JP4695140B2 - 多層構成の被加工品のレーザ穿孔方法 - Google Patents

多層構成の被加工品のレーザ穿孔方法 Download PDF

Info

Publication number
JP4695140B2
JP4695140B2 JP2007526445A JP2007526445A JP4695140B2 JP 4695140 B2 JP4695140 B2 JP 4695140B2 JP 2007526445 A JP2007526445 A JP 2007526445A JP 2007526445 A JP2007526445 A JP 2007526445A JP 4695140 B2 JP4695140 B2 JP 4695140B2
Authority
JP
Japan
Prior art keywords
laser
layer
hole
laser beam
laser output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007526445A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008510311A5 (https=
JP2008510311A (ja
Inventor
プリル トーマス
メトカ ウーヴェ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of JP2008510311A publication Critical patent/JP2008510311A/ja
Publication of JP2008510311A5 publication Critical patent/JP2008510311A5/ja
Application granted granted Critical
Publication of JP4695140B2 publication Critical patent/JP4695140B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
JP2007526445A 2004-08-18 2005-07-29 多層構成の被加工品のレーザ穿孔方法 Expired - Lifetime JP4695140B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004040068.7 2004-08-18
DE102004040068.7A DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
PCT/EP2005/053716 WO2006018372A1 (de) 2004-08-18 2005-07-29 Verfahren zum laserbohren eines mehrschichtig aufgebauten werkstücks

Publications (3)

Publication Number Publication Date
JP2008510311A JP2008510311A (ja) 2008-04-03
JP2008510311A5 JP2008510311A5 (https=) 2010-12-24
JP4695140B2 true JP4695140B2 (ja) 2011-06-08

Family

ID=35219456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007526445A Expired - Lifetime JP4695140B2 (ja) 2004-08-18 2005-07-29 多層構成の被加工品のレーザ穿孔方法

Country Status (5)

Country Link
JP (1) JP4695140B2 (https=)
KR (1) KR101289755B1 (https=)
CN (1) CN1997482B (https=)
DE (1) DE102004040068B4 (https=)
WO (1) WO2006018372A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008027130A1 (de) * 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl
CN101610643B (zh) * 2009-07-14 2010-12-01 华中科技大学 一种激光加工盲孔的方法
KR20120086688A (ko) * 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 전극판의 통기공 형성 방법
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102010034143A1 (de) * 2010-08-12 2012-02-16 Thomas Hofmann Träger für elektronische und elektrische Bauelemente
WO2013002503A2 (ko) * 2011-06-29 2013-01-03 (주)큐엠씨 발광 다이오드의 제조 방법 및 장치
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
CN103974543B (zh) * 2014-03-18 2016-08-17 西安交通大学 一种基于激光加工的多层柔性电路板微小孔加工工艺
KR102216675B1 (ko) 2014-06-12 2021-02-18 삼성디스플레이 주식회사 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
CN106695136B (zh) * 2017-01-12 2017-09-29 广东工业大学 一种多层印刷电路板的激光打孔方法及使用其的系统
DE102017108437B4 (de) * 2017-04-20 2020-07-09 Gottfried Wilhelm Leibniz Universität Hannover Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
WO2018226687A1 (en) * 2017-06-07 2018-12-13 Kci Licensing, Inc. Methods for manufacturing and assembling dual material tissue interface for negative-pressure therapy
JP2019107789A (ja) * 2017-12-15 2019-07-04 株式会社小糸製作所 樹脂成形品および車両用部品
CN112692454A (zh) * 2020-12-17 2021-04-23 华清创智光电科技(清远)有限公司 一种双头激光光路系统及其加工pcb板盲孔的方法
CN115348730A (zh) * 2021-05-12 2022-11-15 无锡深南电路有限公司 一种线路板钻孔方法、制备方法以及线路板
CN117300394B (zh) * 2023-11-28 2024-02-23 武汉铱科赛科技有限公司 一种激光盲孔钻孔方法、设备、装置及系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
FI982568A7 (fi) * 1997-12-02 1999-06-03 Samsung Electro Mech Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi
WO2000056129A1 (de) * 1999-03-16 2000-09-21 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
KR100670841B1 (ko) * 1999-12-07 2007-01-18 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 스위칭가능 파장 레이저 기반의 에칭 회로 기판 처리 시스템
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP4373596B2 (ja) * 2000-10-06 2009-11-25 日立ビアメカニクス株式会社 プリント基板の加工方法
JP4734723B2 (ja) * 2001-01-31 2011-07-27 凸版印刷株式会社 同軸ビアホールを用いた多層配線基板の製造方法
DE10125397B4 (de) * 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
DE10201476B4 (de) * 2002-01-16 2005-02-24 Siemens Ag Laserbearbeitungsvorrichtung
JP2003320470A (ja) * 2002-05-02 2003-11-11 Quantum Design Japan Inc 赤外線レーザアシストによる紫外線レーザ加工方法および加工装置
DE10251480B4 (de) * 2002-11-05 2008-01-24 Hitachi Via Mechanics, Ltd., Ebina Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
JP3720034B2 (ja) * 2003-05-26 2005-11-24 住友重機械工業株式会社 穴あけ加工方法
TW200518869A (en) * 2003-10-06 2005-06-16 Shinko Electric Ind Co Method for forming via-hole in resin layer

Also Published As

Publication number Publication date
KR101289755B1 (ko) 2013-07-26
CN1997482B (zh) 2011-01-05
DE102004040068B4 (de) 2018-01-04
HK1101278A1 (en) 2007-10-12
CN1997482A (zh) 2007-07-11
WO2006018372A1 (de) 2006-02-23
DE102004040068A1 (de) 2006-04-13
JP2008510311A (ja) 2008-04-03
KR20070043708A (ko) 2007-04-25

Similar Documents

Publication Publication Date Title
JP4695140B2 (ja) 多層構成の被加工品のレーザ穿孔方法
CN1155450C (zh) 采用可变功率密度的紫外激光脉冲在多层靶上形成盲通道的方法
KR100258287B1 (ko) 다층 타겟에 경유로를 형성하는 방법과 자외선 레이저 시스템(Ultraviolet laser system and method for forming vias in multi-layered targets)
KR101866579B1 (ko) 레이저 펄스의 시리즈를 이용하는 드릴링 방법 및 장치
TWI386270B (zh) 提供有關於被微加工於工件中的特徵形狀的資訊之方法
US20040112881A1 (en) Circle laser trepanning
JP2007508946A (ja) 局所的に加熱されたターゲット材料のレーザ加工
JP2004526577A (ja) レーザー放射線によってマイクロ孔を穿孔する方法
JP2021528864A (ja) 超高速レーザを使用した回路板材料のパターン形成および除去
JP2005518945A (ja) レーザ加工方法
JP2010214452A (ja) レーザ加工方法、レーザ加工装置及び多層プリント配線板
JP2003048088A (ja) レーザ加工方法及びレーザ加工機
JP2006513862A (ja) レーザを用いて電気的な回路基板を加工するための装置および方法
JP2009512553A (ja) デュアルヘッドレーザ微細加工システム用の合成パルス繰り返しレートの加工
JP2004351513A (ja) 超短パルスレーザーによる材料加工方法、プリント配線板、及びその製造方法
CN1267237C (zh) 圆形激光钻孔方法
JPH11245071A (ja) レーザ加工装置
JP2000202664A (ja) レ―ザ穴あけ加工方法
JP3869736B2 (ja) レーザ加工方法及び多層配線基板
HK1101278B (en) Method for laser drilling a multilayer workpiece
JP2004031500A (ja) 多層プリント配線基板の穴あけ加工方法
JP4163320B2 (ja) レーザ穴あけ加工装置用のデスミア方法及びデスミア装置
JP2005007440A (ja) レーザ加工方法及びレーザ加工装置
JP2000271777A (ja) レーザ穴あけ加工装置用のデスミア方法及びデスミア装置
CA2246329A1 (en) Method employing uv laser pulses of varied energy density to form blind vias in multilayered targets

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100910

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20101108

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101227

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101228

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110218

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110224

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140304

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4695140

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313532

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

EXPY Cancellation because of completion of term