JP2008510311A5 - - Google Patents

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Publication number
JP2008510311A5
JP2008510311A5 JP2007526445A JP2007526445A JP2008510311A5 JP 2008510311 A5 JP2008510311 A5 JP 2008510311A5 JP 2007526445 A JP2007526445 A JP 2007526445A JP 2007526445 A JP2007526445 A JP 2007526445A JP 2008510311 A5 JP2008510311 A5 JP 2008510311A5
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JP
Japan
Prior art keywords
layer
laser
hole
section
cross
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Application number
JP2007526445A
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English (en)
Japanese (ja)
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JP4695140B2 (ja
JP2008510311A (ja
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Priority claimed from DE102004040068.7A external-priority patent/DE102004040068B4/de
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Publication of JP2008510311A publication Critical patent/JP2008510311A/ja
Publication of JP2008510311A5 publication Critical patent/JP2008510311A5/ja
Application granted granted Critical
Publication of JP4695140B2 publication Critical patent/JP4695140B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2007526445A 2004-08-18 2005-07-29 多層構成の被加工品のレーザ穿孔方法 Expired - Lifetime JP4695140B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004040068.7 2004-08-18
DE102004040068.7A DE102004040068B4 (de) 2004-08-18 2004-08-18 Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
PCT/EP2005/053716 WO2006018372A1 (de) 2004-08-18 2005-07-29 Verfahren zum laserbohren eines mehrschichtig aufgebauten werkstücks

Publications (3)

Publication Number Publication Date
JP2008510311A JP2008510311A (ja) 2008-04-03
JP2008510311A5 true JP2008510311A5 (https=) 2010-12-24
JP4695140B2 JP4695140B2 (ja) 2011-06-08

Family

ID=35219456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007526445A Expired - Lifetime JP4695140B2 (ja) 2004-08-18 2005-07-29 多層構成の被加工品のレーザ穿孔方法

Country Status (5)

Country Link
JP (1) JP4695140B2 (https=)
KR (1) KR101289755B1 (https=)
CN (1) CN1997482B (https=)
DE (1) DE102004040068B4 (https=)
WO (1) WO2006018372A1 (https=)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
DE102008027130A1 (de) * 2008-05-29 2009-12-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur trennenden Bearbeitung von Werkstücken mit einem Laserstrahl
CN101610643B (zh) * 2009-07-14 2010-12-01 华中科技大学 一种激光加工盲孔的方法
KR20120086688A (ko) * 2009-10-13 2012-08-03 미쓰비시 마테리알 가부시키가이샤 전극판의 통기공 형성 방법
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102010034143A1 (de) * 2010-08-12 2012-02-16 Thomas Hofmann Träger für elektronische und elektrische Bauelemente
WO2013002503A2 (ko) * 2011-06-29 2013-01-03 (주)큐엠씨 발광 다이오드의 제조 방법 및 장치
JP2013146780A (ja) * 2012-01-23 2013-08-01 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のレーザ加工方法
CN103974543B (zh) * 2014-03-18 2016-08-17 西安交通大学 一种基于激光加工的多层柔性电路板微小孔加工工艺
KR102216675B1 (ko) 2014-06-12 2021-02-18 삼성디스플레이 주식회사 디스플레이 패널의 리페어 장치 및 디스플레이 패널의 리페어 방법
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
US9852997B2 (en) * 2016-03-25 2017-12-26 Applied Materials, Inc. Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
CN106695136B (zh) * 2017-01-12 2017-09-29 广东工业大学 一种多层印刷电路板的激光打孔方法及使用其的系统
DE102017108437B4 (de) * 2017-04-20 2020-07-09 Gottfried Wilhelm Leibniz Universität Hannover Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
WO2018226687A1 (en) * 2017-06-07 2018-12-13 Kci Licensing, Inc. Methods for manufacturing and assembling dual material tissue interface for negative-pressure therapy
JP2019107789A (ja) * 2017-12-15 2019-07-04 株式会社小糸製作所 樹脂成形品および車両用部品
CN112692454A (zh) * 2020-12-17 2021-04-23 华清创智光电科技(清远)有限公司 一种双头激光光路系统及其加工pcb板盲孔的方法
CN115348730A (zh) * 2021-05-12 2022-11-15 无锡深南电路有限公司 一种线路板钻孔方法、制备方法以及线路板
CN117300394B (zh) * 2023-11-28 2024-02-23 武汉铱科赛科技有限公司 一种激光盲孔钻孔方法、设备、装置及系统

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US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US5593606A (en) * 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
FI982568A7 (fi) * 1997-12-02 1999-06-03 Samsung Electro Mech Menetelmä monikerroksisen painetun piirilevyn valmistamiseksi
WO2000056129A1 (de) * 1999-03-16 2000-09-21 Siemens Aktiengesellschaft Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
KR100670841B1 (ko) * 1999-12-07 2007-01-18 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 스위칭가능 파장 레이저 기반의 에칭 회로 기판 처리 시스템
WO2001074529A2 (en) * 2000-03-30 2001-10-11 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP4373596B2 (ja) * 2000-10-06 2009-11-25 日立ビアメカニクス株式会社 プリント基板の加工方法
JP4734723B2 (ja) * 2001-01-31 2011-07-27 凸版印刷株式会社 同軸ビアホールを用いた多層配線基板の製造方法
DE10125397B4 (de) * 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
DE10201476B4 (de) * 2002-01-16 2005-02-24 Siemens Ag Laserbearbeitungsvorrichtung
JP2003320470A (ja) * 2002-05-02 2003-11-11 Quantum Design Japan Inc 赤外線レーザアシストによる紫外線レーザ加工方法および加工装置
DE10251480B4 (de) * 2002-11-05 2008-01-24 Hitachi Via Mechanics, Ltd., Ebina Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem elektrischen Schaltungssubstrat
JP3720034B2 (ja) * 2003-05-26 2005-11-24 住友重機械工業株式会社 穴あけ加工方法
TW200518869A (en) * 2003-10-06 2005-06-16 Shinko Electric Ind Co Method for forming via-hole in resin layer

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