마사토 카네다
Original Assignee
쇼와 덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쇼와 덴코 가부시키가이샤 filed Critical 쇼와 덴코 가부시키가이샤
Publication of KR20070088271A publication Critical patent/KR20070088271A/ko
Application granted granted Critical
Publication of KR100825865B1 publication Critical patent/KR100825865B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020067018245A 2005-02-09 2006-02-09 감광성 조성물 제거액 Expired - Fee Related KR100825865B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005032732 2005-02-09
JPJP-P-2005-00032732 2005-02-09

Publications (2)

Publication Number Publication Date
KR20070088271A KR20070088271A (ko) 2007-08-29
KR100825865B1 true KR100825865B1 (ko) 2008-04-28

Family

ID=36793236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067018245A Expired - Fee Related KR100825865B1 (ko) 2005-02-09 2006-02-09 감광성 조성물 제거액

Country Status (7)

Country Link
US (1) US7510815B2 (enExample)
EP (1) EP1847876A4 (enExample)
JP (1) JP4698435B2 (enExample)
KR (1) KR100825865B1 (enExample)
CN (1) CN101044435B (enExample)
TW (1) TW200641560A (enExample)
WO (1) WO2006085681A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
WO2008072193A2 (en) * 2006-12-15 2008-06-19 Liquid Colours (Pty) Ltd Security composition
CN102093918B (zh) * 2009-12-11 2014-07-09 济南开发区星火科学技术研究院 一种汽油辛烷值改进剂及制备方法
CN105143984B (zh) * 2013-03-07 2017-09-05 株式会社Lg化学 用于去除光阻剂的剥离剂组合物及使用其剥离光阻剂的方法
JP6100669B2 (ja) * 2013-10-11 2017-03-22 Ｊｘエネルギー株式会社 洗浄液組成物
KR102414295B1 (ko) * 2016-01-22 2022-06-30 주식회사 이엔에프테크놀로지 포토레지스트 제거용 박리액 조성물
KR102465602B1 (ko) * 2018-08-31 2022-11-11 주식회사 이엔에프테크놀로지 신너 조성물
CN116171404A (zh) * 2020-08-11 2023-05-26 株式会社力森诺科 溶剂组合物
CN118382688A (zh) * 2021-11-23 2024-07-23 才将科技股份有限公司 一种清洗粘结层的组合物及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000035698A (ko) * 1998-11-27 2000-06-26 히가시 데쓰로 기판처리장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3248781B2 (ja) * 1993-06-28 2002-01-21 東京応化工業株式会社 レジスト洗浄除去用溶剤及びそれを使用する電子部品製造用基材の製造方法
JPH07160008A (ja) 1993-12-06 1995-06-23 Tokyo Ohka Kogyo Co Ltd レジスト形成用塗布物あるいはレジストの洗浄除去用溶剤及びそれを使用する電子部品製造用基材の製造方法
CN1033464C (zh) * 1994-09-14 1996-12-04 山东大学 去胶剂组合物
KR100234532B1 (ko) * 1996-09-21 1999-12-15 윤종용 반도체 제조공정의 포토레지스트 세정용 시너 조성물 및 그를 이용한 반도체장치의 제조방법
JP3978255B2 (ja) * 1997-06-24 2007-09-19 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用洗浄剤
FR2773813B1 (fr) 1998-01-21 2001-09-07 Rhodia Chimie Sa Composition pour decaper les peintures a base d'une cetone cyclique
JP2000204302A (ja) 1998-11-13 2000-07-25 Masao Umemoto 塗料剥離剤
JP2001194806A (ja) * 1999-10-25 2001-07-19 Toray Ind Inc レジスト剥離方法
JP4564683B2 (ja) 2001-05-21 2010-10-20 大日本印刷株式会社 樹脂膜除去装置およびその方法
JP2003167114A (ja) 2001-11-30 2003-06-13 Toshiba Corp 平面表示装置の製造方法
KR100483846B1 (ko) * 2002-10-15 2005-04-19 삼성전자주식회사 신너 조성물 및 이를 사용한 포토레지스트의 스트립핑 방법
KR101215429B1 (ko) 2003-10-20 2012-12-26 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물
TWI276929B (en) * 2003-12-16 2007-03-21 Showa Denko Kk Photosensitive composition remover
KR101142868B1 (ko) * 2004-05-25 2012-05-10 주식회사 동진쎄미켐 포토레지스트 제거용 씬너 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000035698A (ko) * 1998-11-27 2000-06-26 히가시 데쓰로 기판처리장치

Also Published As

Publication number Publication date
JP4698435B2 (ja) 2011-06-08
EP1847876A1 (en) 2007-10-24
JP2006251785A (ja) 2006-09-21
TWI346260B (enExample) 2011-08-01
TW200641560A (en) 2006-12-01
WO2006085681A9 (ja) 2006-09-28
KR20070088271A (ko) 2007-08-29
EP1847876A4 (en) 2011-10-26
CN101044435B (zh) 2010-09-08
CN101044435A (zh) 2007-09-26
WO2006085681A1 (ja) 2006-08-17
US20070196775A1 (en) 2007-08-23
US7510815B2 (en) 2009-03-31

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